44results about How to "Eliminate thermal resistance" patented technology

An improved dry heat method and apparatus for thawing frozen biological fluids utilizing electrically heated plates and oscillatory motion to enhance heat transfer by mixing as the fluid thaws. Bags of frozen fluid to be thawed are lightly squeezed between two heating plates, one of which is gently oscillated to facilitate mixing of the thawing fluid, increasing heat transfer and reducing time required for thawing. Direct contact of the heating plates against the bag surfaces increases heat transfer by eliminating insulative effects of another bag wall and a water boundary layer, compared to water bath units. Flat (or curved to conform to bag) heat pipes are preferred as heating plates compared to plain aluminum sheet. Flat heat pipes have the property of an isothermal heating surface, thus maximizing heat transfer to the coldest areas, preventing hot spots, and simplifying heating plate temperature control.

A technology for casting the steel-based cooling wall features that the cooling medium which is the mixture of corundum powder, iron powder and electrode powder is filled in its cooling pipeline. Said cooling medium features strong cooling action, low thermal expansibility, not adhering to pipe wall, and easy removing it.

The invention discloses a hydroenergy vaporization ice-making device which comprises an ice crystal generator, an ice water pump and an ice crystal pump, wherein an ice water nozzles, vaporization nozzles and a water baffle grid are arranged inside the ice crystal generator; the ice water nozzles are arranged at the lower part of the ice crystal generator; the vaporization nozzles are arranged at the upper part of the ice crystal generator; an exhaust opening is further formed in the ice crystal generator and is used for exhausting vapor generated after the water inside the ice crystal generator is vaporized; the absolute pressure inside the vaporization is 611 Pa; the ice water pump is respectively connected with the lower part of the ice crystal generator, the ice water nozzles and the vaporization nozzles, and is used for pumping ice water into the ice crystal generator; the ice crystal pump is connected with the ice crystal generator and is used for sucking out a mixture of ice crystals and water generated in the ice crystal generator. The invention further provides a control method of the hydroenergy vaporization ice-making device. By the adoption of the device, not only is the ice blocking phenomenon avoided, but also the phenomenon of thermal resistance of ice layers is eliminated.

The invention relates to a lamp, in particular to an LED lamp with an efficient heat dissipation function. The LED lamp comprises a shell, a light guide module and a light-emitting module; the light guide module and the light-emitting module are fixedly arranged in the shell and are both with heat dissipation structures; the light guide module comprises a first sapphire substrate and a reflecting layer, and the light-emitting module comprises a second sapphire substrate, a light filtering layer, a metal conducting layer, a light-emitting module group and a transmission enhanced layer. The sapphire printed circuit board LED lamp and the manufacture method thereof have the advantages that a sapphire printed circuit board LED lamp with the efficient heat dissipation function, die bond, wire bonding and dispensing are conducted on the sapphire printed circuit board directly through arranging the heat dissipation structures on the sapphire printed circuit board, and the manufacture of the LED light-emitting module is achieved, so that thermal resistance generated from cemedin which is used in traditional printed circuit boards is eliminated, and heat dissipation efficiency is improved; light filtering layer is arranged on the printed circuit board, so that luminous flux of the light-emitting module group is guaranteed, light leak is prevented, and the light is kept in a highlighting mode; the structure is simple, and the cost is low.

A circulating preheater with single cavity permanent magnet rotor ( PMR ) pump is featured as preparing cavity body rotor and cavity shell by plastic injection molding for setting then in one body or one body connected structure ; setting outlet , front head opening , electro thermal tube ( ET ) opening at bottom and separated stator slot on cavity body ; installing PMR , front hearing and impeller in rotor or heating cavity from front head opening ; installing ET spiral portion in heating cavity from its own opening ; filling and sealing stator in stator slot ; setting temperature sensing component on external side surface of ET fixture disc and setting junction box below ET fixture disc and stator slot . The ET should be installed first when assembling operation is carried out.

A cooling and heating cup holder includes a holder body having a container shape, formed of a thermally conductive material, having a substantially uniform thickness, and having a contact portion pressed from an inner side to integrally protrude outward from one side surface thereof and having a contact surface forming a predetermined plane; a Peltier element including an operation surface and a heat radiating portion having an opposite row opposite to the operation surface and installed such that the operation surface is directly attached to the contact surface at an outer side of the holder body to transfer heat to the contact surface; and an air conditioner including a heat radiating duct in which the heat radiating portion of the Peltier element is buried and a blowing fan for blowing out air at one side of the heat radiating duct.

