266results about How to "High heat flux" patented technology

A heat transfer loop system includes a primary passive two-phase flow segment with an evaporator, a condenser and a liquid reservoir, and a secondary actively pumped liquid flow segment in which the liquid in the reservoir is drawn by a liquid pump into the evaporator, where a portion of the liquid is vaporized by the heat input and moves into the primary segment while the excess liquid is pumped back to the reservoir. The evaporator consists of a porous wick and one or more liquid arteries encased in the porous wick. The liquid arteries have porous walls to allow liquid phase working fluid to flow into the surrounding porous wick. The liquid arteries have porous walls to allow liquid phase working fluid to flow into the surrounding porous wick. The excess liquid continues to move through the arteries and eventually out of the evaporator and into the reservoir. The porous wick provides sufficient capillary force to separate the liquid inside the arteries and the vapor in the evaporator.

A microchannel cooler containing a slurry having a particulate liquid / solid phase change material is provided balancing the interdependent factors of microencapsulated particle size with microchannel size and shape and flow conditions for the removal of high heat flux with low space and low power requirements.

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for control including venting or recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. A gas permeable membrane removes and vents electrolytic gasses generated within the fluid chamber of the electroosmotic pump to ambient. A catalyst can be used to recombine electrolytic gases to form a vapor product that can be vented or condensed into a liquid state. An osmotic membrane provides for re-entry of condensed fluid to the fluid chamber.

Integrated Combustion Reactors (ICRS) and methods of making ICRs are described in which combustion chambers (or channels) are in direct thermal contact to reaction chambers for an endothermic reaction. Particular reactor designs are also described. Processes of conducting reactions in integrated combustion reactors are described and results presented. Some of these processes are characterized by unexpected and superior results, and / or results that can not be achieved with any prior art devices.

The invention discloses a heat pipe semiconductor refrigeration cool storage system which comprises a semiconductor refrigeration system and a heat pipe cool storage system; the heat end of a semiconductor refrigeration block in the semiconductor refrigeration system is tightly contacted with a first metal heat radiation block, the cold end of the semiconductor refrigeration block is tightly contacted with a second metal heat radiation block; a refrigeration heat radiation fin used for heat radiation of the heat end is arranged on the first metal heat radiation block; a condensation section of a heat pipe in the heat pipe cool storage system is arranged in the second metal heat radiation block, an evaporation section of the heat pipe is arranged in a cool storage device; phase change cool storage material used for storing cool energy is filled in the cool storage device, and a cool storage heat radiation fin used for transferring the cool energy in the cool storage device is arranged at the outside of the cool storage device. The heat pipe semiconductor refrigeration cool storage system of the invention utilizes the heat pipe to transfer the cool energy into the cool storage device in a box from the cold end of the semiconductor refrigeration block, the cool energy is great, the stored cool energy can be released according to the needs, and the residual cool energy is stored for standby, thereby being applicable to vaccine transportation, field operation and other long-term uses.

A method of thermocompressive bonding of one or more electrical devices using individual heating elements and a resilient member to force the individual heating elements into compressive engagement with the electrical devices is provided. The individual heating elements may be Curie-point heating elements or conventional resistive heating elements. A method of thermocompressive bonding of one or more electrical devices using a transparent flexible platen and thermal radiation is also provided. In one embodiment, the thermal radiation is near infra-red thermal radiation and the transparent flexible platen is composed of silicone rubber. The bonding material may be an adhesive or a thermoplastic bonding material. A method of capacitively coupling a semiconductor chip to an electrical component with a pressure sensitive adhesive is also provided. The method includes compressing the chip by forcing a flexible platen of a bonding device into compressive engagement with the semiconductor chip.

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long,-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and / or components. Total cooling power can be increased by employing multiple thermoelectric elements. Indeed, by employing modern semiconductor technologies, including e.g., thin-film technologies, thermoelectric elements may be cost-effectively employed and configured in large arrays.

An improved dry heat method and apparatus for thawing frozen biological fluids utilizing electrically heated plates and oscillatory motion to enhance heat transfer by mixing as the fluid thaws. Bags of frozen fluid to be thawed are lightly squeezed between two heating plates, one of which is gently oscillated to facilitate mixing of the thawing fluid, increasing heat transfer and reducing time required for thawing. Direct contact of the heating plates against the bag surfaces increases heat transfer by eliminating insulative effects of another bag wall and a water boundary layer, compared to water bath units. Flat (or curved to conform to bag) heat pipes are preferred as heating plates compared to plain aluminum sheet. Flat heat pipes have the property of an isothermal heating surface, thus maximizing heat transfer to the coldest areas, preventing hot spots, and simplifying heating plate temperature control.

A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and direct contact cooling liquid of the heat-generating portion of the CPU. A direct contact cooling liquid embedded packaged CPU removes higher levels of heat directly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inlet and outletting cooling liquid into and out of the CPU package.

