A substrate-type multi-layer
polymer capacitor (MLPC), including a casing, a core, and two electroplated terminals. The core is arranged in an inner cavity of the casing. The casing is formed by joining two first packaging plates and two second packaging plates. The two electroplated terminals are formed by
electroplating. One of the two electroplated terminals is configured to cover one end of the casing to form an
anode, and the other of the two electroplated terminals is configured to cover the other end of the casing to form a
cathode electrically led out from the core. The first packaging plate includes a substrate, an
electrode plate and two
metal plates. The electroplated terminals are integrally sealed with the casing.