Novel microelectronic device radiator

Abstract

The invention relates to a novel microelectronic device radiator which comprises a planar heat pipe being two or more through hole array flat plate structures arranged side by side and formed by extrusion or punching of metal materials and the equivalent diameters of through holes range from 0.2mm to 6mm. The through holes are filled with liquid working substance and two ends of the planar heat pipe are encapsulated in a sealing manner; an evaporation section of the planar heat pipe is in surface contact with a heating surface of a microelectronic device and a condensation section of the planar heat pipe eliminates heat through a heat elimination component. The novel microelectronic device radiator overcomes the defects of small contact area between the current round heat pipe and the heating surface of the microelectronic device, large equivalent resistance of heat conduction and complex manufacture technology, and has the advantages of high heat elimination efficiency and simple technology.

Description

technical field [0001] The invention relates to a heat dissipation technology for microelectronic devices, in particular to a heat sink formed by flat heat pipes for heat dissipation of microelectronic devices. Background technique [0002] With the rapid development of microelectronic technology, the calorific value and heat flux density of microelectronic chips have increased significantly, and the layout and design of heat dissipation devices have encountered more and more constraints. Traditional heat dissipation methods such as air cooling make it form forced convection, and its cooling efficiency is proportional to the speed of the fan. When the heat flux density reaches a certain value, this cooling method cannot achieve the desired cooling effect. The cooling effect of water-cooling technology is outstanding, but the structure of the water-cooling system is very complicated, and there are requirements for the capacity of the bucket, and the water-cooling technology i...

AI Technical Summary

Problems solved by technology

Traditional heat dissipation methods such as air cooling make it form forced convection, and its cooling efficiency is proportional to the speed of the fan. When the heat flux density reaches a certain value, this cooling method cannot achieve the desired cooling effect

The cooling effect of water-cooling technology is outstanding, but the structure of the water-cooling system is very complicated, and there are requirements for the capacity of the bucket, and the water-cooling technology itself has potential safety hazards. Once the water-cooling system leaks, it will cause damage to microelectronic devices.

The method of cooling microelectronic devices such as CPUs by using phase-change heat technology also has certain applications, especially the heat pipe technology. The contact area between the heat pipe and the heating surface of the microelectronic device is very small, resulting in a large equivalent thermal resistance, which greatly limits the application

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