The invention discloses a cooling system and method of an airborne heating element based on air expansion refrigeration, and belongs to the field of airborne equipment cooling. The cooling system comprises a high heat-flow heating element spray cooling circulation subsystem, an air expansion refrigeration circulation subsystem and a regenerator (7), wherein the high heat-flow heating element spray cooling circulation subsystem comprises a buffer tank (8), a circulation pump (9), a filter (10), a flow regulating valve (11), a spray chamber (14) and a bypass valve (15); the air expansion refrigeration circulation subsystem comprises a primary heat exchanger (2), a secondary heat exchanger (4), a water separator (5), a turbine (6) and a fan (16). The system can achieve rapid cooling of high heat-flow heating element, and achieve the purpose of circulation cooling for multiple times through the regenerator; an intermediate regenerator structure makes full use of the characteristics of large working time intervals of the heating element and large phase change latent heat of phase change materials, greatly reduces the volume of system equipment, and meets the requirements of airborne equipment.

A novel architecture of high-power four-quadrant hybrid power modules based on high-current trench gate IGBTs and arrays of low-current wide-bandgap diodes is conceived. The distributed physical layout of high power density wide-bandgap devices improves the cooling inside a fully-sealed module case, thus avoiding excessive internal heat flux build up and high PN junction temperature, and benefiting the converter's reliability and efficiency. The design of multiple-in-one hybrid integrated AC-switch module at high power ratings is enabled by using hybrid AC switch cells and aluminum nitride substrate structure.

A planar heat pipe for transferring heat between a higher temperature region and a lower temperature region includes a bottom facesheet, a top facesheet, a vapor-venting arterial wick between the bottom facesheet and the top facesheet and including a high permeability layer and a high capillary pressure layer each having pores such that an average pore hydraulic diameter in the high permeability layer is greater than an average pore diameter in the high capillary pressure layer. The pipe also includes an architected mechanical core structure between the arterial wick and the top facesheet, and a working fluid between the bottom facesheet and the top facesheet. The architected mechanical core structure may have a vapor region, and the vapor-venting arterial wick may have a liquid region.

The invention discloses a heat pipe ground-source heat pump system which comprises a ground heat pump unit and an underground heat pipe; an inlet of a compressor in the ground heat pump unit is connected with an outlet of an evaporator, the outlet of the compressor is connected with the inlet of a water-cooled condenser, the outlet of the water-cooled condenser is connected with the inlet of a liquid storage device, the outlet of the liquid storage device is connected with an electromagnetic valve, the inlet of a throttle valve is connected with the outlet of the electromagnetic valve, and the outlet of the throttle valve is connected with the inlet of the evaporator. The underground heat pipe is composed of a group of heat pipes, the group of the heat pipes are vertically arranged in an underground hole, and the upper parts of the group of the heat pipes are connected with the evaporator. Heat pipe media are filled in the group of the heat pipes. The heat pipe ground-source heat pump system of the invention does not need a circulating pump, thereby saving power consumption; working media adopted in the heat pipes can not corrode the underground heat pipe, so the heat pipes can be used for a long time; the underground heat pipe is short, and the flow resistance of a secondary refrigerant is small; as the gas-liquid phase change heat exchange is occurred in the heat pipes, the heat flux density is high.

The invention provides a pulsating heat pipe heat-expanding plate and a manufacturing method thereof. The pulsating heat pipe heat-expanding plate (1) is manufactured by the following steps: processing a plurality of parallel capillary groove channels (7) on a base plate (9) and cutting a slit (8) between the adjacent capillary groove channels (7); welding an upper cover plate (6) on the surface,with the capillary groove channels (7) and the slits (8), of the base plate (9); welding front plugs (11 and 11') and rear plugs (12 and 12') on the two end faces of the base plate (9) so as to form a pipe shell of a pulsating heat pipe (2), wherein communicating loops (11-1 and 11'-1) and liquid charging pipes (3) are arranged on the front plugs (11 and 11'); and cleaning, detecting leakage and charging medium into the pipe shell, and sealing. The pulsating heat pipe heat-expanding plate is a high-efficiency heat-conducting component, has a simple structure, is easy to process, and increasesthe heat exchange quantity by the characteristics of the pulsating heat pipe and a microsized enhanced heat exchange method, so that the electronic devices have a reliable work performance and the pulsating heat pipe heat-expanding plate can be widely applied to the fields of cooling of the electronic devices.

The invention discloses a cooling system and method of airborne heating elements based on evaporative refrigeration, and belongs to the field of cooling airborne equipment. The cooling system comprises a spray cooling cycle subsystem of high heat-flow heating elements, an evaporative refrigeration cycle subsystem, and a cold accumulator (5) for connecting the spray cooling cycle subsystem and the evaporative refrigeration cycle subsystem, wherein the spray cooling cycle subsystem of high heat-flow heating elements comprises a buffer tank (6), a circulating pump (7), a filter (8), a flow regulating valve (9), a spray cavity (12) and a bypass valve (13); the evaporative refrigeration cycle subsystem comprises a condenser (1), a heat regenerator (3), an expansion valve (4) and a compressor (14). Through adoption of the cooling system, the rapid heat dissipation of the high heat-flow heating elements can be realized, and the purpose of repeated circular heat dissipation is achieved through the cold accumulator; besides, the cold accumulator is arranged in the middle, the working time intervals of the heating elements and the characteristic of high latent heat of phase-change materials are fully utilized, so that the volume of the equipment of the system is greatly reduced, and the requirements of airborne equipment are satisfied.

