Method for testing mechanical property and reliability of thin film material of micro-electromechanical system (MEMS) and device thereof

Abstract

The invention discloses a method for testing mechanical property and reliability of a thin film material of a micro-electromechanical system (MEMS) and a testing device thereof. A thin film testing structure with a suspended membrane is fixed on a sample platform with a gas passage and a differential pressure is imposed on one side of the suspended membrane to cause the other side of the suspended membrane to be deformed and heave; the deflection at the center of the membrane under the impressed pressure is measured, namely the maximum deflection of the membrane and the pressure is gradually increased to cause the suspended membrane to fracture; such parameters related to the mechanical property and reliability of the tested thin film material as plane strain modulus, Young modulus, Poisson ratio, residual stress, rupture strength and the like are extracted and obtained with the measurement of a pressure-deflection change curve and in accordance with a theory calculating model. The invention adopts a non-contact optical method, utilizes a data acquisition and control unit to automatically implement the measurement of the deflection and is characterized by simple sample preparation and testing, high measurement accuracy, convenient and flexible operation and high testing efficiency.

Description

technical field [0001] The invention relates to a micro-electro-mechanical system, in particular to a testing method and device for measuring the mechanical properties and reliability parameters of a micro-electro-mechanical system thin film material. Background technique [0002] Micro Electromechanical System (MEMS) refers to a micro electromechanical system that integrates micro sensors, actuators, signal processing and control circuits, interface circuits and power supplies. MEMS has the advantages of miniaturization, intelligence, multi-function, high integration and suitable for mass production, so it has broad application prospects in the fields of automobile, communication, biomedicine, consumer products, aerospace and national defense. With the continuous development and maturity of MEMS design methods and processing techniques, more and more MEMS devices have been successfully prepared, such as pressure sensors and resonators. [0003] The performance of MEMS devi...

AI Technical Summary

Problems solved by technology

[0005] However, the sample preparation process of these test methods is mostly complicated, and requires patterning processes such as etching on the film to be tested, and the damage and influence of the processing technology on the film to be tested cannot be eliminated.

At the same time, most of these test methods use hard contact to load the sample, which is easy to damage the sample; moreover, the clamping and alignment of the sample is very difficult, and the measurement is more complicated

Images