Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition

A technology of resin composition and copper clad laminate, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, lamination, etc., can solve the problems of high water absorption, large smoke generation, bad smell, etc., and achieve excellent heat resistance and moisture resistance, low dielectric loss, and the effect of improving the electrical properties of the system

Active Publication Date: 2013-03-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the rapid development of electronic technology, people are increasingly seeking environmental protection, but traditional high-frequency and high-speed materials basically use halides, antimonides, etc. to achieve the purpose of flame retardancy. Not only does it generate a lot of smoke and smell bad, but it also emits highly toxic and corrosive hydrogen halide gas, which not only pollutes the environment, but also endangers human health; at pr...

Method used

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  • Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition
  • Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition
  • Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Add solvent, hexachlorocyclotriphosphazene, allylphenol (with ortho-allylphenol as the main component), and acid-binding agent into the reaction device, stir, pass in nitrogen protection, heat to 50-120°C, and then Add a catalyst into the reaction device, react for 5-16 hours, cool to room temperature, filter with suction, carry out pressure distillation on the filtrate, evaporate the solvent, and obtain a brown powder or viscous product. After taking 30g of the above product and dissolving it in an organic solvent, add 50g of DCPD epoxy resin (the selected DCPD epoxy resin is HP-7200H (DIC), equivalent 275-280), 20g of DCPD phenolic resin (the selected DCPD phenolic resin is Nihon Petro -chemical DPP-600M), appropriate amount of imidazole and 2,5-bis(2-ethylhexanoyl peroxy), stir and mix evenly to obtain glue. Select 300×300cm E-glass fiber cloth with smooth and flat surface, evenly coat the above glue, and bake in an oven at 155°C for 7 minutes to make a prepreg. Sta...

Embodiment 2

[0050] Add solvent, hexachlorocyclotriphosphazene, allylphenol (with ortho-allylphenol as the main component), and acid-binding agent into the reaction device, stir, pass in nitrogen protection, heat to 50-120°C, and then Add a catalyst into the reaction device, react for 5-16 hours, cool to room temperature, filter with suction, carry out pressure distillation on the filtrate, evaporate the solvent, and obtain a brown powder or viscous product. After taking 30g of the above product and dissolving it in an organic solvent, add 40g of DCPD benzoxazine (the selected DCPD benzoxazine is MT36000 (Huntsman)), 20g of DCPD epoxy resin (the selected DCPD epoxy resin is HP-7200H (DIC ), equivalent weight 275-280), styrene / maleic anhydride 10g (selected anhydride is EF-30, Sartomer), appropriate amount of imidazole and 2,5-bis(2-ethylhexanoyl peroxy), stirring Mix evenly to obtain glue. Select 300×300cm E-glass fiber cloth with smooth and flat surface, evenly coat the above glue, and b...

Embodiment 3

[0052] Add solvent, hexachlorocyclotriphosphazene, allylphenol (with ortho-allylphenol as the main component), and acid-binding agent into the reaction device, stir, pass in nitrogen protection, heat to 50-120°C, and then Add a catalyst into the reaction device, react for 5-16 hours, cool to room temperature, filter with suction, carry out pressure distillation on the filtrate, evaporate the solvent, and obtain a brown powder or viscous product. After dissolving 30g of the above product in an organic solvent, add 30g of DCPD cyanate (the selected DCPD cyanate is LONZA-Primaset BADCy), 20g of 4,4'-diphenylmethane bismaleimide, DCPD epoxy resin 20g (the selected DCPD epoxy resin is HP-7200H (DIC), equivalent weight 275-280), an appropriate amount of aluminum acetylacetonate, stirred and mixed evenly to obtain glue. Select 300×300cm E-glass fiber cloth with smooth and flat surface, evenly coat the above glue, and bake in an oven at 155°C for 7 minutes to make a prepreg. Stack fi...

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Abstract

The invention discloses a halogen-free resin composition and a method for preparing a copper-clad plate from the halogen-free resin composition. Based on the total weight part of solid ingredients of the halogen-free resin composition, the halogen-free resin composition comprises, by weight, 5 to 50 parts of reaction-type allylphenoxycyclotriphosphazene or vinylphenoxycyclotriphosphazene, 15 to 85 parts of a thermosetting resin, 1 to 35 parts of a crosslinking curing agent, 0 to 5 parts of a crosslinking curing accelerator and 0 to 100 parts of a filling material. Through introduction of reaction-type allylphenoxycyclotriphosphazene or vinylphenoxycyclotriphosphazene having very low water absorbency into the thermosetting resin, the halogen-free resin composition can satisfy halogen-free flame-retardation requirements, improve system electrical properties, and realize non-halogenation of a high-frequency high-speed substrate material. The copper-clad plate prepared from the halogen-free resin composition satisfies halogen-free requirements, has excellent heat resistance and moisture resistance and has a low dielectric loss.

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-free resin composition and a method for making a copper-clad laminate using the composition. Background technique [0002] In recent years, with the development of integration technology, bonding technology and assembly technology of semiconductor devices used in electronic equipment, high-density electronic instrument components and high-density printed circuit board wiring, electronic equipment has been continuously improved, especially in those using There has been a rapid development in broadband electronic equipment such as mobile communication devices. [0003] Printed wiring boards, as a component of such electronic equipment, are developing toward higher levels of multilayer printed wiring boards with more precise wiring. In order to increase the signal transmission speed to the level required to accelerate information processing, an effective method is to reduce the diel...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08G59/40C08G59/50C08G59/62C08K5/5399B32B27/04B32B27/38B32B37/06B32B37/10
CPCC08K5/5399
Inventor 何岳山
Owner GUANGDONG SHENGYI SCI TECH
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