32 results about "Gold ball" patented technology

The invention relates to the technical field of sensors, in particular to a pressure sensor. According to the invention, the bottom of a pressure interface seat is provided with a pressure guiding hole in threaded connection with a measured part; the sputtering film pressure sensitive core body is fixed at the upper end of the pressure interface seat; the glass sintering shell and the terminal are connected with the sputtering film pressure sensitive core body in a gold wire ball welding manner; the blanking cap is used for sealing the glass sintering shell and the top end opening of the terminal, so that the sputtering film pressure sensitive core body is in a vacuum environment; the signal conditioning circuit unit realizes electric signal transmission and processing of the sputtering film pressure sensitive core body through a terminal and a wire; the electric connector is used for external power supply and signal output; the sputtering film pressure sensitive core body is used for generating an electric signal, and after the electric signal is calibrated, compensated and processed by the signal conditioning circuit unit, the electric connector outputs a volt-level voltage signal in a linear relation with the measured pressure. The device has the advantages of being large in measuring range, high in precision, resistant to vibration impact and capable of measuring absolute pressure.

The utility model relates to a special substrate for a Saw filter film coating process. A pasting film is arranged on the substrate body, a plurality of chips are installed between the substrate body and the pasting film, a plurality of gold balls are arranged between the chips and the substrate body, a plurality of salient points are arranged on the periphery between the substrate body and the pasting film to form a salient point enclosure frame, and the chips are located in the salient point enclosure frame. The problem of board edge slope existing in a saw fall film coating process is solved, the flatness of a chip is improved, the slope phenomenon is avoided, the test failure caused by the uneven surface of a product is reduced, and the test yield is improved; the risk of product failure caused by excessive invasion of the epoxy film is reduced; and product layering quality abnormity is avoided.

The application discloses a broadband slot-gap waveguide to microstrip transition structure, and electromagnetic wave transmission is realized through a ridge-gap waveguide and an inverted microstrip line structure between the slot-gap waveguide and the microstrip line, the inverted microstrip line structure comprises an inverted microstrip line dielectric substrate, a gold ball one and a gold ball two which are respectively arranged on a metal ridge of the ridge-gap waveguide and a microstrip line, the inverted microstrip line dielectric substrate is inverted and buckled on the gold ball one and the gold ball two, so that the inverted microstrip line on the inverted microstrip line dielectric substrate is connected with the metal ridge and the microstrip line through the gold ball one and the gold ball two. The application is applied to a millimeter wave frequency band, electromagnetic wave is fed in from the slot-gap waveguide, and finally transmitted to the microstrip line through the ridge-gap waveguide and the inverted microstrip line structure, and the application has the advantages of small loss, high structural stability and the like, is easy to be integrated with other active / passive devices, and is suitable for small unmanned aerial application fields with high requirements on size and weight.

The utility model relates to the technical field of conductive gold ball production, and discloses full-automatic production equipment for high-precision electromagnetic shielding conductive gold balls, which solves the problem that a plurality of conductive gold balls cannot be fixed at the same time when an annealing furnace for conductive gold ball production is used, and comprises a furnace body, and a door plate is mounted on the outer side of the furnace body; a control switch is fixedly installed in the middle of the side, away from the furnace body, of the door plate, electric heating plates are fixedly installed on the side, away from the door plate, in the furnace body and the two sides in the furnace body, an adjusting and positioning assembly is installed in the furnace body, and the top end of the adjusting and positioning assembly extends to the top of the furnace body; the strip-shaped frame is fixedly mounted in the middle of the interior of the furnace body, two strip-shaped seats are fixedly mounted on each of the two sides of the strip-shaped frame, and placement grooves are formed in the tops of the strip-shaped seats; according to the annealing furnace disclosed by the utility model, a plurality of conductive gold balls can be fixed at the same time in the using process of the annealing furnace for producing the conductive gold balls.

The utility model provides a COB packaging structure of a vehicle-mounted camera module. A chip is a bare chip, the center of a PCB is hollowed out to sink two steps, the bottom step is provided with a fixing groove used for fixing the chip, the first step is provided with a gold planting ball used for gold thread welding, a gold thread is led out from a PAD of the chip to be conducted with the PCB, and a whole circle of glue is drawn between a PAD point on the chip and an imaging area to form a box dam; the chip is a bare chip, and a COB packaging process is adopted; the center of the PCB is hollowed out and sinks into two steps, the bottom step is provided with a chip fixing groove, and the first step is provided with a gold planting ball for gold wire welding; a gold wire is led out from the chip PAD, so that the chip PAD is conducted with the PCB; the bottom of the chip is filled with glue to fix the chip and dissipate heat; a whole circle of glue is drawn between a PAD point on the chip and an imaging area to form a box dam, after packaging is completed, the whole chip sinks, the whole size is reduced, the whole structure is simpler, the packaging technology is simplified, and therefore the production efficiency is improved.