The invention belongs to the technical field of precision casting of directional solidification column crystal or single crystal test bars, and relates to a fired mold precision casting method for improving solidification heat dissipation conditions of a directional solidification casting. In the directional column crystal or single crystal test bar manufacturing process, selected mold shell materials are the same as universal mold shell materials. The shape of a mold shell is changed, the equal-distance variable cross section is increased, and a plurality of equal-distance rectangular grooves are formed. When the directional solidification test bars and the mold shell move to the position below a heat insulation plate together, mechanical expansion rings arranged in a directional solidification furnace are inlaid in the equal-distance rectangular grooves of the mold shell; the mechanical expansion rings expand downwards to remove the part, below the grooves, of the mold shell; the lower end of the directional solidification casting is in direct contact with cooling media, so that the heat exchange conditions of the directional solidification test bars and the cooling media are improved; and therefore, the cooling speed of the directional solidification casting and the temperature gradient of a solid-liquid interface are greatly improved, the dendritic crystal structure of the directional solidification casting is refined, dendritic segregation is reduced, and the mechanical property of the casting is remarkably improved.

The present invention concerns a LED (L) lighting device (D) with integrated heatising (2), comprising: a printed circuit (C) of the PCB ( Printed Circuit Board) or MCPCB (Metal Core Printed Circuit Board) type, arranged for electrically and mechanically supporting a LED (L) matrix, forming the light source of said device (D); a heatsink (2) that may be associated in construction to said printed circuit (C), comprising a plurality of cooling fins (3, 8, 13, 14), characterized in that said cooling fins (3, 8, 13, 14) are arranged for being placed into direct contact with said LEDs (L) and each single cooling fin (3, 8, 13, 14) is arranged for dissipating only the heat produced by the specific LEDs (L) applied thereon.; Heatsink (2) comprises cooling fins (3) with a cylindrical shape, (8) with lamellar structure or with prismatic shape with square bases (13) or rectangular bases (14) or with other regular shape, provided with ends (4) arranged for allowing the application of LEDs (L) and made out of high thermally conductive metals or out of composite alloys.

The invention discloses a chip packaging structure and a chip packaging method for reducing interface thermal resistance to improve the heat dissipation performance of a chip. The chip packaging structure comprises a carrier board, a chip, a thermal conductive insulating layer coating the chip and a heat dissipating component, wherein the thermal conductive insulating layer and the heat dissipating component are integrally formed. The applicant accidentally discovers during an experiment that heat dissipation members such as a traditional first-level packaging structure, a heat sink and a heatbalancing plate can be integrally formed into a whole body by 3D printing so as to eliminate the interfaces of various original parts and correspondingly eliminate the interface thermal resistance, thereby improving the heat dissipation efficiency of the chip packaging structure.

The gradient coil assembly is designed to address a neck-shoulder clearance problem by configuring the coil holder housing with a cylindrical portion modified with a slanted surface and positioning current return elements of the coil pattern at the slanted surface, while positioning the active electrical elements on the cylindrical surface, thus eliminating influence of an undesired magnetic field generated by the current return elements, shortening the coil, and moving the homogeneous field gradient region toward the end of the cylindrical portion of the bore in the coil holder housing. The subject assembly operation is further improved by the direct external cooling approach, where a coolant flows in direct contact with electrical wires of the gradient coil inside the cooling channels in the surface of the coil holder housing.

The invention discloses a rapid water sample heater. The rapid water sample heater is composed of a heat exchange tube 1 attached to the surfaces of heat sources 2 or clamped between the two heat sources, a heat conducting medium 3 filling all gaps between the heat exchange tube and the heat sources, and a temperature sensor 4, and the rapid water sample heater is characterized in that the heat conducting medium between the heat exchange tube and the heat sources uses tin-based alloy, and known heat conducting oil, or a metal aluminum casting method in which "thermal resistance" may exist is replaced.

The invention provides a power module packaging structure and a manufacturing method thereof. The power module packaging structure comprises: at least one power chip; a packaging shell provided with acavity for accommodating a insulating cooling liquid and the power chip; and a cooling liquid inlet and a cooling liquid outlet which are formed in the packaging shell and are communicated with the cavity. The power chip is fixedly supported above the bottom wall of the cavity through a lower surface metal column located on the lower surface of the power chip, and the power chip is electrically connected with an external circuit through the lower surface metal column. By means of the packaging structure, the power chip can be directly and completely immersed in the insulating cooling liquid,heat can be dissipated on all surfaces of the power chip, heat dissipation paths are increased, and the heat dissipation problem of the high-density power module is solved.

The invention relates to the technical field of thermoelectric assemblies, and provides a thermoelectric device and cooling fin integrated thermoelectric assembly, which comprises a first ceramic substrate, a second ceramic substrate and thermoelectric material crystal grains, a first flow deflector is welded on the first ceramic substrate, a second flow deflector is welded on the second ceramic substrate, one end of the thermoelectric material crystal grain is welded on the first flow deflector, and the other end of the thermoelectric material crystal grain is welded on the second flow deflector; at least one of the first ceramic substrate and the second ceramic substrate is a ceramic substrate with fins, and the ceramic substrate with the fins comprises a ceramic base and radiating fins which are integrally formed. The conversion efficiency of the thermoelectric assembly can be improved, the production cost of the thermoelectric assembly is reduced, and the production efficiency of the thermoelectric assembly is improved.