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Production method of polyoxazolidone laminated board

A technology of polyoxazolidinone and production method, which is applied in the directions of lamination, layered products, lamination devices, etc., can solve the problem that the glass transition temperature is difficult to exceed 155°C, and achieves improved rigidity, improved crosslinking density, The effect of improving toughness

Inactive Publication Date: 2010-04-21
HUNAN HENGYUAN NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the performance of polyoxazolidone resin increases with the increase of isocyanate content, and the isocyanate content in epoxy-terminated polyoxazolidone resin is difficult to exceed 20%, so the glass transition temperature of its production is difficult to exceed 155 °C

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1, the preparation of polyoxazolidinone resin:

[0036] Polyoxazolidinone resin is made up of the material of following components, and its parts are parts by weight, wherein: bisphenol A type epoxy resin E-51 45, 4,4-diphenylmethane diisocyanate 55, 2-methyl Kiimidazole 0.05.

[0037] Its preparation process is as follows:

[0038] a. Add bisphenol A type epoxy resin E-51 into the reaction kettle, add 2-methylimidazole after heating to 155°C, feed nitrogen gas at the same time during heating, and then add dropwise 30% of the total amount of 4,4-bis Benzyl methane diisocyanate, the dropping time is controlled at 90 minutes, and then the insulation reaction is 30 minutes;

[0039] b. Raise the temperature to 180°C and react for 15 minutes, take regular samples and use infrared spectroscopy to detect the disappearance of the isocyanate functional group;

[0040] c. Detect the softening point to 80-85, cool to 110°C, add a total of 13% toluene as a solvent; ...

Embodiment 2

[0043] Embodiment two, the preparation of polyoxazolidinone resin:

[0044] The polyoxazolidinone resin is made up of the following components, and the parts are parts by weight, wherein: bisphenol A novolac epoxy resin BN-240 25, bisphenol F epoxy resin 862 20, 4, 4 -Diphenylmethane diisocyanate 55, 2-methylimidazole 0.05.

[0045] Its preparation process is as follows:

[0046] a. Add bisphenol A novolak type epoxy resin BN-240 and bisphenol F type epoxy resin 862 into the reaction kettle, add 2-methylimidazole after heating to 140°C, feed nitrogen gas at the same time during heating, and then drop The total amount of 30% 4,4-diphenylmethane diisocyanate, the dropwise addition time is controlled at 90 minutes, and then the reaction is incubated for 30 minutes.

[0047] b. Raise the temperature to 160° C. and react for 25 minutes. Periodically take samples and use infrared spectroscopy to detect that the isocyanate functional group disappears.

[0048] c. Check the softeni...

Embodiment 3

[0051] Embodiment three, the preparation of polyoxazolidinone resin:

[0052]Polyoxazolidinone resin is made up of the following components, and its parts are parts by weight, wherein: novolak type epoxy resin F-48 25, bisphenol F type epoxy resin 862 20, 4,4-diphenyl Methane diisocyanate 55, 2-methylimidazole 0.05.

[0053] Its preparation process is as follows:

[0054] a. Add novolak type epoxy resin F-48 and bisphenol F type epoxy resin 862 into the reaction kettle, add 2-methylimidazole after heating to 140°C, feed nitrogen gas at the same time during heating, and then drop a total of 30 % of 4,4-diphenylmethane diisocyanate, the dropwise addition time is controlled at 90 minutes, and then the reaction is incubated for 30 minutes.

[0055] b. Raise the temperature to 170°C and react for 25 minutes. Periodically take samples and use infrared spectroscopy to detect that the isocyanate functional group disappears.

[0056] c. Check the softening point to 95°C-100°C, cool ...

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Abstract

The invention provides a production method of a polyoxazolidone laminated board, comprising the following steps: reacting diisocyanate with epoxide resin by taking imidazole compounds as catalyst for producing polyoxazolidon resin during the gradual rise of temperature; and then producing the polyoxazolidone laminated board by using the polyoxazolidon resin. The polyoxazolidone laminated board the end of which is sealed with isocyanate has better mechanical strength, favorable heat resistance and high glass transition temperature above 155 DEG C; and when in use at 180 DEG C or 200 DEG C, the mechanical property and electrical propertye of the polyoxazolidone laminated board are over 70 percent.

Description

technical field [0001] The invention relates to a production method of a high heat-resistant polyoxazolidinone laminate, in particular to a method of reacting diisocyanate and epoxy resin, using imidazole compounds as catalysts, and producing polyoxazolidinone in the process of gradually increasing the temperature Resin, and then utilize polyoxazolidone resin to produce the method for high heat resistance polyoxazolidone laminated board. Background technique [0002] At present, most electrical and electronic laminates use bisphenol A epoxy resin or brominated bisphenol A epoxy resin, with dicyandiamide as the curing agent, but the glass transition temperature of this laminate or circuit board changes Low, no more than 135 ° C, chemical corrosion resistance is not ideal, if it is immersed in N-methylpyrrolidone reagent, its weight loss exceeds 0.05%. Although more expensive curing agents or epoxy resins can achieve a glass transition temperature above 135°C and better solve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/06B32B38/08B32B17/04C08G18/00C08G73/06C08L75/00C08L79/04
Inventor 李孟德
Owner HUNAN HENGYUAN NEW MATERIAL TECH CO LTD
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