Packaging method

A method of encapsulation and a technology of encapsulation wires, which are applied in glass molding, glass manufacturing equipment, electrical components, etc., and can solve the problems that glass wires cannot obtain yield, etc.

Active Publication Date: 2012-09-26
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The technical problem solved by the present invention is that the g

Method used

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Embodiment 1

[0049] refer to EAGLE XG TM Display Grade Glass Substrates Product Information, you can know that the thickness change (Thickness Range, 150mm Moving Window) index of this type of glass is less than 20um, the average thickness change to 1mm is about 0.13um, the width of the packaging line is generally 1mm, and the length is currently usually Less than 20mm (diagonal line of small and medium-sized OLED screens <7″, the division ratio is generally 0.618, and the long side direction is about 11mm). The surface thickness variation of the glass substrate is much smaller than the thickness variation of the currently used packaging glass frit sintered body, so the influence of the thickness variation of the glass substrate on the laser welding gap effect is much smaller than the thickness variation of the glass frit sintered body. If Using the formula in US20090069164, the maximum thickness change is also between 3um~7um; if the formula in US20090069164 is not used, the maximum th...

Embodiment 2

[0076] This embodiment introduces a kind of fine powder 404, preferably the diameter is less than 2um, and its main component can be SiO 2 Or metal oxide or other materials with high absorption of laser radiation and electrical insulation; the powder can also be SiO 2 Or a mixture of two or more metal oxides or other materials with high absorption of laser radiation and electrical insulation; the powder can also be SiO 2 Or a mixture of two or more metal oxides or other materials with high absorption of laser radiation and electrical insulation and fine metal powder; in particular, when directly mixed with ordinary glass powder and made into a paste, the powder is actually It can be only fine metal powder; the powder can be particles with different particle sizes or particles with relatively uniform particle size, preferably particles with uniform particle size.

[0077] For use with SiO 2 Or other fine filling powder 404 of glass crystal composition particles, due to SiO 2...

Embodiment 3

[0096] This embodiment introduces a fine powder 404, preferably with a diameter less than 2um, and its main component can be SiO 2 Or metal oxide or other materials with high absorption of laser radiation and electrical insulation; the powder can also be SiO 2 Or a mixture of two or more metal oxides or other materials with high absorption of laser radiation and electrical insulation; the powder can also be SiO 2 Or a mixture of two or more metal oxides or other materials with high absorption of laser radiation and electrical insulation and fine metal powder; in particular, when directly mixed with ordinary glass powder and made into a paste, the powder is actually It can be only fine metal powder; the powder can be particles with different particle sizes or particles with relatively uniform particle size, preferably particles with uniform particle size.

[0097] For use with SiO 2 Or other fine powder 404 of glass crystal composition particles, due to SiO 2 Or the CTE (Coe...

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Abstract

A packaging method comprises the following steps of: preparing a finely pulverized powder, preparing a finely pulverized powder paste by the use of the finely pulverized powder, coating a packaging wire of cover lens by with the finely pulverized powder paste and glass paste, presintering the coated cover lens in vacuum, folding the cover lens which is presented in vacuum with a glass substrate, and carrying out laser scanning and packaging on the folded combination of the cover lens and the glass substrate. By the adoption of the packaging method, height inhomogeneities of the presentered packaging wire can be controlled within an ideal range and requirements on laser power when packaging is obviously reduced.

Description

technical field [0001] The invention relates to a packaging method, in particular to a packaging method of a display device. Background technique [0002] Flat Panel Display (FPD) has developed rapidly since the 1990s, and gradually matures, and is widely used in household appliances, computers and communication products. There are two types of flat panel displays: active light emitting and passive light emitting. The former refers to display devices that display the medium itself to emit light and provide visible radiation, including plasma display (PDP), vacuum fluorescent display (VFD), field emission display (FED), electroluminescent display (LED) and organic light-emitting diode display (OLED) Wait. The latter means that it does not emit light itself, but uses the optical characteristics of the display medium to change after being modulated by an electrical signal, and modulates the light emitted by the ambient light and an external power supply (backlight source, pro...

Claims

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Application Information

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IPC IPC(8): C03B23/203H01L51/56H01L51/52
CPCY02P40/57
Inventor 韦学志陈勇辉
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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