Thermal switch based on negative thermal expansion

A technology of negative thermal expansion and negative thermal expansion material, applied in the direction of thermal switch components, etc., can solve the problems of complex structure of bimetal driven thermal switch, large ratio of off thermal resistance and closed thermal resistance, and occurrence of overcooled welding.

Inactive Publication Date: 2016-02-03
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Among the existing thermal switches, the structure of the thermal switch driven by the bimetal sheet is relatively complicated, and the ratio of the opening and closing thermal resistance is about 300, and the phenomenon of overcooling welding occurs during use
The memory alloy type thermal switch uses the memory alloy to provide the closing force of the thermal switch. Its structure is more complicated, and the ratio of the opening thermal resistance to the closing thermal resistance is relatively large.

Method used

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  • Thermal switch based on negative thermal expansion
  • Thermal switch based on negative thermal expansion
  • Thermal switch based on negative thermal expansion

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Embodiment Construction

[0015] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0016] figure 1 It is a schematic diagram of a negative thermal expansion type thermal switch according to an embodiment of the present invention.

[0017] refer to figure 1 , the thermal switch based on negative thermal expansion in the embodiment of the present invention includes: a negative thermal expansion element 21 and a heat conduction element 22, wherein the negative thermal expansion element 21 is made of a negative thermal expansion material, and the negative thermal expansion element 21 expands in volume as the temperature decreases so that heat conduction Element 22 is connected to a thermal load 23 . Specifically, when the temperature of the negative therm...

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Abstract

The invention discloses a thermal switch based on negative thermal expansion. The thermal switch comprises a negative thermal expansion element and a conductive element. The negative thermal expansion element is made of a negative thermal expansion material. The negative thermal expansion element is connected with the conductive element. When the temperature of the negative thermal expansion element is above a predetermined threshold, the conductive element and a thermal load are disconnected. When the temperature of the negative thermal expansion element is below the predetermined threshold, the conductive element and the thermal load are connected. According to the invention, the thermal switch based on negative thermal expansion is simple in structure and only has two parts; the running stroke of the thermal switch is large; a large gap caused by a large stroke can reduce an angle coefficient between two end faces of the gap; radiation heat transfer can be reduced; and disconnected thermal resistance is increased.

Description

technical field [0001] The invention relates to the technical field of heat flow path control, in particular to a thermal switch based on negative thermal expansion. Background technique [0002] At present, mechanical refrigerators such as Stirling refrigerators have become the best means to provide low-temperature environments with large cooling capacity. In general, the compressor and expander of the Stirling refrigerator use linear motors to drive the vibrator respectively, and perform high-speed reciprocating linear motion at a certain frequency along the axial direction. In this way, when the refrigerator is in operation, large vibrations will be generated along the axial direction, and this vibration will be transmitted to the focal plane detector installed on the cold head of the refrigerator, thereby affecting the imaging effect of the focal plane. In order to reduce refrigeration vibration, a composite refrigeration system is proposed, which uses active and passiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H37/46
CPCH01H37/46
Inventor 孔春辉王俊杰周远
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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