An enhanced bond pad configuration for a light emitting diode (LED) chip of a surface mountable package is presented herein. The surface mountable package comprises an LED chip that has been bonded, within a cavity of the surface mountable package, to a lead frame. The LED chip comprises a first metal layer that has been formed on a first gold bond pad that has been formed on a substrate of the LED chip, or a second gold bond pad that has been formed on the substrate and that surrounds a second metal layer that has been formed on the substate. The surface mountable package further comprises a gold wire that has been ball bonded, via a gold ball, onto the first metal layer or the second metal layer to electrically couple the LED chip to the lead frame.

The invention provides a three-dimensional integrated double-channel modulation radio frequency front-end chip, device and equipment, and relates to the technical field of radio frequency front-end integration. The chip comprises a first layer, a second layer and a third layer which are vertically stacked from bottom to top, the first layer comprises a power amplifier switch chip; the second layer comprises a low noise amplifier chip; the low-noise amplifier chip is connected with a transceiving switch in the power amplifier switch chip through a bonding process; the low noise amplifier chip and the power amplifier chip are assembled together in a stacked mode through gold-gold reballing, and radio frequency signal transmission is achieved through hot-via. The third layer comprises a switch driver chip; and the switch driver chip is adhered to the upper part of the low-noise amplifier chip through insulating glue. Through the chip stacking and interconnection mode, the problem that an existing radio frequency front end integration mode is large in size is effectively solved.

The invention provides a batch packaging method and packaging equipment for MEMS electric field sensors, and the method comprises the steps: fixing an electric field sensitive chip which meets the requirements on the end surface of the inner side of a packaging tube shell; connecting the electric field sensitive chip with a specified welding spot through a lead, and detecting whether the tension of the lead and the thrust of the gold ball meet requirements or not; the packaging cavity, the packaging cover plate, the packaging tube shell meeting the requirement and the material box are pretreated so as to meet the requirement before welding; and in the packaging cavity, performing seam welding on the packaging cover plate and the packaging tube shell so as to fix the packaging cover plate on the packaging tube shell, and warehousing the MEMS electric field sensor meeting the requirements. The packaging equipment for implementing the batch packaging method comprises an electric field sensitive chip fixing part, a bonding wire testing part, a preprocessing part and a welding testing part. According to the invention, the MEMS electric field sensors can be packaged in batches, and the defects of low efficiency, poor product consistency, low air tightness and low yield in the existing packaging process are overcome.

The application provides a preparation method of a wafer sample for making a chip on board and a method for making a chip on board, wherein the preparation method of the wafer sample for making a chip on board comprises the following steps: determining a target wafer in a multi-wafer stack sample, the target wafer being a non-lowermost wafer and being directly connected to the substrate through a gold wire, the gold wire having a first gold ball at a contact part with the substrate; removing the substrate to expose a solder resist layer at the bottom of the lowermost wafer in the plurality of wafers; measuring a first distance in a horizontal direction between the first gold ball on the gold wire connecting the target wafer to the substrate and the edge of the target wafer; determining a grinding area for removing one or more wafers below the target wafer according to the first distance; and removing the one or more wafers below the target wafer based on the determined grinding area to obtain the wafer sample for making a chip on board. The wafer sample for making a chip on board prepared by the application is beneficial to wire bonding operation.

The application describes a pad structure of a flexible stimulation electrode and a preparation method, the pad structure comprising a first insulating layer, a first metal material layer, a second insulating layer, a second metal material layer, a third insulating layer and a central via, wherein the first metal material layer is formed on the first insulating layer; the second insulating layer is formed on the first metal material layer and the first insulating layer; the second metal material layer is formed on the first metal material layer and the second insulating layer; the third insulating layer is formed on the second metal material layer and the second insulating layer; the first insulating layer, the second insulating layer and the third insulating layer are composed of the same material; the central via comprises a first via and a second via, the first via penetrates and exposes the first insulating layer, the first metal material layer and the second metal material layer, and the second via penetrates the third insulating layer. The application simplifies the existing preparation process, and the pad structure can realize the connection between the electrode and the external circuit by using a simple gold ball welding or conductive glue coating process.

