17 results about "Gold ball" patented technology

The invention relates to the technical field of sensors, in particular to a pressure sensor. According to the invention, the bottom of a pressure interface seat is provided with a pressure guiding hole in threaded connection with a measured part; the sputtering film pressure sensitive core body is fixed at the upper end of the pressure interface seat; the glass sintering shell and the terminal are connected with the sputtering film pressure sensitive core body in a gold wire ball welding manner; the blanking cap is used for sealing the glass sintering shell and the top end opening of the terminal, so that the sputtering film pressure sensitive core body is in a vacuum environment; the signal conditioning circuit unit realizes electric signal transmission and processing of the sputtering film pressure sensitive core body through a terminal and a wire; the electric connector is used for external power supply and signal output; the sputtering film pressure sensitive core body is used for generating an electric signal, and after the electric signal is calibrated, compensated and processed by the signal conditioning circuit unit, the electric connector outputs a volt-level voltage signal in a linear relation with the measured pressure. The device has the advantages of being large in measuring range, high in precision, resistant to vibration impact and capable of measuring absolute pressure.

The utility model relates to the technical field of conductive gold ball production, and discloses full-automatic production equipment for high-precision electromagnetic shielding conductive gold balls, which solves the problem that a plurality of conductive gold balls cannot be fixed at the same time when an annealing furnace for conductive gold ball production is used, and comprises a furnace body, and a door plate is mounted on the outer side of the furnace body; a control switch is fixedly installed in the middle of the side, away from the furnace body, of the door plate, electric heating plates are fixedly installed on the side, away from the door plate, in the furnace body and the two sides in the furnace body, an adjusting and positioning assembly is installed in the furnace body, and the top end of the adjusting and positioning assembly extends to the top of the furnace body; the strip-shaped frame is fixedly mounted in the middle of the interior of the furnace body, two strip-shaped seats are fixedly mounted on each of the two sides of the strip-shaped frame, and placement grooves are formed in the tops of the strip-shaped seats; according to the annealing furnace disclosed by the utility model, a plurality of conductive gold balls can be fixed at the same time in the using process of the annealing furnace for producing the conductive gold balls.

The application discloses a kind of intelligent card non-contact module packaging device and packaging process, it is related to electronic packaging process technical field.The intelligent card non-contact module packaging device and packaging process, including holster, each holster is away from the end of wire gun head Half concave cavity with semicircular table shape, the upper end of the half concave cavity is the small diameter end of closure, the lower end is the large diameter end of opening, the small diameter end of closure forms cutter, two groups of holster are closed when cutter is used to cut off gold wire, and two half concave cavities form completed forming cavity, so that gold liquid forms gold ball in forming cavity.By the drive of driving assembly, driving holster can be radially opened and closed, on the one hand, gold wire is cut off flush, to avoid generating excess flow welding, on the other hand, while cutting off, molten gold liquid is polymerized to form gold ball, to avoid producing sharp protrusions, to provide smooth connection surface for subsequent gold wire and gold ball re-welding, to improve stability, accuracy in chip bonding welding process.

1. The name of the design product: tray (handle gold ball foot solid wood tray). 2. The use of the design product: for tray. 3. The design points of the design product: in the combination of shape and pattern. 4. The picture or photo that best indicates the design points: perspective drawing.

The application provides a leadless packaging pressure sensor and a preparation method thereof. The leadless packaging pressure sensor comprises a sintering tube shell and a carrier chip inverted on a substrate of the sintering tube shell. The sintering tube shell comprises a plurality of lead pillars extending through the substrate and along the shell wall of the sintering tube shell, one end of the lead pillar extending out of the substrate. The carrier chip is provided with a connecting hole corresponding to the lead pillar. The bottom of the connecting hole is provided with a gold ball implanted by a cleaver. The connecting hole is filled with conductive paste. When the carrier chip is inverted and bonded to the substrate, the connecting hole is buckled outside the corresponding lead pillar. The lead pillar is inserted into the conductive paste, and the gold ball is opposite to the end of the lead pillar. The packaging method of implanting the gold ball and connecting the gold ball and the lead pillar by the conductive paste can effectively solve the influence of high-temperature sintering on the performance of the carrier chip and improve the service life of the sensor.

