Printed circuit board including embedded capacitors and method of manufacturing the same

A technology of printed circuit boards and capacitors, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., and can solve the problems of reducing the installation area of ​​passive components and embedding capacitors, etc.

Inactive Publication Date: 2006-02-22
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] However, embedded capacitor PCBs fabricated by the above techniques have a capacitance density of 0.5-3nF per inch, which is not enough

Method used

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  • Printed circuit board including embedded capacitors and method of manufacturing the same
  • Printed circuit board including embedded capacitors and method of manufacturing the same
  • Printed circuit board including embedded capacitors and method of manufacturing the same

Examples

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Embodiment Construction

[0035] Hereinafter, a detailed description of the present invention will be given with reference to the accompanying drawings.

[0036] figure 2 , 3a , 3b, 4 and 5a-5d illustrate the process of manufacturing a capacitor including an embedded capacitor according to a first embodiment of the present invention.

[0037] like figure 2 As shown, a conductor 23 , such as aluminum or copper, is formed in a predetermined pattern on a broad flat polymer sheet 22 with a high dielectric constant to form a polymer capacitor layer 21 .

[0038] Methods of patterning the conductor 23 include, for example, a dry method such as sputtering, and a wet method such as screen printing.

[0039] Figure 3aIn , the first polymer capacitor layer 21a having the first conductor pattern 23a and the second polymer capacitor layer 21b having the second conductor pattern 23b are arranged and then laminated together. As apparent from FIG. 3, the positions of the first and second conductor patterns 23a ...

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PUM

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Abstract

Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.

Description

technical field [0001] The present invention generally relates to printed circuit boards in which capacitor laminates or capacitors are embedded. More specifically, the present invention relates to a PCB comprising a polymer capacitor laminate capable of exhibiting a higher capacitance density per unit area than conventional PCBs comprising embedded capacitors, so that capacitors having different Capacitance multilayer ceramic capacitors (MLCCs) are embedded in PCBs, rather than being mounted on them; and their manufacturing methods. Background technique [0002] Typically, capacitors store energy in the form of an electric field. When a DC voltage is applied to the capacitor, the capacitor is charged but current flow stops. On the other hand, if an AC voltage is connected across the capacitor, the current flowing through the capacitor depends on the frequency of the AC signal used to charge and discharge the capacitor and the capacitance value of the capacitor. [0003] ...

Claims

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Application Information

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IPC IPC(8): H05K1/16H05K3/46H01G4/30
CPCH05K1/162H05K1/185H05K3/4652H05K2201/0187
Inventor 金镇哲金民秀吴浚禄金泰庆
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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