Organic silicon oxide fine particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device

Abstract

Provided are organic silicon oxide fine particles which can be formed into a porous film having a dielectric constant and mechanical strength expected as a high-performance porous insulating film and having excellent chemical stability, and a preparation method thereof. Described specifically, provided are an organic silicon oxide fine particle comprising a core containing at least an inorganic silicon oxide or an organic silicon oxide and a shell containing at least an organic silicon oxide and being formed around the core by using shell-forming hydrolyzable silane in the presence of a basic catalyst; wherein of silicon atoms constituting the core or the shell, a ratio (T / Q) of a number (T) of silicon atoms having at least one bond directly attached to a carbon atom to a number (Q) of silicon atoms having all of four bonds attached to an oxygen atom is greater in the shell than in the core; and wherein the shell-forming hydrolyzable silane comprise at least a hydrolyzable silane compound having two or more hydrolyzable-group-having silicon atoms bound to each other via a carbon chain or via a carbon chain containing one silicon atom between some carbon atoms.

Description

CROSS-RELATED APPLICATIONS[0001]This application is a divisional of U.S. patent application Ser. No. 12 / 472,681, filed May 27, 2009, which claims priority from Japanese Patent Application No. 2008-142344; filed May 30, 2008, the disclosures of which are incorporated herein by reference in their entireties.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to organic silicon oxide fine particles which can be formed into a porous film excellent in dielectric properties, mechanical strength and chemical stability by application, a preparation method thereof, a film-forming composition, a formation method of a porous film, a porous film formed thereby, and a semiconductor device having the porous film.[0004]2. Description of the Related Art[0005]In the fabrication of semiconductor integrated circuits, as their integration degree becomes higher, an increase in interconnect delay time due to an increase in interconnect capacitance, which is a par...

AI Technical Summary

Benefits of technology

[0134]The film-forming composition of the present invention may contain, as the polymer component of silicon, a polysiloxane prepared by another process. In order to achieve the advantage of the invention, the ratio of the polysiloxane prepared by another process is preferably 50% by weight or less, more preferably 20% by weight or less based on the weight of the organic silicon oxide fine particles.

[0135]A film of any film thickness can be formed by applying the porous-film-forming composition prepared in the above manner to a substrate by spin-coating at an adequate rotation number. The composition can be applied by not only spin-coating but also another method such as scan-coating.

[0136]The actual film thickness is usually from about 0.1 to 1.0 μm, but the thickness is not limited thereto. A film having a greater thickness can also be formed by application in a plurality of times.

[0137]The film thus formed can be made porous by a known manner. For example, a porous film can be obtained by removing the solvent by heating the film in an oven in a drying step (usually a step called “prebake” in a semiconductor process), preferably heating the film to from 50 to 150° C. for several minutes and then baking at from 350 to 450° C. for from 2 to 60 minutes. The heating step (baking step) may be followed or replaced by a step such as curing step to expose to an electron beam or light. As the light, for example, an ultraviolet ray may be employed.[Semiconductor Device]

[0138]The porous film obtained in such a manner can be used as an insulating film in a semiconductor device in a known manner. The insulating film is mounted on a semiconductor device in a known manner. A semiconductor device equipped with such a porous insulating film having both high mechanical strength and high chemical stability can exhibits high performance and high reliabilityEXAMPLESSynthesis

Problems solved by technology

Simple blending of a material having high mechanical strength and a material having high chemical stability results in the formation of the corresponding material which is not an expected material.

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