The invention discloses a bonding method for enhancing gold wire bonding quality reliability, and belongs to the technical field of semiconductor thick film hybrid integrated circuit packaging. The bonding method comprises the following steps: (1) firstly, pre-planting gold balls on the thick film gold conduction band, and increasing the contact area and the bonding strength of a bonding point and the gold conduction band; and (2) carrying out safety ball bonding on the crescent, and tightly clamping the crescent between the two golden balls to form hamburger wrapping ball bonding. The problems that in an existing bonding technology, crescent bonding pseudo soldering exists, and the root of a bonding wire is prone to breakage are solved. The method is widely applied to the packaging technology of gold conduction band electronic components, in particular to the packaging technology of a semiconductor hybrid integrated circuit adopting a gold wire bonding structure.

The invention discloses an anisotropic conductive adhesive based on polymer gold balls and high-melting-point liquid metal and a preparation method of the anisotropic conductive adhesive, and belongs to the technical field of electronic tag encapsulating materials, the anisotropic conductive adhesive comprises the following raw materials in parts by mass: 4-7 parts of gold-plated polymer particles, 2-12 parts of liquid metal solder balls and 92-98 parts of a curable basic adhesive solution. The curable basic glue solution is an epoxy system basic glue solution or an acrylic acid system basic glue solution. According to the anisotropic conductive adhesive, the gold balls and the liquid metal solder balls with high melting points are matched in the anisotropic conductive adhesive, so that the contact area between the conductive metal and the base material and the contact area between the conductive metal and the chip are increased, the stability and reliability of the anisotropic conductive adhesive are improved, and the anisotropic conductive adhesive can be widely applied to the field of electronic tags.

The present disclosure provides a smart golf ball including: a protection cover (100) that includes a first protection cover (102) having a coupling flange (120), a second protection cover (104) having a coupling frame (124) inserted inside the coupling flange (120), and mounts (130) configured at the first and second protection covers (102, 104) to correspond to each other; a control unit (400) that is mounted on the mounts (130) and creates movement information of the golf ball when the golf ball is hit; a shock-absorbing member (200) configured to cover an outer surface of the protection cover (100); and an outer shell (300) configured to cover the shock-absorbing member (200), and a system for providing ball flight that transmits putting ball flight information of the smart gold ball to a user terminal.

The invention discloses a pad structure of a flexible stimulating electrode easy for batch production and a preparation method thereof, the pad structure comprises a first insulating layer, a first metal material layer, a second insulating layer, a second metal material layer, a third insulating layer and a central through hole, the first metal material layer is formed on the first insulating layer; the second insulating layer is formed on the first metal material layer and the first insulating layer and exposes part of the first metal material layer; the second metal material layer is formed on the first metal material layer and the second insulating layer; the first metal material layer is directly connected with the second metal material layer; the third insulating layer is formed on the second metal material layer and the second insulating layer. According to the invention, the bonding pad structure which is easy to produce in batches and can realize the connection between the electrode and the external circuit by using a simple gold wire ball bonding or conductive adhesive coating process can be provided.

The invention provides a method for improving the bonding strength of gold wire ball bonding, and the method comprises the step of adding a pretreatment step for removing a gold ball and an oxide layer on the surface of a to-be-bonded region and redundant materials before formal welding. A pretreatment step is added before formal welding. According to the method, the oxide layer and the redundancy on the bonding surface are effectively removed, so that the gold wire and the metal surface can be better combined during formal bonding, the bonding strength is improved, and the packaging reliability of an electronic device is improved. The problem that the gold wire ball bonding strength is insufficient due to the fact that the bonding surface is contaminated or an oxide layer is thick is solved.

