6results about How to "Improve packaging yield" patented technology

The utility model relates to the technical field of MEMS device packaging, and particularly discloses a strip-shaped clamp for an MEMS device, and the MEMS device comprises an MEMS sensor and a special integrated circuit needing to be subjected to an injection molding process; the strip-shaped clamp comprises a frame part and a central part; the central part comprises a plurality of parallel long strip parts which are arranged at intervals; the two ends of each long strip part in the plurality of long strip parts are respectively connected with the frame part so as to form a plurality of strip-shaped openings; the corners of the strip-shaped opening are arranged to be fillets; and under the condition that the MEMS device is arranged below the strip-shaped clamp, the strip-shaped opening is used for exposing an application-specific integrated circuit of the MEMS device so as to carry out an injection molding process, and the strip-shaped part is used for covering an MEMS sensor of the MEMS device. According to the strip-shaped clamp, the cleaning difficulty can be reduced, the manufacturing cost can be reduced, the influence of sputtered resin points in the injection molding process on the performance of the MEMS device can be effectively prevented, and the packaging yield of the MEMS device is effectively improved.

This invention provides a glass substrate optoelectronic co-packaging structure and its fabrication method, addressing the technical problems of existing glass substrate-based optoelectronic co-packaging structures, such as easy mounting errors during assembly, poor structural stability, and easy displacement relative to the glass substrate during operation, resulting in transmission loss. The glass substrate optoelectronic co-packaging structure of this invention innovatively embeds optoelectronic integrated chips and integrated circuit chips within the glass substrate, and also incorporates a microbridge structure and a pluggable fiber array within the glass substrate. This not only reduces the overall volume of the packaging structure but also effectively improves the structural stability of each component, reducing failures caused by poor packaging or component detachment, and increasing packaging yield. More importantly, this design effectively ensures alignment accuracy, enabling precise docking between the optoelectronic integrated chip and the external optical signal array, achieving efficient and low-loss transmission of optical signals.

The present application relates to the technical field of electronic packaging, and especially relates to a power electronic packaging module and a packaging method, wherein a pyrolyzable polymer film is used as a temporary carrier, and a microgroove array is constructed on the surface; nano metal solder paste is filled in the microgroove array to form a patterned metal layer; a power chip and a substrate are respectively arranged on two sides of the patterned metal layer, and are attached and temporarily fixed; the whole structure after attachment is arranged in a sintering cavity, and under the condition of 200-260 DEG C and no external pressure, the atmosphere composition and the temperature are controlled in stages, so that the polymer film is pyrolyzed and removed, the nano metal solder paste is sintered to form a metal network structure, and metallurgical interconnection between the power chip surface and the substrate is completed. Compared with a traditional interconnection scheme, the present application has design flexibility, process compatibility and long-term reliability, and provides an interconnection solution with stable structure, controllable process and suitability for mass production for a new generation of high-power module packaging.

The embodiment of the invention discloses a semiconductor packaging structure, a manufacturing method and a memory system, the semiconductor packaging structure comprises a first semiconductor chip and a second semiconductor chip which are stacked along a first direction and are coupled, the first semiconductor chip comprises a first tube core and a second tube core which are bonded along the first direction, the first tube core is coupled with the second tube core through a first bonding contact; the first connecting structure penetrates through the first tube core along the first direction; the second connecting structure penetrates through the second tube core along the first direction; wherein in the first direction, the first bonding contact is located between the first connecting structure and the second connecting structure, and the first connecting structure and the second connecting structure are coupled through the first bonding contact.

The invention belongs to the technical field of LED packaging equipment, and particularly relates to an LED side light support discharging and stacking device with a self-adaptive buffering function, the LED side light support discharging and stacking device comprises a base, a supporting seat is arranged at the top of the base, and a sliding rail is arranged on one side of the supporting seat. Specifically, the linkage assembly converts reciprocating motion of the first suction cup machine into one-way intermittent rotation of an intermittent fluted disc, and a bearing plate and the material receiving box are driven to descend step by step through a lead screw, a sliding block and a slope transmission pair. The descending distance each time is accurately equal to the sum of the thickness of the side light support plate and the combined thickness of the buffer plate and the convex part, due to the incomplete gear design of the fluted disc and the one-way conversion characteristic of the reciprocating hole, it is guaranteed that idling is conducted only in the discharging stroke driving descending process and the return stroke process, invalid movement is effectively filtered, and therefore each support is released at the fixed height; therefore, zero-impact stacking is realized, and the material receiving surface is kept flush with the receiving surface in the material receiving box.

This invention discloses a low-temperature SMT packaging method for optical components and an optoelectronic module. The low-temperature SMT packaging method includes: printing solder paste onto the pads of a PCBA board to obtain a first PCBA board; mounting the optical component onto the pads of the first PCBA board to obtain a second PCBA board; performing reflow soldering on the second PCBA board to obtain a third PCBA board, wherein the temperature change rate of the optical component during the reflow soldering process is less than 2°C / min; applying adhesive to the third PCBA board, with the application location located at the end of the optical component away from the fiber optic connector, to obtain a fourth PCBA board; and curing the adhesive to obtain a fifth PCBA board. This invention avoids deformation of the optical component and improves the packaging yield of the optical component.