Insulating resin composition for printed circuit board and products manufactured by using the same

A printed circuit board, insulating resin technology, applied in the direction of printed circuit stress/deformation reduction, printed circuit, printed circuit, etc., can solve the problem that the thermal expansion coefficient and glass transition temperature of the printed circuit board have not been improved, elastic modulus and thermal stability Sexual decline and other issues

Inactive Publication Date: 2015-04-29
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the prior art, the coefficient of thermal expansion and glass transition temperature can be improved; however, the modulus of elasticity and thermal stability will decrease
In addition, there is a limit to improving the coefficient of thermal expansion and glass transition temperature
[0007] Meanwhile, Patent Document 1 discloses a resin composition for printed circuit boards, however, it has limitations in sufficiently forming an interactive network between components, so that the thermal expansion coefficient and glass transition of the printed circuit board temperature did not improve

Method used

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  • Insulating resin composition for printed circuit board and products manufactured by using the same
  • Insulating resin composition for printed circuit board and products manufactured by using the same
  • Insulating resin composition for printed circuit board and products manufactured by using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] Disperse 3Kg of eucryptite inorganic filler powder into 750g of N,N'-dimethylacetamide (DMAc) (N,N'-dimethylacetamide) solvent to prepare a slurry with a solid content of 80%, 30g of dispersant and 60g of silicon-based coupling agent (3-glycidoxypropyl)trimethoxysilane were added to the slurry as additives.

[0104] 100 g of phenylmethane maleimide oligomer was added to the slurry as bismaleimide resin, which was then stirred by a stirrer for about 1 hour. Then, after ensuring that the bismaleimide resin is completely dissolved, 500 g of bis(2,7-bis(2,3-epoxypropoxy))dinaphthyl methane, which is a naphthyl epoxy resin containing four functional groups, is added into the slurry, followed by stirring by a mixer for 2 hours. Then, after ensuring that the epoxy resin is completely dissolved, add 400 g of phenol novolak type cyanate resin, and stir for about 1 hour by a stirrer. After ensuring that the cyanate ester is completely dissolved, add 2-ethyl-4-methylimidazole (2...

Embodiment 2

[0106] After the varnish with appropriate content prepared according to the above Example 1 was poured on the smooth glossy surface of a copper-clad foil, a film with a thickness of about 150 μm was obtained by a film casting machine used in a laboratory. The film is mainly dried in an oven at about 80°C for 30 minutes to remove volatile solvents. Then, the film was dried at about 120° C. for 60 minutes to obtain a B-stage resin film. The film is kept at about 220°C and applied with 30Kgf / cm 2 The pressure is about 90 minutes to fully cure. After the curing was completed, the film was cut into a size of 4.3 mm / 30 mm to manufacture a measurement sample.

Embodiment 3

[0108] The varnish of Example 3 was prepared by the same conditions and methods as in Example 1, except that 60 g of N-phenyl-3-aminopropyltrimethoxysilane was added instead of (3-glycidoxypropyl) Trimethoxysilane as a silicon coupling agent. The varnish had a viscosity of 500 cps as measured by using a Brookfield viscometer under the condition of 100 rpm.

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Abstract

Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Description

[0001] Cross References to Related Applications [0002] This application claims the priority of Korean Patent Application No. 10-2013-0127918 filed on October 25, 2013, titled "Insulating resin composition for printed circuit board and products manufactured using same", the publication of which The contents are incorporated into this application by reference. technical field [0003] The present invention relates to an insulating resin composition for printed circuit boards and products manufactured using the same. Background technique [0004] With the development of electronic equipment, circuit boards are developing towards light weight, thin thickness and small size. In order to meet the above light and thin requirements, the wiring on the circuit board becomes more complex and dense. The electrical, thermal and mechanical properties required for substrates that function as described above are a more important factor. Printed circuit boards are composed of copper, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/08C08L79/04C08K9/06C08K3/34B32B27/04B32B15/092H05K1/03
CPCC08G59/245C08G59/3218C08G73/0655C08K3/34C08L63/00C08L79/04C08L79/085H05K1/0271H05K1/0373H05K2201/068H01B3/10H01B3/30H05K1/05
Inventor 文珍奭尹今姬赵大熙刘圣贤李炫俊金真渶孙暻镇
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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