The invention relates to a novel microelectronic device radiator which comprises a planar heat pipe being two or more through hole array flat plate structures arranged side by side and formed by extrusion or punching of metal materials and the equivalent diameters of through holes range from 0.2mm to 6mm. The through holes are filled with liquid working substance and two ends of the planar heat pipe are encapsulated in a sealing manner; an evaporation section of the planar heat pipe is in surface contact with a heating surface of a microelectronic device and a condensation section of the planar heat pipe eliminates heat through a heat elimination component. The novel microelectronic device radiator overcomes the defects of small contact area between the current round heat pipe and the heating surface of the microelectronic device, large equivalent resistance of heat conduction and complex manufacture technology, and has the advantages of high heat elimination efficiency and simple technology.

The invention relates to a novel LED and a high-power radiator of a radiating element, comprising flat plate heat pipes which are of two or more via-hole array flat plate structures arranged side by side; the via-hole array flat plate structures are formed by carrying out extrusion or punch forming on metal materials; the equivalent diameter of the via hole is 0.5-3mm; the via hole is filled with liquid propellant and both ends of the flat plate heat pipes are packaged by sealing; an evaporation section of the flat plate heat pipe contacts heating surfaces of the LED and the high-power radiating element and a condensation section thereof radiates through the radiating element. The novel LED and the high-power radiator of a radiating element overcome the disadvantages that the contact area of the existing circular heat pipes and the heating surfaces of the LED and the high-power radiating element is small, the equivalent resistance of heat conduction is large and the manufacturing process is complex, which have the advantages of high radiating efficiency and simple process.

The invention discloses a working medium contact cooling system of power batteries. An insulating liquid heat-conducting working medium is contained in a working medium box; a working medium pump sinks into the insulating liquid heat-conducting working medium; a filter is arranged at an inlet of the working medium pump; the working medium pump is connected with a spray main pipe; a plurality of spray branch pipes are connected with the spray main pipe in parallel; each spray branch pipe is provided with a plurality of nozzles; the nozzles are opposite to a high-power battery pack; the spray branch pipes and the spray main pipe form a cage frame; the high-power battery pack is placed in the cage frame; the spray branch pipes are distributed on the side surfaces and the upper part of the high-power battery pack to form a relatively open spray structure; and the insulating liquid heat-conducting working medium is a nonpolar substance and is free of a phase change in the spray process. The invention further provides a working method of the working medium contact cooling system of the power batteries. According to the working medium contact cooling system, the cooling structure is reasonable and the cooling efficiency is high.

A heat sink includes a heat conducting substrate and a plurality of directive heat elements disposed within the substrate such that a first end of each of the plurality directive heat elements are adapted to be disposed proximate a heat generating device and a second end of each of the plurality of directive heat elements are spaced apart within the substrate to promote the transfer to heat from the heat generating device through the directive elements to an area of the heat conducting substrate which is larger than the area of the heat generating device. In this way, the heat sink transforms a high heat flux density existing at one end of the directive heat elements proximate a device being cooled to a low heat flux density at an opposite end of the directive heat elements.

A temperature control type loop heat pipe evaporator assembly comprises a heat compensator, N evaporation units and a connecting pipeline, wherein the N is a positive integer bigger than or equal to 1; the heat compensator is arranged in the input end so as to heat up the liquid working medium in the loop heat pipe into gas-liquid two-phase state; the N evaporation units are connected by the connecting pipeline so as to form an evaporation network; the input end of the evaporation network is connected with the output end of the heat compensator through the connecting pipeline; the output end of the evaporation network serves as the output end of the evaporator assembly. The evaporator assembly can ensure the working medium entering each evaporation unit in the loop heat pipe operation to be two-phase working medium, thus ensuring constant and consistent temperature of the heat source in working / non working state, and accurately controlling the temperature in the complete cycle.

The invention provides continuous casting mold fluxes specific for production of medium-high carbon steel and alloy steel. The mold fluxes are applicable to the production of the medium-high carbon steel and the alloy steel with a carbon content ranging from 0.26 to 1.0 weight percent by a thin slab continuous casting machine. The mold fluxes mainly comprise the following components in weight percentage: 23.0 to 31.0 percent of SiO2, 22.0 to 29.0 percent of CaO, 4.0 to 6.0 percent of MgO, 2.5 to 4.5 percent of Al2O3, less than or equal to 1.3 percent of Fe2O3, less than or equal to 1.0 percent of MnO2, 10.0 to 13.0 percent of Na2O, 8.7 to 12.0 percent of F and 7.0 to 10.0 percent of C. The mold fluxes of the invention have relatively low crystallization and softening temperatures, so when the medium-high carbon steel and the alloy steel with a relatively low liquidus temperature are poured, the lubrication of a non-Newtonian fluid and the probability of surface cracking caused by the inhomogeneous heat dissipation of a casting slab due to the crystallization are greatly reduced in a relatively low crystallization and softening temperature range.