Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof

Abstract

The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. <??>In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 mu m or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 mu m and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

Description

technical field [0001] The present invention relates to composite particles for dielectrics, a composition for forming a dielectric containing the composite particles for dielectrics, an aqueous dispersion for electrodeposition containing the composition, an aqueous dispersion for electrodeposition comprising the composition, and an aqueous dispersion for electrodeposition The formed photosensitive transfer film and dielectric body, the dielectric body with conductive foil obtained by forming the dielectric body on the conductive foil, and electronic components including the dielectric body, multilayer circuit board and wiring board. [0002] Also, the present invention relates to ultrafine particle composite resin particles, a composition for forming a dielectric body containing the ultrafine particle composite resin particle, an aqueous dispersion liquid for electrodeposition containing the composition, and the above-mentioned composition for electrodeposition. Invention of...

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Problems solved by technology

However, in this method, for example, it must be fired at a high temperature of about 1000°C, so it is not suitable for providing a dielectric layer in a state where electronic components are mounted on a wiring substrate, so there is still a problem that it cannot be widely used in various semiconductor manufacturing. Step Questions (The question currently asked is simply referred to as (Question 1))

In addition, although JP-A-5-37161 or JP-A-5-160334 disclose the technique of coating a high-permittivity material on a wiring board, a sufficient capacitor capacity cannot be obtained if the area of ​​the wiring board is too small. (subject 4)

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