241 results about "Negative thermal expansion" patented technology

An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising a copper vanadium composite oxide dissolving Li atoms and represented by the following general formula (1):(CuxMy)(VaPb)Ot. In the general formula (1), M represents a metallic element with an atomic number of 11 or more other than Cu and V, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.60≤a≤2.40, 0.00≤b≤0.40, 5.00≤t≤9.00, 1.60≤x+y≤2.40, and 1.60≤a+b≤2.40.

An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising copper vanadium composite oxide powder dissolving Al atoms and represented by the following general formula (1), CuxMyVzOt (1). In general formula (1), M represents a metallic element with an atomic number of 11 or more other than Cu, V, and Al, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.70≤z≤2.30, 6.00≤t≤9.00, 1.00≤x+y≤3.00, and a molar number of the Al atoms in terms of atoms>a molar number of M atoms in terms of atoms if an M element is contained.

The utility model belongs to the technical field of propellers, and particularly relates to a ship propeller which comprises a propeller body, a propeller, a connecting rod and a wave suppression plate, a flange plate is fixedly connected to the top end of the connecting rod, a through hole is formed in the flange plate, a wiring channel is formed in the connecting rod, and two annular grooves are formed in the top end of the flange plate. The inner walls of the two annular grooves are fixedly connected with rubber sealing rings and annular wrapping bags correspondingly, and the annular wrapping bags are filled with negative thermal expansion filler. The negative thermal expansion filler and the rubber sealing ring are expanded at different temperatures, so that the sealing performance between the flange plate and the ship body flange is improved, and the sealing performance between the flange plate and the ship body flange can always keep stable high sealing performance in different periods; water is prevented from entering the ship body and the wiring channel due to a gap between the flange plate and the ship body flange, and the situation that the line and the propeller body are damaged due to water immersion is prevented.

The invention provides a diamond and negative expansion particle reinforced aluminum matrix composite and a preparation method, and belongs to the technical field of composites. The aluminum-based composite material is composed of a diamond phase and a negative thermal expansion phase which are dispersed in an aluminum matrix. The average particle size of the diamond phase is 10-1000 [mu] m, and the ratio of the average particle size of the diamond phase to the average particle size of the negative thermal expansion particles is 10-20; the particle size of the negative thermal expansion particles adjacent to the diamond phase is smaller than that of the negative thermal expansion particles away from the diamond phase. The diamond and negative expansion particle reinforced aluminum-based composite material with excellent thermophysical performance is obtained by regulating and controlling the volume fraction of the diamond and the negative expansion particles, the thermal expansion coefficient matched with a semiconductor material is prepared through a collaborative optimization strategy, and the diamond and negative expansion particle reinforced aluminum-based composite material is applied to the field of electronic packaging heat dissipation materials.

A deformation-driven additive manufacturing method for a low-interfacial-stress aluminum-steel composite structure comprises the steps that an aluminum alloy thin tube is filled with an adding phase with a low thermal expansion coefficient or a negative thermal expansion coefficient and aluminum-silicon powder used for enhancing the thermal plasticizing fluidity of a raw material wire according to the proportion, and after drying treatment, the raw material wire for adjusting the thermal expansion coefficient is manufactured; a continuous wire feeding friction stir additive manufacturing method is adopted, aluminum alloy raw material wires and adjusting raw material wires are synchronously fed according to the rate proportion changing layer by layer, deposition is driven through deformation, and an aluminum alloy composite transition layer with additive phase components changing in a gradient mode is formed; after the aluminum alloy composite material transition layer is completely prepared, the continuous wire feeding friction stir additive manufacturing method is continuously adopted, and continuous deposition is conducted on the aluminum alloy composite material transition layer to form an aluminum alloy deposition layer; and after deposition manufacturing of the component is completed, subtractive machining treatment is carried out, and a final product is obtained. The invention relates to the technical field of dissimilar material additive manufacturing.

The present invention relates to the field of ceramic technology, and specifically to a high thermal shock alumina composite ceramic and a preparation method thereof, comprising the following raw materials in parts by weight: 65-95 parts of an Al2O3-ZrO2 / ceramic fiber or whisker composition, 100-200 parts of deionized water, 8-12 parts of a plasticizer, and 2-15 parts of a low thermal expansion coefficient base material. The present invention reduces the thermal expansion coefficient of the alumina ceramic by adding ZrO2 / ceramic fiber or whisker to alumina, introducing ceramic fiber or whisker binary toughening while introducing ZrO2 phase change toughening, and introducing a unit with a lower thermal expansion coefficient or a negative thermal expansion coefficient. High-energy ball milling improves the uniformity of the powder interface, thereby improving the thermal shock resistance of the alumina composite ceramic. The method for preparing the ceramic is simple to operate, has high production efficiency, and low production cost. The ceramic round tube made of the alumina composite ceramic can meet the high thermal shock resistance requirements and can be widely used in environments with sudden temperature changes.

The present invention provides a negative thermal expansion material which has excellent negative thermal expansion properties and exhibits a gentle volume reduction with temperature rise as compared with a conventional zinc phosphorus composite oxide such as Zn2P2O7.　The present invention specifically provides a negative thermal expansion material which is characterized by being a composite of a zinc phosphorus composite oxide represented by general formula (1): ZnxMyPz1Ot1(1) and a metal pyrophosphate salt represented by general formula (2): AwPz2Ot2 (2), wherein the composite has a core-shell structure. It is preferable that a core contains the zinc phosphorus composite oxide represented by the general formula (1), and a shell contains the metal pyrophosphate salt represented by the general formula (2).

The invention belongs to the field of inorganic nonmetals, discloses a wide-temperature-range inorganic negative thermal expansion material and a synthesis method thereof, and requests to protect application of a Mn2V2O7 material as a negative thermal expansion material. The Mn2V2O7 material can be prepared on the basis of a solid-phase reaction method. The negative thermal expansion performance of the Mn2V2O7 material is disclosed for the first time, the negative thermal expansion temperature range is large and is 69-497 DEG C, the negative thermal expansion coefficient reaches-4 * 10 <-6 > DEG C <-1 >, and the Mn2V2O7 material is a wide-temperature-range inorganic negative thermal expansion material. The Mn2V2O7 material does not contain Hf, Dy, Lu, W and other rare metal elements, has a large negative thermal expansion temperature interval, and can be compounded with organic matters, metals, ceramics and the like to adjust the thermal expansion coefficient of the Mn2V2O7 material.

The invention provides a method for applying strain to a semiconductor material and a product. The method mainly comprises the following steps: S1, obtaining a semiconductor material donor and a negative thermal expansion substrate; s2, bonding the semiconductor material donor to the negative thermal expansion substrate at a first temperature; and S3, stripping the first semiconductor layer on the semiconductor material donor from the semiconductor material donor at a third temperature. According to the method for applying the strain to the semiconductor material, the optical and electrical properties of the semiconductor material can be adjusted, and the application range of the semiconductor material is widened.

The invention provides a method for applying stable strain to a semiconductor material and a product. The method mainly comprises the following steps that S1, a semiconductor material donor and a negative thermal expansion substrate are obtained, and the negative thermal expansion substrate has the property of positive thermal expansion or low thermal expansion in a first temperature interval and a third temperature interval and has the property of negative thermal expansion in a second temperature interval between the first temperature interval and the third temperature interval; s2, bonding the semiconductor material donor to the negative thermal expansion substrate at a first temperature in a first temperature interval; s3, stripping the first semiconductor layer on the semiconductor material donor from the semiconductor material donor at a second temperature in the first temperature interval; and S4, enabling the product subjected to the step S3 to work at the temperature of a third temperature interval. According to the method for applying the stable strain to the semiconductor material, the strain stability of the semiconductor material can be kept at the working temperature, and the strain control cost is reduced.

The invention provides an electric heating shock-resistant leading edge and a using method thereof.The electric heating shock-resistant leading edge comprises an outer side skin, a leading edge heating layer, a leading edge inner skin, an energy absorption structure layer, an energy absorption inner skin, ribs and a control module which are sequentially arranged in a stacked mode from outside to inside, the energy absorption structure comprises a Z-shaped body and a supporting body, one end of the supporting body is connected with the end of the Z-shaped body, the other end of the supporting body is connected with a bent portion of the Z-shaped body, the Z-shaped body is connected to the front edge inner skin, the supporting body is made of negative thermal expansion materials, and a probe is arranged at the position, corresponding to the supporting body, of the rib and comprises a pressure sensor and a distance monitor. And the probe and the front edge heating layer are electrically connected to the control module. The electric heating deicing function of bird impact resistance and automatic control of the front edge structure is achieved, the temperature control reliability is improved, the structural weight is reduced, and the technical problems of temperature control, bird impact resistance, structural weight reduction and the like are solved.

