46results about How to "Large amount of heat" patented technology

A cooling array including a housing accommodating electrical built-in components and an air conditioning device that is connected to a heat source of the electrical built-in components by a coolant-carrying inlet line and a return line. To simply air-condition complex systems having a plurality of electrical built-in components, several device inlet lines come out from the inlet line and device return lines come out from the return line and each electrical built-in component is assigned at least one device inlet line and at least one device return line.

A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises a thick thermally conductive plane (e.g., copper plane) mounted on a thin support substrate and interfaced with a die. Thermally conductive via interconnects extending through the substrate conduct heat generated by the die from the conductive plane to conductive balls mounted on traces on the opposing side of the substrate. In another embodiment, the semiconductor devices comprises a thick thermally conductive plane (e.g., copper foil) sandwiched between insulative layers, with signal planes (e.g., traces, bonding pads) disposed on the insulative layers, a die mounted on a first signal plane, and solder balls mounted on bonding pads of a second signal plane. A thermally conductive via interconnect extends through the substrate to provide a thermal path from the die and signal plane (traces) through the thick conductive plane and into the solder balls and external device (e.g., mother board). The present semiconductor device provides effective heat dissipation without the attachment of an external heat sink or spreader.

We have found a novel spray-on adhesive composition made from components including a high melt index polymer and a high melt tackifier that interact to produce a composition that can form a low odor, light color, non-tacky, hot melt adhesive material that can be used in disposable article manufacture. The adhesive is thermally stable at hot melt application conditions, is low in cost, is easily applied and produces high quality disposable articles.

A thermal management system for a vehicle includes a cooling device which includes a radiator, electrical components, and at least one water pump which are connected through a coolant line, to circulate a coolant through the coolant line to supply the coolant to the electrical components and an oil cooler which is mounted on the coolant line and connected to a drive motor to cool the drive motor; and an HVAC module which has a heater connected to the coolant line through first and second connection lines to supply the coolant with a temperature which is increased as the coolant passes through the electrical components and the oil cooler in a heating mode of a vehicle.

We have found a novel spray-on adhesive composition made from components including a high melt index polymer and a high melt tackifier that interact to produce a composition that can form a low odor, light color, non-tacky, hot melt adhesive material that can be used in disposable article manufacture. The adhesive is thermally stable at hot melt application conditions, is low in cost, is easily applied and produces high quality disposable articles.