Novel microelectronic device radiator

A technology for microelectronic devices and heat sinks, applied in the field of heat dissipation of microelectronic devices, can solve the problems of large equivalent thermal resistance, small contact area of ​​heating surfaces, damage to microelectronic devices, etc. Small area and the effect of enhancing heat transfer capacity

Active Publication Date: 2009-08-19
GUANGWEI HETONG ENERGY TECH BEIJING CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Traditional heat dissipation methods such as air cooling make it form forced convection, and its cooling efficiency is proportional to the speed of the fan. When the heat flux density reaches a certain value, this cooling method cannot achieve the desired cooling effect
The cooling effect of water-cooling technology is outstanding, but the structure of the water-cooling system is very complicated, and there are requirements for the capacity of the bucket, and the water-cooling technol

Method used

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Embodiment Construction

[0027] The present invention will be described below in conjunction with the accompanying drawings.

[0028] figure 1 It is a structural schematic diagram of the first preferred embodiment of the novel microelectronic device heat sink of the present invention. The novel microelectronic device heat sink includes a flat heat pipe 1, and the flat heat pipe is formed by extruding or stamping two or more metal materials. The through-hole array plate structure arranged side by side, considering the heat dissipation characteristics of the heating surface of the microelectronic device, the structural characteristics of the microelectronic device installation, and the influence of working environment factors, the equivalent diameter of the through hole of a specific size is set, such as a notebook computer The internal installation space is narrow, and the computer body is required to be relatively thin, while the installation space of the desktop computer is relatively large. The work...

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Abstract

The invention relates to a novel microelectronic device radiator which comprises a planar heat pipe being two or more through hole array flat plate structures arranged side by side and formed by extrusion or punching of metal materials and the equivalent diameters of through holes range from 0.2mm to 6mm. The through holes are filled with liquid working substance and two ends of the planar heat pipe are encapsulated in a sealing manner; an evaporation section of the planar heat pipe is in surface contact with a heating surface of a microelectronic device and a condensation section of the planar heat pipe eliminates heat through a heat elimination component. The novel microelectronic device radiator overcomes the defects of small contact area between the current round heat pipe and the heating surface of the microelectronic device, large equivalent resistance of heat conduction and complex manufacture technology, and has the advantages of high heat elimination efficiency and simple technology.

Description

technical field [0001] The invention relates to a heat dissipation technology for microelectronic devices, in particular to a heat sink formed by flat heat pipes for heat dissipation of microelectronic devices. Background technique [0002] With the rapid development of microelectronic technology, the calorific value and heat flux density of microelectronic chips have increased significantly, and the layout and design of heat dissipation devices have encountered more and more constraints. Traditional heat dissipation methods such as air cooling make it form forced convection, and its cooling efficiency is proportional to the speed of the fan. When the heat flux density reaches a certain value, this cooling method cannot achieve the desired cooling effect. The cooling effect of water-cooling technology is outstanding, but the structure of the water-cooling system is very complicated, and there are requirements for the capacity of the bucket, and the water-cooling technology i...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/367
Inventor 赵耀华刁彦华张楷荣
Owner GUANGWEI HETONG ENERGY TECH BEIJING CO LTD
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