Image sensor module and formation method thereof

An image sensor and image sensing technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., to achieve the effect of improving yield rate, high yield rate, and mild process conditions

Active Publication Date: 2014-07-23
苏州晶方光电科技有限公司
View PDF7 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the performance of the image sensor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Image sensor module and formation method thereof
  • Image sensor module and formation method thereof
  • Image sensor module and formation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] It can be seen from the background art that the packaging performance and reliability of the image sensor module formed in the prior art need to be further improved, and the process is more complicated and the packaging cost is higher.

[0050] After research, it is found that the packaging performance and reliability of the image sensor module need to be improved because of:

[0051] The packaging process for forming the aforementioned image sensor module is extremely complicated, and the grains are formed by cutting the wafer to be packaged (image sensor chip to be packaged) after a series of packaging processes; the wafer to be packaged undergoes thinning and etching to form through holes , forming a protective layer, forming a metal layer, forming an insulating layer and other multi-channel packaging processes, the packaging process has a negative impact on the performance of the wafer to be packaged, so the performance of the crystal grains formed by cutting the waf...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an image sensor module and a formation method thereof, wherein the image sensor module comprises a substrate which is provided with a frontage and a back opposite to the frontage, a buffer layer located on the frontage of the substrate and a metal layer located on the surface of the buffer layer, a die inverted above the substrate, a welding projection located on the surface of the metal layer, and a formed lens assembly, wherein the die is provided with an image sensing region and a bonding pad surrounding the image sensing region, and the bonding pad is electrically connected with the metal layer; the lens assembly comprises a mirror base and a lens, and the lens is connected with the back of the substrate by virtue of the mirror base. The performance and the reliability of the image sensor module are improved.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to an image sensor module and its forming method. Background technique [0002] An image sensor chip is a chip that senses external light and converts it into an electrical signal. After the image sensor chip is manufactured, a series of packaging processes are performed on the image sensor chip to form a packaged image sensor for use in various electronic devices such as digital cameras and digital video cameras. [0003] The traditional image sensor packaging method is usually packaged by wire bonding (Wire Bonding). However, with the rapid development of integrated circuits, longer leads make the product size unable to meet the ideal requirements. Therefore, wafer-level packaging (WLP: Wafer Level Package) has gradually replaced wire bonding packaging as a more commonly used packaging method. [0004] The image sensor module is formed by installing a lens module on the basi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L27/146H01L21/77
Inventor 王之奇喻琼王蔚
Owner 苏州晶方光电科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap