207 results about "Negative thermal expansion" patented technology

A deformation-driven additive manufacturing method for a low-interfacial-stress aluminum-steel composite structure comprises the steps that an aluminum alloy thin tube is filled with an adding phase with a low thermal expansion coefficient or a negative thermal expansion coefficient and aluminum-silicon powder used for enhancing the thermal plasticizing fluidity of a raw material wire according to the proportion, and after drying treatment, the raw material wire for adjusting the thermal expansion coefficient is manufactured; a continuous wire feeding friction stir additive manufacturing method is adopted, aluminum alloy raw material wires and adjusting raw material wires are synchronously fed according to the rate proportion changing layer by layer, deposition is driven through deformation, and an aluminum alloy composite transition layer with additive phase components changing in a gradient mode is formed; after the aluminum alloy composite material transition layer is completely prepared, the continuous wire feeding friction stir additive manufacturing method is continuously adopted, and continuous deposition is conducted on the aluminum alloy composite material transition layer to form an aluminum alloy deposition layer; and after deposition manufacturing of the component is completed, subtractive machining treatment is carried out, and a final product is obtained. The invention relates to the technical field of dissimilar material additive manufacturing.

The present invention relates to the field of ceramic technology, and specifically to a high thermal shock alumina composite ceramic and a preparation method thereof, comprising the following raw materials in parts by weight: 65-95 parts of an Al2O3-ZrO2 / ceramic fiber or whisker composition, 100-200 parts of deionized water, 8-12 parts of a plasticizer, and 2-15 parts of a low thermal expansion coefficient base material. The present invention reduces the thermal expansion coefficient of the alumina ceramic by adding ZrO2 / ceramic fiber or whisker to alumina, introducing ceramic fiber or whisker binary toughening while introducing ZrO2 phase change toughening, and introducing a unit with a lower thermal expansion coefficient or a negative thermal expansion coefficient. High-energy ball milling improves the uniformity of the powder interface, thereby improving the thermal shock resistance of the alumina composite ceramic. The method for preparing the ceramic is simple to operate, has high production efficiency, and low production cost. The ceramic round tube made of the alumina composite ceramic can meet the high thermal shock resistance requirements and can be widely used in environments with sudden temperature changes.

The invention provides a method for applying strain to a semiconductor material and a product. The method mainly comprises the following steps: S1, obtaining a semiconductor material donor and a negative thermal expansion substrate; s2, bonding the semiconductor material donor to the negative thermal expansion substrate at a first temperature; and S3, stripping the first semiconductor layer on the semiconductor material donor from the semiconductor material donor at a third temperature. According to the method for applying the strain to the semiconductor material, the optical and electrical properties of the semiconductor material can be adjusted, and the application range of the semiconductor material is widened.

The invention provides a method for applying stable strain to a semiconductor material and a product. The method mainly comprises the following steps that S1, a semiconductor material donor and a negative thermal expansion substrate are obtained, and the negative thermal expansion substrate has the property of positive thermal expansion or low thermal expansion in a first temperature interval and a third temperature interval and has the property of negative thermal expansion in a second temperature interval between the first temperature interval and the third temperature interval; s2, bonding the semiconductor material donor to the negative thermal expansion substrate at a first temperature in a first temperature interval; s3, stripping the first semiconductor layer on the semiconductor material donor from the semiconductor material donor at a second temperature in the first temperature interval; and S4, enabling the product subjected to the step S3 to work at the temperature of a third temperature interval. According to the method for applying the stable strain to the semiconductor material, the strain stability of the semiconductor material can be kept at the working temperature, and the strain control cost is reduced.

The invention provides an electric heating shock-resistant leading edge and a using method thereof.The electric heating shock-resistant leading edge comprises an outer side skin, a leading edge heating layer, a leading edge inner skin, an energy absorption structure layer, an energy absorption inner skin, ribs and a control module which are sequentially arranged in a stacked mode from outside to inside, the energy absorption structure comprises a Z-shaped body and a supporting body, one end of the supporting body is connected with the end of the Z-shaped body, the other end of the supporting body is connected with a bent portion of the Z-shaped body, the Z-shaped body is connected to the front edge inner skin, the supporting body is made of negative thermal expansion materials, and a probe is arranged at the position, corresponding to the supporting body, of the rib and comprises a pressure sensor and a distance monitor. And the probe and the front edge heating layer are electrically connected to the control module. The electric heating deicing function of bird impact resistance and automatic control of the front edge structure is achieved, the temperature control reliability is improved, the structural weight is reduced, and the technical problems of temperature control, bird impact resistance, structural weight reduction and the like are solved.

A bearing having a bearing surface with a groove, the bearing positioned adjacent to a shaft, the groove facing the shaft, and a negative thermal expansion (NTE) material positioned in the groove, the NTE material at least partially filling the groove.

The invention provides a composite material for forming a stress release layer, a preparation method of the composite material, an integrated co-fired piezoelectric ceramic actuator and a preparation method of the integrated co-fired piezoelectric ceramic actuator. The method for preparing the composite material for forming the stress release layer comprises the following steps: carrying out ball milling treatment on Bi2O3, Fe2O3, Pb3O4 and TiO2 to obtain precursor powder; the precursor powder is subjected to heat treatment, and BiFeO3-PbTiO3 ceramic powder is obtained; and mixing the BiFeO3-PbTiO3 ceramic powder with the inner electrode metal slurry to obtain the composite material. The internal stress of the actuator is effectively regulated and controlled by utilizing the negative thermal expansion characteristic of the BF-PT ceramic. The elasticity of the inner electrode metal ensures the stress slow-release capability of the inner electrode metal and the outer electrode metal serving as a composite material of a stress release layer, and meanwhile, an effective water vapor barrier is constructed due to the high density of the inner electrode metal.

The invention provides a bifunctional interface lithium-rich manganese-based positive electrode material as well as a preparation method and application thereof, and belongs to the technical field of lithium ion battery positive electrode materials. The bifunctional interface lithium-rich manganese-based positive electrode material comprises a lithium-rich manganese-based layered oxide core particle, an inner negative thermal expansion inorganic layer coating the surface of the lithium-rich manganese-based layered oxide core particle, and an outer fast lithium ion conducting layer coating the outer side of the inner negative thermal expansion inorganic layer. Through the synergistic effect of inner and outer coating layers, mechanical regulation and control and chemical / ion regulation and control are simultaneously realized on the particle size. Compared with a scheme which only adopts an inert coating, a single lithium ion conductive coating or a single negative thermal expansion coating, the method has the advantages that the thermal-chemical-mechanical coupling failure problem of a positive electrode / solid electrolyte interface in the all-solid-state battery can be more comprehensively solved, relatively low interface impedance, smaller voltage attenuation and higher cycling stability are realized, the preparation process is simple, and the preparation cost is low. The method is suitable for large-scale production.

The invention provides a Mn-Fe-Ni-Si-Cu-based negative thermal expansion material as well as a preparation method and application thereof, and belongs to the technical field of negative thermal expansion materials. The negative thermal expansion temperature range of the Mn-Fe-Ni-Si-Cu-based negative thermal expansion material provided by the invention covers the high-temperature and low-temperature ranges (120K-896K), and the high-temperature and wide-temperature-range negative thermal expansion effect is shown; good mechanical properties are achieved; the material has extremely high thermal and mechanical stability, and has important significance for developing high-temperature precision mechanical devices based on zero expansion. The Mn-Fe-Ni-Si-Cu-based negative thermal expansion material disclosed by the invention is low in raw material cost and simple in preparation method.

The application discloses a SiO2-coated negative thermal expansion film and application thereof, and belongs to the technical field of temperature measurement. 12 :Nd 3+ The precursor solution is calcined to obtain the negative thermal expansion film, and then SiO2 solution is added dropwise on the negative thermal expansion film to obtain the SiO2-coated Yb2W3O 12 :Nd 3+ The SiO2-coated negative thermal expansion film is loaded on the opal template. 12 :Nd 3+ As a matrix, the SiO2 coating does not affect the luminescence of the negative thermal expansion film, and makes the Yb2W3O 12 :Nd 3+ The luminescence of the film in the near infrared is significantly enhanced. In addition, compared with the negative thermal expansion material film without the SiO2 coating, the negative thermal expansion material film is more sensitive to temperature.

The present invention relates to the technical field of lithium-ion batteries, and particularly provides a positive electrode sheet and a preparation method therefor, and a lithium-ion battery comprising the positive electrode sheet. The positive electrode sheet comprises a positive electrode active material layer, and the positive electrode active material layer comprises a positive electrode material, a negative thermal expansion material, a conductive agent, and a binder, wherein the characteristic value J of the positive electrode sheet satisfies: 0.001≤J≤0.005. wherein J=R(F) / ρ, R(F) represents the peak intensity ratio between the main peak (F) of the negative thermal expansion material and the (003) characteristic peak of the positive electrode material in the XRD pattern of the positive electrode sheet, and p represents the surface density of the positive electrode sheet, with a unit of mg / cm2.

The invention relates to the technical field of preparation of magnesia-calcium bricks, and provides a thermal expansion compensation magnesia-calcium brick and a preparation process thereof. The magnesia-calcium brick adopts a three-layer gradient structure design and comprises a porous layer, a transition layer and a compact layer, and negative thermal expansion composite particles, neutral thermal expansion adjusting particles and thermosensitive expansion particles are introduced into the formula of each layer to jointly form a thermal expansion compensation system. The bonding strength between layers is enhanced through a mechanical meshing structure of the dovetail grooves and the dovetail protrusions, and interlayer stripping is effectively avoided. The preparation process comprises the steps of raw material surface modification, layered burdening, mold design and charging, segmented temperature control sintering, coordinated cooling and the like. The problems that a traditional magnesia-calcium brick is not matched in thermal expansion and prone to cracking are effectively solved, the thermal shock resistance and structural stability of a brick body are remarkably improved, and the service life of the brick body is remarkably prolonged.

The application discloses a kind of superhigh temperature self-adaptive insulated cable of composite and preparation method thereof, which uses carbon nanotube fiber bundle as conductor, multiple layer aerogel-ceramic nanofiber composite felt as insulator, stress buffer layer formed by negative thermal expansion coefficient material is arranged between layers, and the outer sheath is chemical vapor infiltration SiC carbon fiber braided sleeve.The cable of the application has the advantages of ultra-light, high thermal stability, self-adaptive sealing and strong thermal shock resistance, and is suitable for extreme high temperature environment above 800 DEG C;The preparation method includes supercritical drying, pre-stretching winding and other key processes, to realize the high performance and reliability of the cable.

The application provides an isometric topology optimization method and device based on thermal elastic metamaterial design, and relates to the field of isometric topology optimization. The method comprises the following steps: constructing a multi-material interpolation model corresponding to the thermal elastic metamaterial, and obtaining a plurality of groups of density distributions corresponding to a plurality of solid materials in the thermal elastic metamaterial design domain according to the multi-material interpolation model, one solid material corresponding to one density distribution; obtaining the relationship interpolation between the plurality of groups of density distributions, and obtaining the elastic modulus and the thermal expansion coefficient according to the relationship interpolation; calculating the equivalent elastic matrix corresponding to the thermal elastic metamaterial according to the elastic modulus, and calculating the thermal expansion coefficient matrix corresponding to the thermal elastic metamaterial according to the thermal expansion coefficient; performing discrete form processing on the calculation equations of the equivalent elastic matrix and the thermal expansion coefficient matrix through the isometric grid, constructing a constraint function according to the equivalent elastic matrix, constructing an objective function according to the thermal expansion coefficient matrix, and calculating the sensitivity information corresponding to the first design variable through the objective function and the constraint function; updating the first design variable according to the sensitivity information until the thermal expansion coefficient meets the convergence condition, and obtaining the second design variable when the convergence condition is met through the isometric topology design model of the negative thermal expansion metamaterial; and optimizing the thermal elastic metamaterial according to the second design variable. The application solves the problem that the finite element method is difficult to guarantee the efficient and high-precision design of the thermal elastic metamaterial when dealing with complex geometric structures.

This invention relates to a glass cover with an outer frame, wherein a flat glass plate is directly joined to the outer frame, wherein the glass matrix within the outer frame comprises at least one of bismuth oxide and boron oxide, and the glass ceramic has a coefficient of thermal expansion of 15 × 10⁻⁶. －7 In the glass ceramics described above, the total volume fraction of the negative thermal expansion filler and the total volume fraction of the filler components are both 40% to 65%, and the softening point of the glass components in the glass matrix is ​​lower than the glass transition point of the flat glass.

The present invention discloses a copper pyrovanadate-based reinforcement for reducing the thermal expansion coefficient of a composite material and a preparation method thereof, and relates to a copper pyrovanadate-based reinforcement and a preparation method thereof. In order to solve the problem that the existing copper pyrovanadate-based reinforcement β-Cu2V2O7 has poor negative thermal expansion performance and does not have zero expansion. The copper pyrovanadate-based reinforcement for reducing the thermal expansion coefficient of a composite material of the present invention is β-Cu 2‑x Ba x V2O7, 0<x≤0.2; β-Cu 2‑x Ba x V2O7 is a zero expansion ceramic. Another copper pyrovanadate-based reinforcement for reducing the thermal expansion coefficient of the composite material of the present invention is β-Cu 2‑x Mn x V2O7, 0<x<2; β-Cu 2‑x Mn x V2O7 is a negative thermal expansion material. The present invention can prepare β-Cu by solid phase sintering. 2‑x Ba x V2O7 solid solution has a simple preparation process, can achieve a large number of products in a single sintering, and no harmful gas release. In order to successfully achieve β-Cu through solid phase sintering combined with rapid cooling 2‑ x Ba x The preparation of V2O7 solid solution provides a simpler and more efficient technical means for its batch synthesis. The prepared samples have significantly improved mechanical properties compared to β-Cu2V2O7 and have the potential to be used independently as structural components.

Provided are: a resin composition with which it is possible to suppress thermal expansion and impart excellent connection reliability when used as an adhesive for connecting; and a production method therefor. The present invention relates to a resin composition including an epoxy resin, a curing agent, conductive particles, and negative thermal expansion particles, wherein the content of the conductive particles is 0.2-40 mass%, the content of the negative thermal expansion particles is 0.5-30 vol%, and the ratio of the average particle size of the negative thermal expansion particles with respect to the average particle size of the conductive particles (average particle size of the negative thermal expansion particles / average particle size of the conductive particles) is 0.001-10.

The invention belongs to the technical field of metal-based composite materials, and particularly relates to a preparation method of a metal-based composite material. The preparation method comprises the following steps: mixing Mn3GaC-coated Ti, iron alloy mixed powder and a binder according to a mass ratio, and mixing to obtain a mixed material; cooling and granulating the mixed material to obtain a granular material; and the granular material is injected into a mold, injection molding is conducted, a formed blank is obtained, degreasing, cooling and sintering are conducted, and the metal-based composite material is obtained. The key problems that in the prior art, a metal-based composite material is poor in forming stability, high in thermal expansion coefficient, short in service life and the like in a high-load state are solved, a powder type negative thermal expansion material is introduced into the prepared metal-based composite material, the thermal expansion coefficient is reduced, meanwhile, the technological process is regulated and controlled, and the production efficiency is improved. And the stability and the reliability of the material are improved.

The invention belongs to the technical field of thermal switches, and particularly relates to an expansion type thermal switch based on a paper-cut structure, which comprises a thermal expansion paper-cut structure, the thermal expansion paper-cut structure is a central symmetry structure, two ends of the thermal expansion paper-cut structure are fixedly connected through a fixing plate, and the top end of the thermal expansion paper-cut structure is fixedly connected with the bottom end of a fixed heat source; the negative thermal expansion paper-cut structure is of a central symmetry structure, the two ends of the negative thermal expansion paper-cut structure are fixedly connected through a fixing plate, and the bottom end of the negative thermal expansion paper-cut structure is fixedly connected with the top end of the fixed cold source; the thermal expansion paper-cut structure and the negative thermal expansion paper-cut structure are horizontally arranged in parallel, a first gap is reserved between the bottom end of the thermal expansion paper-cut structure and the top end of the fixed cold source, and a second gap is reserved between the top end of the negative thermal expansion paper-cut structure and the bottom end of the fixed heat source. The invention has the advantages of larger thermal stroke, extremely small contact thermal resistance, larger switch ratio and long service life in overheat and overcold space environments.

The invention relates to a three-dimensional heterogeneous integrated interface structure based on hybrid bonding and a stress buffer layer, and belongs to the technical field of semiconductor packaging. The interface structure sequentially comprises a copper-copper bonding layer, a polymer micro bump array, a carbon nanotube vertical interconnection bundle, a bonding interface layer, a stress self-adaptive buffer layer, a topological optimization power grid and a substrate from top to bottom, wherein an embedded coaxial interconnection structure and a graphene electromagnetic isolation wall are arranged in the topological optimization power grid. Wherein the stress self-adaptive buffer layer is formed by manufacturing polymer micro-lattices on the surface of the bonding interface layer, filling the micro-lattices with a mixture of negative thermal expansion ceramic particles and epoxy resin, and embedding shape memory alloy micro-springs. And the chip is bonded with the interface structure through the copper-copper bonding layer. The device has the advantages of being high in interconnection density, good in mechanical reliability and excellent in signal integrity, and high-performance three-dimensional heterogeneous integration can be achieved.

