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Epoxy resin composition as well as prepreg and copper-foil-clad laminated board prepared by using same

A technology of epoxy resin and prepreg, which is applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., and can solve the problems of lower water absorption, low water absorption, low glass transition temperature and dielectric loss tangent, etc. , to reduce water absorption, low water absorption, excellent dielectric properties

Inactive Publication Date: 2012-05-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] In the above existing patent technologies, although it is proposed that the use of active ester as epoxy resin can improve the moisture resistance of the cured product, reduce the water absorption rate, and reduce the dielectric constant and dielectric loss value of the cured product, but its disadvantage is that it is difficult to resist A good balance is achieved between thermal and dielectric properties, so that the cured product has a high glass transition temperature and a low dielectric loss tangent at the same time, and its dielectric properties are relatively stable with frequency changes, and the water absorption rate is higher. Low

Method used

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  • Epoxy resin composition as well as prepreg and copper-foil-clad laminated board prepared by using same
  • Epoxy resin composition as well as prepreg and copper-foil-clad laminated board prepared by using same
  • Epoxy resin composition as well as prepreg and copper-foil-clad laminated board prepared by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Take a container, add 100 parts by weight of naphthol type novolac epoxy resin NC-7300L, then add an equivalent part by weight of active ester curing agent HPC-8000-65T, stir, add an appropriate amount of DMAP, and solvent toluene, continue to stir evenly into glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to prepare a prepreg. A plurality of prepregs prepared are stacked on each other, a piece of copper foil is laminated on each side of the prepreg, and put into a hot press machine to solidify to form the copper-clad laminate. The physical data are shown in Table 1.

Embodiment 2～3

[0065] The manufacturing process is the same as in Example 1, and the formula composition and physical property data are as shown in Table 1.

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Abstract

The invention relates to an epoxy resin composition as well as a prepreg and a copper-foil-clad laminated board prepared by using the same. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing a naphthol structure, (B) an active ester serving as a curing agent, and (C) a curing accelerant. Because epoxy resin at least contains the naphthol structure in the molecular structure, the epoxy resin composition provided by the invention has higher functionality degree and high glass transition temperature; at the same time, the naphthol group structure is introduced to the molecular structure, thus the cured product has low water absorptivity and low expansion coefficient; due to the active ester serving as the curing agent, the advantages that the a polar group is not generated during the reaction between the active ester and epoxy, thus the dielectric properties are excellent and moisture and heat resistance are good are fully exerted; and in addition, because of the epoxy resin containing the special naphthol structure, the hydroscopicity of the resin cured product is further reduced and the dielectric loss value of the cured product is lowered. The prepreg and the copper-foil-clad laminated board provided by the invention have excellent dielectric properties, moisture and heat resistance and high glass transition temperature.

Description

technical field [0001] The invention relates to a resin composition, in particular to an epoxy resin composition and a prepreg and a copper-clad laminate made of the epoxy resin composition. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. In addition to maintaining higher requirements for the heat resistance of laminate materials, their dielectric constant and dielectric The loss value requirement will be lower and lower. The existing traditional FR-4 is difficult to meet the high-frequency and high-speed development needs of electronic products. At the same time, the substrate material no longer plays the role of mechanical support in the traditional sense, but will become the designer of PCB and terminal manufacturers together with electronic components. An important way to improve product performance. Because...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08G59/20C08L63/00B32B15/092B32B27/04
Inventor 曾宪平
Owner GUANGDONG SHENGYI SCI TECH
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