The application discloses a kind of intelligent card non-contact module packaging device and packaging process, it is related to electronic packaging process technical field.The intelligent card non-contact module packaging device and packaging process, including holster, each holster is away from the end of wire gun head Half concave cavity with semicircular table shape, the upper end of the half concave cavity is the small diameter end of closure, the lower end is the large diameter end of opening, the small diameter end of closure forms cutter, two groups of holster are closed when cutter is used to cut off gold wire, and two half concave cavities form completed forming cavity, so that gold liquid forms gold ball in forming cavity.By the drive of driving assembly, driving holster can be radially opened and closed, on the one hand, gold wire is cut off flush, to avoid generating excess flow welding, on the other hand, while cutting off, molten gold liquid is polymerized to form gold ball, to avoid producing sharp protrusions, to provide smooth connection surface for subsequent gold wire and gold ball re-welding, to improve stability, accuracy in chip bonding welding process.

1. The name of the design product: tray (handle gold ball foot solid wood tray). 2. The use of the design product: for tray. 3. The design points of the design product: in the combination of shape and pattern. 4. The picture or photo that best indicates the design points: perspective drawing.

The application relates to a gold wire ball wedge soldering bonding method, which adopts a ball soldering process to plant a first gold ball on an RF pad of a PCB, adopts a wedge soldering process to wedge solder one end of a gold wire on an RF pad of a silicon optical chip, and then wedge solder the other end on the first gold ball after being pulled high; or, first adopts a ball soldering process to plant a second gold ball on an RF pad of a silicon optical chip and a first gold ball on an RF pad of a PCB, and then adopts a wedge soldering process to wedge solder one end of a gold wire on one second gold ball, and then wedge solder the other end on one first gold ball after being pulled high. A 1.6T silicon optical module comprises a structure bonded by the gold wire ball wedge soldering bonding method. The gold wire ball wedge soldering bonding method solves the problems of the total length of the gold wire being too long and the reliability of wedge soldering on the pad of the PCB being unstable, the diameter of the gold wire can be 35 mu after the ball wedge soldering, the force is strong, the reliability is good, and the high-frequency performance is good.

The invention discloses a packaging assembly, an assembling method thereof and a camera module. The assembling method of the packaging assembly comprises the steps that a, a circuit board is provided, a plurality of circuit board bonding pads are arranged on the surface of one side of the circuit board, and at least one solder ball is implanted into the circuit board bonding pads; b, a chip is provided, a plurality of chip bonding pads are arranged on the chip, and at least one gold ball is implanted into the chip bonding pads; c, coating the glue on the solder balls of the circuit board bonding pad; and d, enabling the chip bonding pad to correspond to the circuit board bonding pad, and bonding and fixing the solder balls of the circuit board bonding pad and the gold balls of the chip bonding pad so as to conduct the circuit board and the chip. The glue is filled in the fusion area formed by the gold balls and the solder balls, so that the packaging assembly has the advantages of good conductivity, light overall weight, small size and the like, can be applied to a camera module structure for chip shake prevention and the like, and can effectively improve the precision of chip shake prevention adjustment.

The application provides a leadless packaging pressure sensor and a preparation method thereof. The leadless packaging pressure sensor comprises a sintering tube shell and a carrier chip inverted on a substrate of the sintering tube shell. The sintering tube shell comprises a plurality of lead pillars extending through the substrate and along the shell wall of the sintering tube shell, one end of the lead pillar extending out of the substrate. The carrier chip is provided with a connecting hole corresponding to the lead pillar. The bottom of the connecting hole is provided with a gold ball implanted by a cleaver. The connecting hole is filled with conductive paste. When the carrier chip is inverted and bonded to the substrate, the connecting hole is buckled outside the corresponding lead pillar. The lead pillar is inserted into the conductive paste, and the gold ball is opposite to the end of the lead pillar. The packaging method of implanting the gold ball and connecting the gold ball and the lead pillar by the conductive paste can effectively solve the influence of high-temperature sintering on the performance of the carrier chip and improve the service life of the sensor.

The invention discloses a bonding method for enhancing gold wire bonding quality reliability, and belongs to the technical field of semiconductor thick film hybrid integrated circuit packaging. The bonding method comprises the following steps: (1) firstly, pre-planting gold balls on the thick film gold conduction band, and increasing the contact area and the bonding strength of a bonding point and the gold conduction band; and (2) carrying out safety ball bonding on the crescent, and tightly clamping the crescent between the two golden balls to form hamburger wrapping ball bonding. The problems that in an existing bonding technology, crescent bonding pseudo soldering exists, and the root of a bonding wire is prone to breakage are solved. The method is widely applied to the packaging technology of gold conduction band electronic components, in particular to the packaging technology of a semiconductor hybrid integrated circuit adopting a gold wire bonding structure.

The invention discloses an anisotropic conductive adhesive based on polymer gold balls and high-melting-point liquid metal and a preparation method of the anisotropic conductive adhesive, and belongs to the technical field of electronic tag encapsulating materials, the anisotropic conductive adhesive comprises the following raw materials in parts by mass: 4-7 parts of gold-plated polymer particles, 2-12 parts of liquid metal solder balls and 92-98 parts of a curable basic adhesive solution. The curable basic glue solution is an epoxy system basic glue solution or an acrylic acid system basic glue solution. According to the anisotropic conductive adhesive, the gold balls and the liquid metal solder balls with high melting points are matched in the anisotropic conductive adhesive, so that the contact area between the conductive metal and the base material and the contact area between the conductive metal and the chip are increased, the stability and reliability of the anisotropic conductive adhesive are improved, and the anisotropic conductive adhesive can be widely applied to the field of electronic tags.

1. The name of this design product: Jewelry Accessory (Hard Gold Ball 2). 2. Purpose of this design product: for wearing and decorative use. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.

The present disclosure provides a smart golf ball including: a protection cover (100) that includes a first protection cover (102) having a coupling flange (120), a second protection cover (104) having a coupling frame (124) inserted inside the coupling flange (120), and mounts (130) configured at the first and second protection covers (102, 104) to correspond to each other; a control unit (400) that is mounted on the mounts (130) and creates movement information of the golf ball when the golf ball is hit; a shock-absorbing member (200) configured to cover an outer surface of the protection cover (100); and an outer shell (300) configured to cover the shock-absorbing member (200), and a system for providing ball flight that transmits putting ball flight information of the smart gold ball to a user terminal.

The invention discloses a pad structure of a flexible stimulating electrode easy for batch production and a preparation method thereof, the pad structure comprises a first insulating layer, a first metal material layer, a second insulating layer, a second metal material layer, a third insulating layer and a central through hole, the first metal material layer is formed on the first insulating layer; the second insulating layer is formed on the first metal material layer and the first insulating layer and exposes part of the first metal material layer; the second metal material layer is formed on the first metal material layer and the second insulating layer; the first metal material layer is directly connected with the second metal material layer; the third insulating layer is formed on the second metal material layer and the second insulating layer. According to the invention, the bonding pad structure which is easy to produce in batches and can realize the connection between the electrode and the external circuit by using a simple gold wire ball bonding or conductive adhesive coating process can be provided.

The invention provides a method for improving the bonding strength of gold wire ball bonding, and the method comprises the step of adding a pretreatment step for removing a gold ball and an oxide layer on the surface of a to-be-bonded region and redundant materials before formal welding. A pretreatment step is added before formal welding. According to the method, the oxide layer and the redundancy on the bonding surface are effectively removed, so that the gold wire and the metal surface can be better combined during formal bonding, the bonding strength is improved, and the packaging reliability of an electronic device is improved. The problem that the gold wire ball bonding strength is insufficient due to the fact that the bonding surface is contaminated or an oxide layer is thick is solved.

The invention relates to a gold wire ball wedge bonding method, which comprises the following steps of: planting a first gold ball on an RF (Radio Frequency) bonding pad of a PCB (Printed Circuit Board) by adopting a ball bonding process, carrying out wedge bonding on one end of a gold wire on an RF bonding pad of a silicon optical chip by adopting a wedge bonding process, and pulling the other end of the gold wire up and then carrying out wedge bonding on the first gold ball; or, the second gold balls are planted on the RF bonding pad of the silicon optical chip and the first gold balls are planted on the RF bonding pad of the PCB by adopting a ball bonding process, then one end of the gold wire is subjected to wedge bonding on one second gold ball by adopting a wedge bonding process, and the other end of the gold wire is pulled up and then is subjected to wedge bonding on one first gold ball. The 1.6 T silicon optical module comprises the structure formed by bonding through the gold wire ball wedge bonding method. The method has the beneficial effects that the problem that the total length of the gold wire is too long is solved by adopting a gold wire ball wedge bonding method, the problem that the reliability of wedge bonding on a bonding pad in a PCB is unstable is solved, after ball wedge bonding is adopted, the maximum diameter of the gold wire can be 35 microns, the force is strong, the reliability is good, and the high-frequency performance is good.

