High-performance thermoelectric device and ultrafast fabrication method thereof

Abstract

The invention discloses a high-performance thermoelectric device and an ultrafast fabrication method thereof. In the high-performance thermoelectric device, a segmented structure is employed to perform optimal matching of a thermoelectric material and a temperature difference environment, a blocking layer and a buffer stress layer are employed to reduce interface element migration and longitudinalcontact thermal expansion stress and improve bonding strength, a phonon scattering layer and a negative thermal expansion buffer layer are embedded to fix a thermoelectric leg so as to improve internal thermal resistance and horizontal thermal matching performance of the high-performance thermoelectric device, internal package and external package are employed to prevent the thermoelectric material from being oxidized and sublimed and improve external collision-resistant capability, the technical bottlenecks of low energy conversion efficiency, small specific power, poor thermal stability, poor collision performance, complicated fabrication process and the like of a traditional thermoelectric device are effectively broken through, meanwhile, the thermal stability and the mechanical structural performance of the high-performance thermoelectric device are improved to a great extent, long-term and excellent electrical output performance is guaranteed, and the working environment is expanded.

Description

technical field [0001] The invention relates to the fields of thermoelectric devices and clean energy, in particular to a high-performance thermoelectric device and an ultrafast preparation method thereof. Background technique [0002] A thermoelectric device is an environmentally friendly clean energy device that utilizes the Seebeck effect or the Peltier effect to directly convert heat energy to electrical energy. Because thermoelectric devices have the advantages of strong environmental adaptability, good working stability, long service life, no maintenance, no noise, and miniaturization, they have been used in military defense, deep space and deep sea, polar exploration, biomedicine, electronics industry, artificial intelligence, etc. and other important fields are widely used. [0003] In recent years, the cost of raw materials, material properties, and manufacturing processes of thermoelectric devices have attracted extensive attention from academia and industry. In ...

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Problems solved by technology

But as far as thermoelectric devices are concerned, the traditional Bi 2 Te 3 The figure of merit zT is 1.4 at 450K, and the thermoelectric conversion is only 6% at a temperature difference of 217K

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