Preparation method of micron polymer-based composite conductive gold balls

A composite conductive and polymer technology, used in metal processing equipment, transportation and packaging, can solve the problems of poor bonding fastness between the gold layer and the polymer matrix, endangering the life safety of operators, and uneven adsorption. Large-scale production, low production cost, and the effect of enhancing bond fastness

Active Publication Date: 2016-04-13
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of large gold particles in the gold plating process will cause uneven adsorption, poor bonding fastness between the gold layer and the polymer matrix, and problems such as falling off.
In addition, the cyanide contained in the gold plating solution is a highly toxic substance, which seriously pollutes the environment and endangers the safety of operators.

Method used

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  • Preparation method of micron polymer-based composite conductive gold balls
  • Preparation method of micron polymer-based composite conductive gold balls

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Dissolve 1 g of the dispersant polyvinylpyrrolidone (PVP) in 22 g of ethanol solvent, then add 10 g of styrene monomer with 0.11 g of azobisisobutyronitrile into the ethanol solution, and stir evenly , added to a four-necked flask with nitrogen, the reaction temperature was 75 ° C, mechanically stirred for 20 h, and then centrifuged and washed to obtain monodisperse polystyrene microspheres.

[0035] (2) Disperse the polystyrene microspheres synthesized above in an appropriate amount of water, add polyvinyl alcohol, and stir thoroughly to obtain evenly and stably dispersed microspheres.

[0036] (3) Disperse 1 g of the above-prepared polystyrene microspheres in a mixed solution of water and ethanol, add 0.1 g of 2-aminopyrrole after stirring evenly, add 0.05 g of ammonium persulfate and place on ice React in a water bath for 12 hours, wash by centrifugation, and vacuum-dry at 60°C to obtain aminated polystyrene microspheres.

[0037] (4) Add mercaptobutyric acid to...

Embodiment 2

[0040] (1) dispersant polyvinyl alcohol 1g, dissolve in the methanol solvent of 22g, add 0.75g polyacrylic acid, then add the methyl methacrylate monomer 10g that is dissolved in the benzoyl peroxide of 0.11g to methanol solution After stirring evenly, it was added into a four-necked flask with nitrogen gas, the reaction temperature was 75°C, mechanically stirred for 20 hours, and then washed by centrifugation.

[0041] (2) Disperse the polymer microspheres synthesized above in an appropriate amount of water, add polyvinylpyrrolidone, and stir thoroughly to obtain evenly and stably dispersed microspheres.

[0042] (3) Disperse 1 g of the polymer microspheres prepared above in a mixed solution of water and ethanol, stir well and add 0.1 g of diphenylamine, mix well, add 0.05 g of ferric chloride, and place in an ice-water bath React for 12 hours, wash by centrifugation, and dry under vacuum at 60°C.

[0043] (4) Add thioglycolic acid to the gold sol reduced with dimethylborane...

Embodiment 3

[0046] (1) Dissolve 1 g of polyvinyl alcohol as a dispersant in 22 g of ethanol solvent, then add 10 g of methyl methacrylate monomer 0.11 g of azobisisobutyronitrile into the ethanol solution, and stir evenly , was added to a four-neck flask with nitrogen gas, the reaction temperature was 75°C, mechanically stirred for 20 hours, and then washed by centrifugation.

[0047] (2) Disperse the polymer microspheres synthesized above in an appropriate amount of water, add polyvinylpyrrolidone, and stir thoroughly to obtain evenly and stably dispersed microspheres.

[0048] (3) Disperse 1 g of the polymer microspheres prepared above in a mixed solution of water and ethanol, stir evenly, add 0.1 g of 4-(2-aminoethyl)-1,2-benzenediol, mix well Finally, 0.05 g of ammonium persulfate was added, reacted for 12 hours, washed by centrifugation, and dried in vacuum at 60°C.

[0049] (4) Add thioglycolic acid to the gold sol reduced with sodium borohydride to obtain a carboxylic acid-modifie...

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Abstract

The present invention relates to a preparation method of micron polymer-based composite conductive gold balls. The method comprises: dispersing polymer microparticles in water; then adding stabilizing agent; stirring to obtain polymer microparticle dispersion liquid; then adding an amino-modified reagent; mechanically stirring and reacting to obtain amino-modified polymer microparticles; ultrasonically dispersing in water; adding carboxylic acid-modified gold sol; magnetically stirring, washing, centrifuging and drying to obtain polymer microparticles overlapped with nanoparticles on the surface; ultrasonically dispersing in a cyanide-free gold growth solution; under a condition of 40-80 DEG C, ultrasonically or mechanically stirring and reacting, washing, centrifuging and drying to obtain the product. The preparation method in the present invention is environmentally friendly and is simple and convenient to operate, avoids the heavy and complicated pre-treatment process in the traditional chemical plating and solves the problems of interference of impurity ions such as tin and palladium and toxicity of chemical plating solution such as cyanide.

Description

technical field [0001] The invention belongs to the field of preparation of composite conductive gold balls, in particular to a preparation method of micron-scale polymer-based composite conductive gold balls. Background technique [0002] Due to their unique properties, metal-coated polymer microspheres are widely used in biomedicine, catalysis, microelectronic devices, surface-enhanced Raman scattering (SERS) and other fields, and have attracted extensive attention in recent years. Among them, the excellent conductivity of gold (Au) can be used as the conductive particles of the anisotropic conductive film ACF material. ACF is a composite bonding material composed of conductive particles, binders, additives, etc. that conducts electricity in the Z-axis direction and insulates in the XY plane direction, thus becoming a green and environmentally friendly bonding method that replaces tin-lead soldering. It is widely used in the connection of fine microelectronic device circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F9/24
CPCB22F9/24B22F1/102
Inventor 张清华徐婷齐亚龙赵昕
Owner DONGHUA UNIV
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