Production method of polyoxazolidone laminated board

Abstract

The invention provides a production method of a polyoxazolidone laminated board, comprising the following steps: reacting diisocyanate with epoxide resin by taking imidazole compounds as catalyst for producing polyoxazolidon resin during the gradual rise of temperature; and then producing the polyoxazolidone laminated board by using the polyoxazolidon resin. The polyoxazolidone laminated board the end of which is sealed with isocyanate has better mechanical strength, favorable heat resistance and high glass transition temperature above 155 DEG C; and when in use at 180 DEG C or 200 DEG C, the mechanical property and electrical propertye of the polyoxazolidone laminated board are over 70 percent.

Description

technical field

[0001] The invention relates to a production method of a high heat-resistant polyoxazolidinone laminate, in particular to a method of reacting diisocyanate and epoxy resin, using imidazole compounds as catalysts, and producing polyoxazolidinone in the process of gradually increasing the temperature Resin, and then utilize polyoxazolidone resin to produce the method for high heat resistance polyoxazolidone laminated board. Background technique

[0002] At present, most electrical and electronic laminates use bisphenol A epoxy resin or brominated bisphenol A epoxy resin, with dicyandiamide as the curing agent, but the glass transition temperature of this laminate or circuit board changes Low, no more than 135 ° C, chemical corrosion resistance is not ideal, if it is immersed in N-methylpyrrolidone reagent, its weight loss exceeds 0.05%. Although more expensive curing agents or epoxy resins can achieve a glass transition temperature above 135°C and better solve...