A bearing having a bearing surface with a groove, the bearing positioned adjacent to a shaft, the groove facing the shaft, and a negative thermal expansion (NTE) material positioned in the groove, the NTE material at least partially filling the groove.

The invention provides a composite material for forming a stress release layer, a preparation method of the composite material, an integrated co-fired piezoelectric ceramic actuator and a preparation method of the integrated co-fired piezoelectric ceramic actuator. The method for preparing the composite material for forming the stress release layer comprises the following steps: carrying out ball milling treatment on Bi2O3, Fe2O3, Pb3O4 and TiO2 to obtain precursor powder; the precursor powder is subjected to heat treatment, and BiFeO3-PbTiO3 ceramic powder is obtained; and mixing the BiFeO3-PbTiO3 ceramic powder with the inner electrode metal slurry to obtain the composite material. The internal stress of the actuator is effectively regulated and controlled by utilizing the negative thermal expansion characteristic of the BF-PT ceramic. The elasticity of the inner electrode metal ensures the stress slow-release capability of the inner electrode metal and the outer electrode metal serving as a composite material of a stress release layer, and meanwhile, an effective water vapor barrier is constructed due to the high density of the inner electrode metal.

The invention provides a bifunctional interface lithium-rich manganese-based positive electrode material as well as a preparation method and application thereof, and belongs to the technical field of lithium ion battery positive electrode materials. The bifunctional interface lithium-rich manganese-based positive electrode material comprises a lithium-rich manganese-based layered oxide core particle, an inner negative thermal expansion inorganic layer coating the surface of the lithium-rich manganese-based layered oxide core particle, and an outer fast lithium ion conducting layer coating the outer side of the inner negative thermal expansion inorganic layer. Through the synergistic effect of inner and outer coating layers, mechanical regulation and control and chemical / ion regulation and control are simultaneously realized on the particle size. Compared with a scheme which only adopts an inert coating, a single lithium ion conductive coating or a single negative thermal expansion coating, the method has the advantages that the thermal-chemical-mechanical coupling failure problem of a positive electrode / solid electrolyte interface in the all-solid-state battery can be more comprehensively solved, relatively low interface impedance, smaller voltage attenuation and higher cycling stability are realized, the preparation process is simple, and the preparation cost is low. The method is suitable for large-scale production.

A modified lithium iron phosphate, a preparation method therefor and a use thereof. The preparation method comprises the following steps: (1) mixing a zirconium salt, a tungstate and a solvent, to obtain a mixed salt solution, adjusting the pH, then adding lithium iron phosphate and performing a heating reaction; (2) separating a slurry obtained by the heating reaction into a solid and a liquid, and subjecting the obtained solid to a one-step sintering treatment, to obtain a first sintered material; (3) mixing an organic carbon source, a lithium source and the first sintered material, and performing a second sintering treatment, to obtain a modified lithium iron phosphate. A material having a negative thermal expansion effect is used as a coating layer, which is then coated with an electrically conductive material, causing pores to appear during a second coating process due to the negative thermal expansion effect, which is conducive to the embedding of organic matter and improves bonding tightness between the two layers of coatings. The pores generated during the negative thermal expansion process are conducive to the entry of lithium ions, which can better generate lithium tungstate and lithium zirconate from the tungsten oxide and zirconium oxide generated by decomposition.

The invention provides a Mn-Fe-Ni-Si-Cu-based negative thermal expansion material as well as a preparation method and application thereof, and belongs to the technical field of negative thermal expansion materials. The negative thermal expansion temperature range of the Mn-Fe-Ni-Si-Cu-based negative thermal expansion material provided by the invention covers the high-temperature and low-temperature ranges (120K-896K), and the high-temperature and wide-temperature-range negative thermal expansion effect is shown; good mechanical properties are achieved; the material has extremely high thermal and mechanical stability, and has important significance for developing high-temperature precision mechanical devices based on zero expansion. The Mn-Fe-Ni-Si-Cu-based negative thermal expansion material disclosed by the invention is low in raw material cost and simple in preparation method.

