The application discloses a kind of
copper sulfate electroplating solution preparation device and method for
chip packaging, it is related to
chip packaging technical field, and its technical solution points are as follows: including
copper sulfate pentahydrate
storage tank, negative pressure feeder, feed volume bin, electronic scale,
copper sulfate solution preparation tank, preparation pump one,
micropore filter one, resin
barrel,
electroplating solution preparation tank, spiral spray head, preparation pump two,
heat exchanger,
micropore filter two;
Copper sulfate pentahydrate
storage tank is connected by negative pressure feeder, feed volume bin, electronic scale and
copper sulfate solution preparation tank;
Copper sulfate solution preparation tank is communicated with
electroplating solution preparation tank by
micropore filter one and resin
barrel, and
copper sulfate solution is added into electroplating solution preparation tank by preparation pump one after preparation in
copper sulfate solution preparation tank;
Electroplating solution preparation tank and preparation pump two,
heat exchanger form circulating
system, and micropore filter two is used to fill electroplating solution.The whole preparation device of the application adopts automatic instrument and
logic control, and full-process can realize automatic and intelligent operation.