The invention relates to the technical field of ceramic preparation, in particular to a preparation method of low-expansion heat-resistant purple sand ceramic. Comprising the following steps: preparing lithium-doped pseudo-boehmite composite powder; preparing oxygen vacancy enhanced negative expansion powder; compounding the ceramic raw materials; and firing the ceramic. A (NH4) H2PO4 solution, an H42N10O42W12. XH2O solution, a C10H14NiO4 solution and a ZrOCl28H2O solution are prepared and subjected to a compound hydrothermal reaction, a product is ground and calcined to prepare a material which is rich in oxygen vacancies and has negative thermal expansion, the material is introduced into a ceramic material to be sintered, and the negative thermal expansion performance of the ceramic material is improved by utilizing the characteristics of thermal shrinkage and cold expansion of the material. The negative expansion material is doped with Ni and can offset the thermal expansion and cold contraction characteristics of other positive expansion materials in the ceramic material, so that the thermal expansion coefficient of the subsequently prepared purple sand ceramic is reduced, high-concentration oxygen vacancies can be formed in the negative expansion material through Ni doping, and the negative expansion capacity of the negative expansion material is further improved. The thermal expansion coefficient of the purple sand ceramic can be further reduced.

Embodiments of the present disclosure relates to a composite material, a working stamp, and a preparation method thereof. The composite material includes a polymer matrix, a plurality of SMA nanoparticles, and a plurality of NTE material nanoparticles. The SMA nanoparticles are dispersed in the polymer matrix. The NTE material nanoparticles are dispersed in the polymer matrix. At a first temperature, the composite material is in a cured state and a thermal expansion coefficient of the composite material is zero (0) or near zero. When the composite material is cooled from the first temperature to a second temperature, the composite material spontaneously contracts caused by phase transformation of the SMA nanoparticles.

The present invention belongs to the technical field of thermal expansion materials and discloses a high entropy negative thermal expansion luminescent material and a preparation method thereof. 0.196 Sc 0.196 In 0.196 Yb 0.196 Y 0.196 Er 0.02 )2Mo3O 12 Preparation method: Select Al source, Sc source, In source, Yb source, Y source, Er source and Mo source as raw materials, and prepare the target product (Al 0.196 Sc 0.196 In 0.196 Yb 0.196 Y 0.196 Er 0.02 )2Mo3O 12 The stoichiometric molar ratio of Al: Sc: In: Yb: Y: Er: Mo is 0.392: 0.392: 0.392: 0.392: 0.392: 0.04: 3, and the mixture is weighed and ground to mix evenly. The obtained mixed powder is directly sintered or sintered after tableting at a temperature of 1000-1100 ° C for 5-10 h, and then cooled to room temperature to obtain the target product (Al 0.196 Sc 0.196 In 0.196 Yb 0.196 Y 0.196 Er 0.02 )2Mo3O 12 The present invention proposes a molecular formula (Al 0.196 Sc 0.196 In 0.196 Yb 0.196 Y 0.196 Er 0.02 )2Mo3O 12 The high entropy negative thermal expansion luminescent material overcomes the thermal quenching characteristics of the luminescent material within a certain temperature range.

This invention discloses a through-silicon via (TSV) capable of suppressing copper extrusion and its fabrication method. The invention utilizes magnetron sputtering to deposit a certain thickness of ZrW at the bottom of the TSV. 2‑x Mo x After depositing an O8 thin film, followed by electroplating a copper layer of a certain thickness, the above steps are repeated to deposit multiple layers of ZrW in the middle of the Cu. 2‑x Mo x O8 thin film; while ZrW 2‑x Mo x O8 is a material with a negative coefficient of thermal expansion, which is -4.3 × 10⁻⁶. ‑6 to -7.7×10 ‑6 K ‑1 This material contracts rather than expands when heated. During heat treatment (e.g., annealing) or temperature cycling of through-silicon vias (TSVs), Cu expands, while ZrW... 2‑x Mo x The O8 material shrinks rather than expands, which can partially offset the thermally induced stress caused by the mismatch in the coefficients of thermal expansion between the constituent materials of the through-silicon via (TSV). Therefore, the TSV fabricated by the method of this invention can improve the reliability of copper-filled TSVs while allowing for optimized device performance (e.g., allowing for higher temperature annealing of copper).