The application discloses a SiO2-coated negative thermal expansion film and application thereof, and belongs to the technical field of temperature measurement. 12 :Nd 3+ The precursor solution is calcined to obtain the negative thermal expansion film, and then SiO2 solution is added dropwise on the negative thermal expansion film to obtain the SiO2-coated Yb2W3O 12 :Nd 3+ The SiO2-coated negative thermal expansion film is loaded on the opal template. 12 :Nd 3+ As a matrix, the SiO2 coating does not affect the luminescence of the negative thermal expansion film, and makes the Yb2W3O 12 :Nd 3+ The luminescence of the film in the near infrared is significantly enhanced. In addition, compared with the negative thermal expansion material film without the SiO2 coating, the negative thermal expansion material film is more sensitive to temperature.

The present invention relates to the technical field of lithium-ion batteries, and particularly provides a positive electrode sheet and a preparation method therefor, and a lithium-ion battery comprising the positive electrode sheet. The positive electrode sheet comprises a positive electrode active material layer, and the positive electrode active material layer comprises a positive electrode material, a negative thermal expansion material, a conductive agent, and a binder, wherein the characteristic value J of the positive electrode sheet satisfies: 0.001≤J≤0.005. wherein J=R(F) / ρ, R(F) represents the peak intensity ratio between the main peak (F) of the negative thermal expansion material and the (003) characteristic peak of the positive electrode material in the XRD pattern of the positive electrode sheet, and p represents the surface density of the positive electrode sheet, with a unit of mg / cm2.

The invention relates to the technical field of preparation of magnesia-calcium bricks, and provides a thermal expansion compensation magnesia-calcium brick and a preparation process thereof. The magnesia-calcium brick adopts a three-layer gradient structure design and comprises a porous layer, a transition layer and a compact layer, and negative thermal expansion composite particles, neutral thermal expansion adjusting particles and thermosensitive expansion particles are introduced into the formula of each layer to jointly form a thermal expansion compensation system. The bonding strength between layers is enhanced through a mechanical meshing structure of the dovetail grooves and the dovetail protrusions, and interlayer stripping is effectively avoided. The preparation process comprises the steps of raw material surface modification, layered burdening, mold design and charging, segmented temperature control sintering, coordinated cooling and the like. The problems that a traditional magnesia-calcium brick is not matched in thermal expansion and prone to cracking are effectively solved, the thermal shock resistance and structural stability of a brick body are remarkably improved, and the service life of the brick body is remarkably prolonged.

The application discloses a kind of superhigh temperature self-adaptive insulated cable of composite and preparation method thereof, which uses carbon nanotube fiber bundle as conductor, multiple layer aerogel-ceramic nanofiber composite felt as insulator, stress buffer layer formed by negative thermal expansion coefficient material is arranged between layers, and the outer sheath is chemical vapor infiltration SiC carbon fiber braided sleeve.The cable of the application has the advantages of ultra-light, high thermal stability, self-adaptive sealing and strong thermal shock resistance, and is suitable for extreme high temperature environment above 800 DEG C;The preparation method includes supercritical drying, pre-stretching winding and other key processes, to realize the high performance and reliability of the cable.

The application provides an isometric topology optimization method and device based on thermal elastic metamaterial design, and relates to the field of isometric topology optimization. The method comprises the following steps: constructing a multi-material interpolation model corresponding to the thermal elastic metamaterial, and obtaining a plurality of groups of density distributions corresponding to a plurality of solid materials in the thermal elastic metamaterial design domain according to the multi-material interpolation model, one solid material corresponding to one density distribution; obtaining the relationship interpolation between the plurality of groups of density distributions, and obtaining the elastic modulus and the thermal expansion coefficient according to the relationship interpolation; calculating the equivalent elastic matrix corresponding to the thermal elastic metamaterial according to the elastic modulus, and calculating the thermal expansion coefficient matrix corresponding to the thermal elastic metamaterial according to the thermal expansion coefficient; performing discrete form processing on the calculation equations of the equivalent elastic matrix and the thermal expansion coefficient matrix through the isometric grid, constructing a constraint function according to the equivalent elastic matrix, constructing an objective function according to the thermal expansion coefficient matrix, and calculating the sensitivity information corresponding to the first design variable through the objective function and the constraint function; updating the first design variable according to the sensitivity information until the thermal expansion coefficient meets the convergence condition, and obtaining the second design variable when the convergence condition is met through the isometric topology design model of the negative thermal expansion metamaterial; and optimizing the thermal elastic metamaterial according to the second design variable. The application solves the problem that the finite element method is difficult to guarantee the efficient and high-precision design of the thermal elastic metamaterial when dealing with complex geometric structures.

