Micro-channel heat dissipation structure, manufacturing method and electronic device

Abstract

The invention provides a micro-channel heat dissipation structure. The structure comprises at least two heat dissipation units which are stacked in sequence; each heat dissipation unit is provided with a heat dissipation channel; at least one inlet and at least one outlet, communicating with the heat dissipation channels, are formed in the heat dissipation units in contact with a chip; at least two circulation channels are formed in the other heat dissipation units, so that the heat dissipation channels in the adjacent heat dissipation units are connected; the structure also comprises negativethermal expansion bodies; each circulation channel is filled with the corresponding negative thermal expansion body; and the negative thermal expansion bodies are used for connecting or disconnectingthe heat dissipation channels of the adjacent heat dissipation units. The conduction or non-conduction of the adjacent heat dissipation units is controlled by the expansion or contraction of the negative thermal expansion bodies. Thus, the effective heat conduction coefficient of the heat dissipation structure can be improved on the whole, and the heat dissipation requirements of a high-power chip are met. The invention further provides a manufacturing method of the micro-channel heat dissipation structure and an electronic device with the micro-channel heat dissipation structure.

Description

technical field [0001] The invention relates to the field of microelectronic chips, in particular to a microfluidic cooling mechanism, a manufacturing method and an electronic device. Background technique [0002] Now electronic equipment is rapidly developing towards high integration, high assembly density, and high operating speed. As the core of electronic equipment, electronic chips are constantly shrinking due to their integration, packaging density, and operating clock frequency. , the calorific value per unit area of ​​electronic chips continues to increase, especially for high-power electronic equipment. The continuous increase of heat generation per unit area of ​​electronic chips can easily cause a sharp rise in the temperature of the junction region, and the high temperature of the junction region will have an adverse effect on the performance of electronic chips and electronic equipment. According to statistics, 55% of electronic equipment failures are caused by...

AI Technical Summary

Problems solved by technology

[0004] However, the existing microfluidic channel heat dissipation structure is mainly suitable for electronic chips with a heating power density below 1000 W / cm2, which cannot meet the heat dissipation requirements of high-power electronic chips.

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