A forced convection micro-channel cooling structure, manufacturing method and electronic device
A heat dissipation structure and forced convection technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems that cannot meet the heat dissipation requirements of high-power electronic chips
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[0049] The specific implementation manners according to the present invention will be described below in conjunction with the accompanying drawings.
[0050] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, therefore, the present invention is not limited to the specific embodiments disclosed below limit.
[0051] In order to solve the heat dissipation problem of high-power electronic chips, the invention provides a forced convection micro-channel heat dissipation structure, a manufacturing method and an electronic device using the forced convection micro-channel heat dissipation structure. The forced convection microchannel heat dissipation structure provided by the present invention has at least two layers of heat dissipation units, each heat dissipation unit has a heat dissipation channel, and the heat dissipa...
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