Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board including embedded capacitors and method of manufacturing the same

A technology of printed circuit boards and capacitors, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., and can solve the problems of reducing the installation area of ​​passive components and embedding capacitors, etc.

Inactive Publication Date: 2006-02-22
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF2 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] However, embedded capacitor PCBs fabricated by the above techniques have a capacitance density of 0.5-3nF per inch, which is not enough value to fully embed the capacitors into the PCB
Also, there is a limitation in the reduction of the mounting area of ​​the passive components

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board including embedded capacitors and method of manufacturing the same
  • Printed circuit board including embedded capacitors and method of manufacturing the same
  • Printed circuit board including embedded capacitors and method of manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] Hereinafter, a detailed description of the present invention will be given with reference to the accompanying drawings.

[0036] figure 2 , 3a , 3b, 4 and 5a-5d illustrate the process of manufacturing a capacitor including an embedded capacitor according to a first embodiment of the present invention.

[0037] like figure 2 As shown, a conductor 23 , such as aluminum or copper, is formed in a predetermined pattern on a broad flat polymer sheet 22 with a high dielectric constant to form a polymer capacitor layer 21 .

[0038] Methods of patterning the conductor 23 include, for example, a dry method such as sputtering, and a wet method such as screen printing.

[0039] Figure 3aIn , the first polymer capacitor layer 21a having the first conductor pattern 23a and the second polymer capacitor layer 21b having the second conductor pattern 23b are arranged and then laminated together. As apparent from FIG. 3, the positions of the first and second conductor patterns 23a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.

Description

technical field [0001] The present invention generally relates to printed circuit boards in which capacitor laminates or capacitors are embedded. More specifically, the present invention relates to a PCB comprising a polymer capacitor laminate capable of exhibiting a higher capacitance density per unit area than conventional PCBs comprising embedded capacitors, so that capacitors having different Capacitance multilayer ceramic capacitors (MLCCs) are embedded in PCBs, rather than being mounted on them; and their manufacturing methods. Background technique [0002] Typically, capacitors store energy in the form of an electric field. When a DC voltage is applied to the capacitor, the capacitor is charged but current flow stops. On the other hand, if an AC voltage is connected across the capacitor, the current flowing through the capacitor depends on the frequency of the AC signal used to charge and discharge the capacitor and the capacitance value of the capacitor. [0003] ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/16H05K3/46H01G4/30
CPCH05K1/162H05K1/185H05K3/4652H05K2201/0187
Inventor 金镇哲金民秀吴浚禄金泰庆
Owner SAMSUNG ELECTRO MECHANICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com