1. The name of the design product: chip height microscope (gold ball). 2. The use of the design product: microscope for observing microstructure. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.

1. Name of the product in this design: Chandelier Accessory (GJ506 Phantom Gold Ball B). 2. Purpose of this design: Indoor lighting fixture accessories. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The utility model discloses a PAD structure for a SOLARCELLFPC binding end. The PAD structure comprises a display screen and an FPC, a binding position is arranged at the bottom of the front surface of the display screen, and the FPC is arranged on the binding position; a plurality of positive PADs and negative PADs are arranged on the left side and the right side of the top of the FPC respectively, and the positive PADs and the negative PADs are bound with the binding positions through hot pressing. According to the PAD structure aiming at the binding end of the SOLARCELLFPC, one PAD position in the original design is changed into three PAD positions or more, so that the width of the binding position PAD is greatly reduced compared with the original design, the stress is more uniform during hot-pressing binding, and the conductive gold ball is easier to crush, thereby greatly improving the problem of poor binding when a SolarCell product is bound with the FPC.

The application provides a three-dimensional integrated dual-path modulation radio frequency front-end chip, device and equipment, and relates to the technical field of radio frequency front-end integration. The chip comprises: a first layer, a second layer and a third layer stacked vertically from bottom to top; the first layer comprises a power amplifier switch chip; the second layer comprises a low-noise amplifier chip; the low-noise amplifier chip is interconnected with a transceiver switch in the power amplifier switch chip through a bonding process; the low-noise amplifier chip and the power amplifier chip are assembled together through gold-gold ball planting stacking and realize radio frequency signal transmission through hot-via; the third layer comprises a switch driver chip; the switch driver chip is adhered to the top of the low-noise amplifier chip through insulating glue. The application effectively solves the problem of large volume of the existing radio frequency front-end integration mode through the chip stacking and interconnection mode.

The application discloses an optoelectronic co-encapsulation bonding method and a bonding device, and is applied to the technical field of optoelectronic integration and semiconductor packaging, and the bonding method comprises the following steps: obtaining an optical chip, and preparing a micro bump on a pad of the optical chip; the micro bump comprises a gold ball base and a solder ball, the gold ball base is covered on the pad of the optical chip, and the solder ball is located on the gold ball base; placing a packaging substrate on a heating base, and the micro bump of the optical chip faces the packaging substrate; sealing the four sides of the optical chip by using a nitrogen gas curtain, and physically flushing and chemically reducing the micro bump of the optical chip by using formic acid vapor; and bonding processing is performed by using a hot-press bonding control gap method. According to the bonding method, the micro bump structure of the gold ball base and the solder ball is adopted, the interconnection reliability is significantly improved, the gold ball base and the laser solder ball form stable metallurgical bonding, the process is simplified, the cost is reduced, no flux is involved in the whole process, the process transfer is reduced, and the production efficiency is significantly improved.

The invention provides a device and a method for internal deep cavity bonding of an accelerometer. The device comprises semi-automatic bonding equipment (1), a bonding workbench (2), a bonding working angle dynamic adjusting device (3), a bonding heating device (4) and a detachable anti-static ignition rod device (5), the detachable anti-static ignition rod device (5) comprises an ignition rod (51) and a detachable anti-static head (52); the ignition rod (51) is used for instantaneously discharging in the transduction process of the bonding equipment to react with the bonding pure gold material so as to form a bondable gold ball; when the bonding part of the PCB is bonded, the detachable anti-static head (52) is connected to the head of the ignition rod (51) and is connected with a ground wire. When deep-cavity bonding is carried out on the internal bonding part of the movement, the detachable anti-static head (52) is detached from the head of the ignition rod (51), and the ignition rod (51) extends into the movement of the accelerometer.

1.The name of the design product: wine box (fire gold ball series world cup association 251-1.5). 2.The use of the design product: for wine box. 3.The design points of the design product: in the combination of shape, pattern and color. 4.The picture or photo that best shows the design points: front view. 5.The design claimed contains color.