Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion.

Abstract

A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Description

technical field [0001] The present invention relates to a dielectric composite material suitable for use in electronic packaging and to electronic packaging made of such a dielectric material. Background technique [0002] Only few dielectric materials are available for high-performance electronic applications. For use in high-speed interconnects, materials must have low dielectric constant, low loss, and must be able to adhere to other materials to which they may be bonded, such as copper, chromium, zinc, aluminum, silicon oxide, silicon nitride (SiN), nitride Titanium (TiN), plasma enhanced oxide (PEOX), phosphosilicate glass (PSG), etc. Furthermore, the material must be processable using conventional fabrication techniques such as spin coating, die coating, chemical mechanical polishing, dry etching, imaging, laser ablation, hot / cold pressing, and the like. Other desirable material properties include low moisture absorption, outstanding chemical resistance, good thermal...

AI Technical Summary

Problems solved by technology

Coating thicknesses are typically less than 20 μm due to the relatively high BCB curing stress, which often causes wafer or substrate bowing and thus renders the wafer / substrate unhandlable in subsequent coating processes

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