Sapphire printed circuit board LED lamp and manufacture method thereof

Abstract

The invention relates to a lamp, in particular to an LED lamp with an efficient heat dissipation function. The LED lamp comprises a shell, a light guide module and a light-emitting module; the light guide module and the light-emitting module are fixedly arranged in the shell and are both with heat dissipation structures; the light guide module comprises a first sapphire substrate and a reflecting layer, and the light-emitting module comprises a second sapphire substrate, a light filtering layer, a metal conducting layer, a light-emitting module group and a transmission enhanced layer. The sapphire printed circuit board LED lamp and the manufacture method thereof have the advantages that a sapphire printed circuit board LED lamp with the efficient heat dissipation function, die bond, wire bonding and dispensing are conducted on the sapphire printed circuit board directly through arranging the heat dissipation structures on the sapphire printed circuit board, and the manufacture of the LED light-emitting module is achieved, so that thermal resistance generated from cemedin which is used in traditional printed circuit boards is eliminated, and heat dissipation efficiency is improved; light filtering layer is arranged on the printed circuit board, so that luminous flux of the light-emitting module group is guaranteed, light leak is prevented, and the light is kept in a highlighting mode; the structure is simple, and the cost is low.

Description

technical field [0001] The invention relates to a lamp, in particular to a sapphire printed circuit board LED lamp with strong heat dissipation and high brightness and a preparation method thereof. Background technique [0002] With the continuous development of society, due to the advantages of long working life, low energy consumption, small size, and stable light, LED lamps have been widely used in various lighting fields or electrical fields, such as street lights, searchlights, signal lights, car lights, airport lights, etc. Runway lights, bulb lights, etc. generally use LED light sources to replace traditional light bulbs. At present, LED lamps in the society generally fix the LED light source on the circuit board to form a light bar, and then fix the light bar on a conductive metal plate. The main heat dissipation method of this circuit board is to transfer the heat generated by the LED light source to the conductive plate. On the metal plate, the heat generated by ...

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Problems solved by technology

At present, LED lamps in the society generally fix the LED light source on the circuit board to form a light bar, and then fix the light bar on a conductive metal plate. The main heat dissipation method of this circuit board is to transfer the heat generated by the LED light source to the conductive plate. On the metal plate, the heat generated by the LED light strip is dissipated through the conductive metal plate. Due to the poor heat dissipation performance of the conductive metal plate itself, its heat dissipation capacity is limited. Under the premise of high heat generation of LED lamps, ideal heat dissipation cannot be achieved through the metal plate As a result, if the LED lamp works for a long time, it will generate huge heat. When the heat cannot be discharged quickly, it is easy to affect the life of the lamp due to overheating, and even burn the lamp. Moreover, this type of lamp has a complex structure, low cost, and poor practicability

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