Flip-chip light emitting diodes and method of manufacturing thereof
A flip-chip, light-emitting device technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as low luminous efficiency and low adhesion, and achieve increased packaging yield, low contact resistivity, and excellent current-voltage. Effects of Features
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[0052] Hereinafter, referring to the accompanying drawings, a flip-chip nitride-based light-emitting device according to a preferred embodiment of the present invention will be described in more detail.
[0053] figure 1 A cross-sectional view of the flip-chip nitride-based light-emitting device according to the first embodiment of the present invention is shown.
[0054] Now refer to figure 1 The flip-chip nitride-based light-emitting device is formed by the following structure, the structure includes a substrate 110, a buffer layer 120, an n-type cladding layer 130, an active layer 140, and a p-type cladding layer sequentially stacked thereon. The layer 150, the transparent conductive film layer 170, and the reflective layer 180. Reference numerals 190 and 200 represent p-type electrode pads and n-type electrode pads, respectively.
[0055] The portion from the substrate 110 to the p-type cladding layer 150 corresponds to a light emitting structure, and the transparent conduc...
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