This invention relates to a glass cover with an outer frame, wherein a flat glass plate is directly joined to the outer frame, wherein the glass matrix within the outer frame comprises at least one of bismuth oxide and boron oxide, and the glass ceramic has a coefficient of thermal expansion of 15 × 10⁻⁶. －7 In the glass ceramics described above, the total volume fraction of the negative thermal expansion filler and the total volume fraction of the filler components are both 40% to 65%, and the softening point of the glass components in the glass matrix is ​​lower than the glass transition point of the flat glass.

The present invention discloses a copper pyrovanadate-based reinforcement for reducing the thermal expansion coefficient of a composite material and a preparation method thereof, and relates to a copper pyrovanadate-based reinforcement and a preparation method thereof. In order to solve the problem that the existing copper pyrovanadate-based reinforcement β-Cu2V2O7 has poor negative thermal expansion performance and does not have zero expansion. The copper pyrovanadate-based reinforcement for reducing the thermal expansion coefficient of a composite material of the present invention is β-Cu 2‑x Ba x V2O7, 0<x≤0.2; β-Cu 2‑x Ba x V2O7 is a zero expansion ceramic. Another copper pyrovanadate-based reinforcement for reducing the thermal expansion coefficient of the composite material of the present invention is β-Cu 2‑x Mn x V2O7, 0<x<2; β-Cu 2‑x Mn x V2O7 is a negative thermal expansion material. The present invention can prepare β-Cu by solid phase sintering. 2‑x Ba x V2O7 solid solution has a simple preparation process, can achieve a large number of products in a single sintering, and no harmful gas release. In order to successfully achieve β-Cu through solid phase sintering combined with rapid cooling 2‑ x Ba x The preparation of V2O7 solid solution provides a simpler and more efficient technical means for its batch synthesis. The prepared samples have significantly improved mechanical properties compared to β-Cu2V2O7 and have the potential to be used independently as structural components.

Provided are: a resin composition with which it is possible to suppress thermal expansion and impart excellent connection reliability when used as an adhesive for connecting; and a production method therefor. The present invention relates to a resin composition including an epoxy resin, a curing agent, conductive particles, and negative thermal expansion particles, wherein the content of the conductive particles is 0.2-40 mass%, the content of the negative thermal expansion particles is 0.5-30 vol%, and the ratio of the average particle size of the negative thermal expansion particles with respect to the average particle size of the conductive particles (average particle size of the negative thermal expansion particles / average particle size of the conductive particles) is 0.001-10.

The invention belongs to the technical field of metal-based composite materials, and particularly relates to a preparation method of a metal-based composite material. The preparation method comprises the following steps: mixing Mn3GaC-coated Ti, iron alloy mixed powder and a binder according to a mass ratio, and mixing to obtain a mixed material; cooling and granulating the mixed material to obtain a granular material; and the granular material is injected into a mold, injection molding is conducted, a formed blank is obtained, degreasing, cooling and sintering are conducted, and the metal-based composite material is obtained. The key problems that in the prior art, a metal-based composite material is poor in forming stability, high in thermal expansion coefficient, short in service life and the like in a high-load state are solved, a powder type negative thermal expansion material is introduced into the prepared metal-based composite material, the thermal expansion coefficient is reduced, meanwhile, the technological process is regulated and controlled, and the production efficiency is improved. And the stability and the reliability of the material are improved.

The invention provides a multilayer composite functional ceramic powder material and a preparation method thereof. The method comprises the following steps: firstly, coating an auxiliary layer on the surface of a substrate, wherein the substrate can support a multilayer composite functional ceramic powder film; depositing a negative thermal expansion material on the surface of the auxiliary layer by using a physical vapor deposition technology to obtain a negative thermal expansion material layer; alternately depositing functional metal oxides on the surface of the negative thermal expansion material layer to obtain a functional metal oxide layer; depositing zirconium oxide on the surface of the functional metal oxide layer to obtain a zirconium oxide layer; and depositing a functional metal oxide layer and a negative expansion material layer on the surface of the zirconium oxide layer in sequence to form a multi-layer composite functional ceramic film layer. And finally, carrying out ball milling and heat treatment on the separated multi-layer composite functional ceramic powder film layer to obtain the multi-layer composite functional ceramic powder. The preparation method is simple in process, short in production period and beneficial to uniform mixing of various powder, and the prepared powder has excellent performance.