1. Name of the product in this design: Chandelier Accessory (GJ506 Phantom Gold Ball B). 2. Purpose of this design: Indoor lighting fixture accessories. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The utility model discloses a PAD structure for a SOLARCELLFPC binding end. The PAD structure comprises a display screen and an FPC, a binding position is arranged at the bottom of the front surface of the display screen, and the FPC is arranged on the binding position; a plurality of positive PADs and negative PADs are arranged on the left side and the right side of the top of the FPC respectively, and the positive PADs and the negative PADs are bound with the binding positions through hot pressing. According to the PAD structure aiming at the binding end of the SOLARCELLFPC, one PAD position in the original design is changed into three PAD positions or more, so that the width of the binding position PAD is greatly reduced compared with the original design, the stress is more uniform during hot-pressing binding, and the conductive gold ball is easier to crush, thereby greatly improving the problem of poor binding when a SolarCell product is bound with the FPC.

The application provides a three-dimensional integrated dual-path modulation radio frequency front-end chip, device and equipment, and relates to the technical field of radio frequency front-end integration. The chip comprises: a first layer, a second layer and a third layer stacked vertically from bottom to top; the first layer comprises a power amplifier switch chip; the second layer comprises a low-noise amplifier chip; the low-noise amplifier chip is interconnected with a transceiver switch in the power amplifier switch chip through a bonding process; the low-noise amplifier chip and the power amplifier chip are assembled together through gold-gold ball planting stacking and realize radio frequency signal transmission through hot-via; the third layer comprises a switch driver chip; the switch driver chip is adhered to the top of the low-noise amplifier chip through insulating glue. The application effectively solves the problem of large volume of the existing radio frequency front-end integration mode through the chip stacking and interconnection mode.

The application discloses an optoelectronic co-encapsulation bonding method and a bonding device, and is applied to the technical field of optoelectronic integration and semiconductor packaging, and the bonding method comprises the following steps: obtaining an optical chip, and preparing a micro bump on a pad of the optical chip; the micro bump comprises a gold ball base and a solder ball, the gold ball base is covered on the pad of the optical chip, and the solder ball is located on the gold ball base; placing a packaging substrate on a heating base, and the micro bump of the optical chip faces the packaging substrate; sealing the four sides of the optical chip by using a nitrogen gas curtain, and physically flushing and chemically reducing the micro bump of the optical chip by using formic acid vapor; and bonding processing is performed by using a hot-press bonding control gap method. According to the bonding method, the micro bump structure of the gold ball base and the solder ball is adopted, the interconnection reliability is significantly improved, the gold ball base and the laser solder ball form stable metallurgical bonding, the process is simplified, the cost is reduced, no flux is involved in the whole process, the process transfer is reduced, and the production efficiency is significantly improved.

The invention provides a device and a method for internal deep cavity bonding of an accelerometer. The device comprises semi-automatic bonding equipment (1), a bonding workbench (2), a bonding working angle dynamic adjusting device (3), a bonding heating device (4) and a detachable anti-static ignition rod device (5), the detachable anti-static ignition rod device (5) comprises an ignition rod (51) and a detachable anti-static head (52); the ignition rod (51) is used for instantaneously discharging in the transduction process of the bonding equipment to react with the bonding pure gold material so as to form a bondable gold ball; when the bonding part of the PCB is bonded, the detachable anti-static head (52) is connected to the head of the ignition rod (51) and is connected with a ground wire. When deep-cavity bonding is carried out on the internal bonding part of the movement, the detachable anti-static head (52) is detached from the head of the ignition rod (51), and the ignition rod (51) extends into the movement of the accelerometer.

1.The name of the design product: wine box (fire gold ball series world cup association 251-1.5). 2.The use of the design product: for wine box. 3.The design points of the design product: in the combination of shape, pattern and color. 4.The picture or photo that best shows the design points: front view. 5.The design claimed contains color.