The invention discloses a columnar
capacitor formed between different
metal layers in the technique for preparing through-holes and wiring. The columnar
capacitor comprises a
dielectric layer, wherein, a central through-hole and at least one cylindrical through-hole coaxial with the central through-hole are formed in the
dielectric layer; the central through-hole and the cylindrical through holesare filled with
metal respectively, so as to form
metal areas respectively, wherein, the adjacent metal areas are not communicated with each other. The invention further discloses a stacking-type coaxial columnar
capacitor and a method for preparing the capacitors. The capacitors of the invention have the following advantages: 1, the preparation of the capacitors are formed in the process of preparing metal wiring, so that the technique is simple and the cost is low; and 2, the capacitors are free from the design dimensionality in the height direction through coaxial stacking preparation, so that the capacitors can be prepared flexibly according to the spatial requirements for circuit components, and according to component
simulation, the
capacitance of a stacking-type capacitor with the height of 4 mu m is equivalent to that of a plate capacitor, being about 1fF / mu m<2>.