42results about How to "High thermal conductivity material" patented technology

The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin 32, which produces a resin impregnated matrix. The high thermal conductivity material 30 comprises 5-60% by volume of the resin 32. This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.

Patterned thin films comprise regions of relatively low thermal conductivity material separated by regions of relatively high thermal conductivity material. The low thermal conductivity regions may be provided in the form of cylinders or cuboids which are arranged in a continuous matrix of the high thermal conductivity material. The thin film may be used as thermal control layers in data recording media such as heat assisted magnetic recording media.

The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.

A thermal management system for a heat generating electrical component and a method of making such a thermal management system. Additive manufacturing is used to form at least a portion of the thermal management system as a unitary, monolithic structure. Such a structure maximizes heat transfer by reducing or eliminating thermal interfaces between the components of the thermal management system. The use of additive manufacturing also allows for the production of varying thermal management system geometries that are not possible with conventional methods.

The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.

A solid state light source with LEDs in thermal contact to thermally conductive translucent elements where light emitted from the LEDs is directed to emerge from the heat dissipating surfaces of the elements. The thermally conductive translucent elements are arranged or combined with a reflector to form a light recycling cavity. The outside surfaces of the thermally conductive translucent elements forming the cavity become luminescent as the light emitted by the LEDs on the inside of the cavity is continually reflected and recycled until a very high percentage of the light emitted by the LEDs is eventually transmitted through and emitted uniformly and omnidirectionally. Simultaneously, the heat from the LEDs conducts through and to the luminescent outside surfaces of the elements of the cavity, which radiatively and convectively cool the light source thereby eliminating the need for bulky appended heat sinks.

A co-fired ceramic module includes a ceramic substrate and at least one heat-emitting device. The ceramic substrate has at least one high thermal conductivity material. The heat-emitting device is disposed on the ceramic substrate. The substrate further includes a cavity and the heat-emitting device is disposed in the cavity.

An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive electronic components (305-355) operating in cooperation with the flip chip semiconductor die (105) and housed inside the device package to decouple noise from input signals, and a heat spreader (195) disposed between a top surface of the semiconductor die (105) and a package cover (185). The semiconductor die (105) is configured as a flip chip die and the device package includes a package substrate (110) configured as a ball grid array. The improved microelectronic device (100) reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate (115) and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

A core for molding apparatus includes inner surface configurations for improving the cooling of injected plastic material.

A nozzle assembly for an injection molding assembly has a nozzle housing having a melt channel extending therethrough, a nozzle tip, and a retainer that retains the nozzle tip against the nozzle housing. The nozzle tip is formed of a precipitation hardened, high thermal conductivity material and a precipitation hardened, high strength material, which are integrally joined together to form the body. The thermal conductivity of the high thermal conductivity material is greater than the thermal conductivity of the high strength material, and the strength of the high strength material is greater than the strength of the high thermal conductivity material. The high thermal conductivity material and the high strength material can be precipitation hardened together under the same precipitation hardening conditions to achieve increases in the value of at least one strength aspect of the high thermal conductivity material and the value of at least one strength aspect of the high strength material.

A perforated film electrode for a pinned electrostatic chuck that lies below the top surface of the pins in the valleys or interstices between pins, below the elevation of the top surface of the pins, and is attached to the body of the chuck. In one embodiment, the perforated film electrode assembly features a thin film electrode sandwiched between thin sheets of electrically insulating material. The top, outer or exposed surface of the perforated film electrode assembly has a flatness that is maintained within 3 microns. That is, the distance or elevation between the tops of the pins and the top surface of the perforated film unit is maintained within plus or minus 3 microns. A tool for producing a uniform elevation of the top and bottom sheets or layers of electrically insulating material also is taught.

An isothermal cooking plate assembly is formed from a first plate of high thermal conductivity material having a back surface and an oppositely disposed top cooking surface. One or more heater circuit assemblies are disposed on the first plate back surface for forming a composite having a back surface. A controller is in electrical connection with the heater circuit assemblies for controlling temperature of the first plate of high thermal conductivity material. The first plate can be aluminum Type 1100 or aluminum Type 6061. The first plate can be a laminate formed from a clad bottom metal layer and clad top cooking surface metal layer, where the clad layers formed from the same material and having about the same thickness. The clad material can be austenitic stainless steel. A second plate of low thermal conductivity material can be attached to the composite back surface of first plate.

A solar receiver having a receiver vessel with a receiver chamber, a receiver cover with a receiver window, a receiver fluid inlet, a receiver fluid outlet, and an absorption media matrix in the receiver chamber. In operation of the solar receiver, incident solar radiation is transmitted through the receiver window to the absorption media matrix. Receiver fluid is circulated through the receiver chamber and the absorption media matrix. Heat is transferred from the absorption media matrix to the receiver fluid.

An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.