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485results about "Metallic oxides" patented technology

Organic silicon oxide core-shell particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device

Provided are organic silicon oxide fine particles which can be formed into a porous film having a dielectric constant and mechanical strength expected as a high-performance porous insulating film and having excellent chemical stability, and a preparation method thereof. Described specifically, provided are an organic silicon oxide fine particle comprising a core containing at least an inorganic silicon oxide or an organic silicon oxide and a shell containing at least an organic silicon oxide and being formed around the core by using shell-forming hydrolyzable silane in the presence of a basic catalyst; wherein of silicon atoms constituting the core or the shell, a ratio (T / Q) of a number (T) of silicon atoms having at least one bond directly attached to a carbon atom to a number (Q) of silicon atoms having all of four bonds attached to an oxygen atom is greater in the shell than in the core; and wherein the shell-forming hydrolyzable silane comprise at least a hydrolyzable silane compound having two or more hydrolyzable-group-having silicon atoms bound to each other via a carbon chain or via a carbon chain containing one silicon atom between some carbon atoms.
Owner:SHIN ETSU CHEM CO LTD +1

Copper wire with insulating layer and manufacture method thereof

The invention discloses a copper wire with an insulating layer and a manufacture method thereof. The copper wire comprises a copper core, a pure aluminum layer and an aluminum oxide layer, wherein the pure aluminum layer is compounded to the outer surface of the copper core through a metal composite technology, and the aluminum oxide layer which is prepared through hard anode oxidation treatment is arranged on the outer surface of the pure aluminum layer. In the method, the pure aluminum layer is compounded to the outer surface of the copper core through an extrusion-drawing method metal composite technology and is an auxiliary layer added in order to prepare the aluminum oxide layer, and the hard anode oxidation treatment is carried out on the outer surface of the pure aluminum layer so as to form the aluminum oxide layer. Because the copper wire manufactured by using the method is adopted, the aluminum oxide layer is arranged on the outer surface of the copper wire; the copper wire belongs to ceramic materials per se and has the advantages of high temperature resistance and insulation, therefore, when used at the temperature of below 400 DEG C, the copper wire can also keep favorable insulating performance, is safe to use and has the temperature exceeding a copper wire canned by conventional plastics by more than one time.
Owner:DALIAN MARITIME UNIVERSITY

Organic silicon oxide fine particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device

Provided are organic silicon oxide fine particles which can be formed into a porous film having a dielectric constant and mechanical strength expected as a high-performance porous insulating film and having excellent chemical stability, and a preparation method thereof. Described specifically, provided are an organic silicon oxide fine particle comprising a core containing at least an inorganic silicon oxide or an organic silicon oxide and a shell containing at least an organic silicon oxide and being formed around the core by using shell-forming hydrolyzable silane in the presence of a basic catalyst; wherein of silicon atoms constituting the core or the shell, a ratio (T / Q) of a number (T) of silicon atoms having at least one bond directly attached to a carbon atom to a number (Q) of silicon atoms having all of four bonds attached to an oxygen atom is greater in the shell than in the core; and wherein the shell-forming hydrolyzable silane comprise at least a hydrolyzable silane compound having two or more hydrolyzable-group-having silicon atoms bound to each other via a carbon chain or via a carbon chain containing one silicon atom between some carbon atoms.
Owner:HAMADA YOSHITAKA +4

Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof

The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. <??>In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 mu m or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 mu m and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.
Owner:JSR CORPORATIOON
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