The application provides a PrMnO3-based negative thermal expansion material and a preparation method, and belongs to the technical field of negative thermal expansion materials. The negative thermal expansion material is of an orthogonal phase Pnma structure and a 3D cross Mn-O bond network. The negative thermal expansion temperature range of the negative thermal expansion material can be adjusted by adjusting the amount of Bi ions replacing Pr ions. The addition amount of the Bi ions satisfies that the ratio of the molar amount of the Bi ions to the molar amount of A-site ions is less than 50%. The application introduces Bi 3+ for the first time in the A-site of pure PrMnO3 3+ , and directionally introduces a "Bi 2 6s 2 lone pair electron functional site" in the crystal lattice. The PrMnO3-based negative thermal expansion material stably maintains the orthogonal phase Pnma structure and the 3D cross Mn-O bond network, and achieves the purpose of mildly and accurately controlling the negative thermal expansion temperature range.

This invention provides an extension film for FC-BGA encapsulation substrates containing a negative thermal expansion material, its preparation method, and its application. The extension film comprises the following components in parts by weight: 50-60 parts epoxy resin, 5-10 parts phenoxy resin, 30-35 parts curing agent, 70-80 parts inorganic filler, and 10-20 parts phase change negative thermal expansion material. The preparation method includes the following steps: mixing the components of the extension film evenly, coating it onto a substrate, and drying to obtain the extension film. By using inorganic filler and a phase change negative thermal expansion material, this invention produces an extension film with a low coefficient of thermal expansion, suitable for preparing FC-BGA encapsulation substrates.

The object of the present invention is to provide a negative thermal expansion material that consistently exhibits excellent negative thermal expansion characteristics over a wide temperature range of -30 to 150°C, and shows a more gradual volume decrease with increasing temperature compared to Zn2P2O7 between 100 and 150°C. The negative thermal expansion material of the present invention is characterized by containing 5 to 90 parts by mass of zinc pyrophosphate per 100 parts by mass of copper pyrophosphate, wherein the BET specific surface area of ​​the copper pyrophosphate is 0.2 to 8.0 m². 2 The BET specific surface area of ​​the zinc pyrophosphate is 0.2 to 8.0 m² / g. 2 It is preferable that it be / g.

The invention discloses an anti-warping IC carrier plate with an edge supporting structure, and the anti-warping IC carrier plate remarkably reduces the warping deformation of a substrate through the design of edge special holes and thermal mechanical compensation. The H-shaped copper column frame and the gradient aperture / spacing design can compensate according to the asymmetry degree of a substrate pattern, so that the warping of the whole board is reduced; v-shaped or Y-shaped holes are designed according to angles, directional support and bending moment resistance are generated, and corner warping is particularly restrained; a shape memory polymer (SMP) or a thermal shrinkage and cold expansion insert containing a negative thermal expansion (NTE) filler is embedded in a specific position, shrinks at a high temperature to enable the substrate to normally release residual stress, and recovers the supporting property at a room temperature; the existing process of the PCB is continued, special equipment does not need to be newly added, and mass production is easy; under the double compensation of the structure and the material, the metal / polymer in the substrate is crystallized in a low-stress environment, and the overall stability of the substrate is improved.

The invention discloses a battery packaging structure, a preparation method thereof and a battery. The battery packaging structure comprises a battery shell, and a first coating layer and a second coating layer are sequentially arranged on the inner side of the battery shell from inside to outside; the first coating layer is a negative thermal expansion alloy layer; and the second coating layer comprises a metal organic framework material and a negative thermal expansion inorganic compound. The battery packaging structure prepared by the invention can effectively inhibit the volume expansion of the battery in the charging and discharging process, and improves the structural stability, safety and electrochemical performance of the battery.

The invention belongs to the related technical field of metamaterials, and discloses a design method and a product of a zero / negative thermal expansion coefficient metamaterial made of a single solid material. The method comprises the following steps: dividing a design domain into a high-pressure gas region, a low-pressure gas region and a solid region, wherein the solid region is used for isolating the high-pressure gas region from the low-pressure gas region; setting a thermal expansion coefficient and an elastic modulus of the solid area; adjusting the form of the solid region and the air pressure of the gas region so that the deformation of the solid region generated under the pressure difference between the high-pressure gas region and the low-pressure gas region is equal to zero heat or negative thermal expansion of the solid region generated under the temperature change under the condition that the temperature in the design region is changed; in this way, the required form and air pressure of the solid area are obtained. According to the invention, the thermal expansion performance is accurately regulated and controlled, and the method is suitable for application scenes with high requirements on size thermal stability, such as aerospace and precise instruments.