The invention discloses a columnar capacitor formed between different metal layers in the technique for preparing through-holes and wiring. The columnar capacitor comprises a dielectric layer, wherein, a central through-hole and at least one cylindrical through-hole coaxial with the central through-hole are formed in the dielectric layer; the central through-hole and the cylindrical through holesare filled with metal respectively, so as to form metal areas respectively, wherein, the adjacent metal areas are not communicated with each other. The invention further discloses a stacking-type coaxial columnar capacitor and a method for preparing the capacitors. The capacitors of the invention have the following advantages: 1, the preparation of the capacitors are formed in the process of preparing metal wiring, so that the technique is simple and the cost is low; and 2, the capacitors are free from the design dimensionality in the height direction through coaxial stacking preparation, so that the capacitors can be prepared flexibly according to the spatial requirements for circuit components, and according to component simulation, the capacitance of a stacking-type capacitor with the height of 4 mu m is equivalent to that of a plate capacitor, being about 1fF/mu m<2>.