Panel and manufacturing method thereof

Abstract

The invention relates to a panel and a manufacturing method thereof, wherein, the manufacturing method of the panel comprises the following steps: finishing the manufacturing of film transistor arraysand peripheral graphs on a substrate to form an array substrate; coating main frame sealing glue in which no golden ball is doped at the periphery of the array substrate; coating secondary frame sealing glue in which golden balls are doped outside of the main frame sealing glue, wherein the secondary frame sealing glue is partly overlapped with or completely separated from the main frame sealingglue, and is positioned in the connecting electrode area of the array substrate but keeps away from the lead wire area of data lines; and aligning the array substrate and a color-film substrate to form the panel. To the panel and the manufacturing method thereof, due to the absence of golden balls in the lead wire area of the date lines, ESD can not occur, simultaneously golden balls are only doped in the secondary frame sealing glue, the usage amount of golden balls is greatly reduced, thereby lowering the cost of the panel.

Description

technical field [0001] The invention relates to a panel and a manufacturing method of the panel, in particular to a panel with a main sealing frame glue and a secondary sealing frame glue structure and a manufacturing method thereof, belonging to the field of liquid crystal display manufacturing. Background technique [0002] In the field of flat panel display, thin film transistor (TFT) liquid crystal display (LCD) has gradually become the mainstream product in the field of flat panel display due to its advantages of light weight, thin thickness, no radiation, and low power consumption. In order to further improve the display quality and reliability of liquid crystal displays, various new manufacturing processes, new materials and new structures have been successfully developed, including the optimization of the structure of the sealant. The sealant 105 in the panel of the liquid crystal display is generally coated with Around the array (Array) substrate 103 or the color fi...

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Problems solved by technology

[0004] However, the inventor found in the process of implementing the above technical solution: in the current structure of the sealing glue, since gold balls are doped in all the sealing glue, it will inevitably bring about two major disadvantages: one is that the pads of the data lines ( The data line lead (Fan out) 101 area corresponding to the Data Pad) 104 will cause multiple occurrences of electrostatic discharge (ESD), such as figure 2 As shown, it is a schematic diagram of the area of ​​the data line leads corresponding to the data line pads in the existing sealing glue structure, wherein the data line pads 104 are located on the array substrate 103, and due to the existence of gold balls, the data line leads 101 A short circuit occurs with the common electrode 113 on the color filter substrate 102, thereby causing the occurrence of corresponding line defects. ESD usually occurs in image 3 Point E in image 3 For the middle edge of the existing frame sealant structure figure 2 A cross-sectional view at position A-A in , additionally, from figure 2 The positional relationship between the frame sealant 105 and the black matrix (BM) 106 can also be seen in the figure; second, since all the frame sealants are doped with gold balls, the amount of gold balls used is relatively large, so to a certain extent The cost of the liquid crystal display panel is increased; the third is that the inventors also found that the occurrence of defective lines has nothing to do with the density of gold balls doped in the sealant, that is to say, the problem cannot be solved fundamentally by reducing the doping density. Therefore, a new sealing glue structure is needed to solve the line defect caused by the use of gold balls

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