The invention belongs to the technical field of thermal switches, and particularly relates to an expansion type thermal switch based on a paper-cut structure, which comprises a thermal expansion paper-cut structure, the thermal expansion paper-cut structure is a central symmetry structure, two ends of the thermal expansion paper-cut structure are fixedly connected through a fixing plate, and the top end of the thermal expansion paper-cut structure is fixedly connected with the bottom end of a fixed heat source; the negative thermal expansion paper-cut structure is of a central symmetry structure, the two ends of the negative thermal expansion paper-cut structure are fixedly connected through a fixing plate, and the bottom end of the negative thermal expansion paper-cut structure is fixedly connected with the top end of the fixed cold source; the thermal expansion paper-cut structure and the negative thermal expansion paper-cut structure are horizontally arranged in parallel, a first gap is reserved between the bottom end of the thermal expansion paper-cut structure and the top end of the fixed cold source, and a second gap is reserved between the top end of the negative thermal expansion paper-cut structure and the bottom end of the fixed heat source. The invention has the advantages of larger thermal stroke, extremely small contact thermal resistance, larger switch ratio and long service life in overheat and overcold space environments.

The invention relates to a three-dimensional heterogeneous integrated interface structure based on hybrid bonding and a stress buffer layer, and belongs to the technical field of semiconductor packaging. The interface structure sequentially comprises a copper-copper bonding layer, a polymer micro bump array, a carbon nanotube vertical interconnection bundle, a bonding interface layer, a stress self-adaptive buffer layer, a topological optimization power grid and a substrate from top to bottom, wherein an embedded coaxial interconnection structure and a graphene electromagnetic isolation wall are arranged in the topological optimization power grid. Wherein the stress self-adaptive buffer layer is formed by manufacturing polymer micro-lattices on the surface of the bonding interface layer, filling the micro-lattices with a mixture of negative thermal expansion ceramic particles and epoxy resin, and embedding shape memory alloy micro-springs. And the chip is bonded with the interface structure through the copper-copper bonding layer. The device has the advantages of being high in interconnection density, good in mechanical reliability and excellent in signal integrity, and high-performance three-dimensional heterogeneous integration can be achieved.

The invention discloses double-component heat-conducting gel with a low expansion coefficient and a preparation method of the double-component heat-conducting gel. A component A of the gel comprises 5-15 parts of vinyl silicone oil, 0.5-3 parts of MQ resin, 0.01-0.05 part of a coloring agent, 5-15 parts of a negative thermal expansion agent, 5-10 parts of small-particle-size aluminum oxide, 20-35 parts of medium-particle-size aluminum oxide, 40-60 parts of large-particle-size aluminum oxide and 0.01-0.05 part of a platinum catalyst; the component B comprises 5-15 parts of vinyl silicone oil, 0.5-3 parts of MQ resin, 0.3-1.5 parts of side hydrogen-containing silicone oil, 0.3-1.5 parts of end hydrogen-containing silicone oil, 5-15 parts of a negative thermal expansion agent, 5-10 parts of small-particle-size aluminum oxide, 20-35 parts of medium-particle-size aluminum oxide and 40-60 parts of large-particle-size aluminum oxide. According to the gel, the silicon resin, the hydrogen-containing silicone oil, the negative thermal expansion agent, the aluminum oxide and other components are reasonably matched, so that the heat-conducting gel with excellent mechanical properties and lower thermal expansion coefficient is obtained.

The invention relates to the technical field of ceramic preparation, in particular to a preparation method of low-expansion heat-resistant purple sand ceramic. Comprising the following steps: preparing lithium-doped pseudo-boehmite composite powder; preparing oxygen vacancy enhanced negative expansion powder; compounding the ceramic raw materials; and firing the ceramic. A (NH4) H2PO4 solution, an H42N10O42W12. XH2O solution, a C10H14NiO4 solution and a ZrOCl28H2O solution are prepared and subjected to a compound hydrothermal reaction, a product is ground and calcined to prepare a material which is rich in oxygen vacancies and has negative thermal expansion, the material is introduced into a ceramic material to be sintered, and the negative thermal expansion performance of the ceramic material is improved by utilizing the characteristics of thermal shrinkage and cold expansion of the material. The negative expansion material is doped with Ni and can offset the thermal expansion and cold contraction characteristics of other positive expansion materials in the ceramic material, so that the thermal expansion coefficient of the subsequently prepared purple sand ceramic is reduced, high-concentration oxygen vacancies can be formed in the negative expansion material through Ni doping, and the negative expansion capacity of the negative expansion material is further improved. The thermal expansion coefficient of the purple sand ceramic can be further reduced.