24 results about "Dielectric body" patented technology

The application discloses a dielectric waveguide resonator and a multimode dielectric waveguide resonator, which comprises a dielectric resonant cavity, the dielectric resonant cavity comprises a dielectric body and a metal plating layer wrapping an outer surface of the dielectric body; a metal loading interface is arranged in the dielectric body and is connected with the metal plating layer; the metal loading interface intersects with an intrinsic electric field direction of the dielectric resonant cavity to reduce a main mode frequency of the dielectric resonant cavity. Embodiments of the application provide a dielectric waveguide resonator and a multimode dielectric waveguide resonator, by adding a metal loading interface in a dielectric body of a dielectric waveguide resonator, the size, frequency and unloaded Q value of the dielectric waveguide resonator are kept unchanged, high-order mode harmonics are pushed away, the performance of a low-pass filter is improved, and loss is improved.

An electret (1) is formed by subjecting an inorganic dielectric body (2) to a charging process. The inorganic dielectric body (2) is composed of a metal compound containing at least either Al or Mg, and the total mole fraction of Al and Mg among all the metal elements contained in the metal compound is greater than 50%. The metal compound may contain a metal oxide or a metal salt and may be an Al-containing oxide or salt, a Mg-containing oxide or salt, or a mixed oxide containing both Al and Mg.

A high-voltage subsea assembly (30) comprising a subsea high-voltage wet-mate connector (15) with a male part a female part or a penetrator (9) with a penetrator body (9a) extending through a wall aperture (7a) of an enclosure wall (7) of a subsea enclosure A high-voltage bridging unit (20) connects to the male or female part, or to the penetrator. The bridging unit comprises a first and second end (27, 29), a main body (22) with an inner bore (23). A dielectric body (24) is radially within the inner bore, with a dielectric body inner bore (28). A conductor unit (26) comprising metal extends between the first and second ends and is arranged inside the dielectric body inner bore (28).

A connector capable of realizing commonalization of components and suppressing cost increase is provided. The connector is provided with a first connector (10) and a second connector (11) capable of being fitted to each other. The first connector (10) has a first inner conductor (13), a first outer conductor (16), a first outer conductor cover (17), and a first dielectric body (15). The second connector (11) has a second inner conductor (14), a second outer conductor (21), a second outer conductor cover (17), and a second dielectric body (19). The second outer conductor has a second outer conductor connecting portion (34) radially overlapping the first outer conductor. The first outer conductor has a first outer conductor main body portion, a first outer conductor connecting portion covering an outer periphery of the second outer conductor connecting portion and being in contact with the second outer conductor connecting portion, and a necking portion which is reduced in diameter from the first outer conductor connecting portion to the first outer conductor main body portion. The first outer conductor cover and the second outer conductor cover have the same shape as each other.

The application provides a method for reducing a flipping electric field of a ferroelectric material, which can be applied to the technical fields of ferroelectric materials and semiconductor devices, and comprises the following steps: arranging a top electrode and a bottom electrode on opposite sides of the ferroelectric material respectively to form a ferroelectric capacitor; and connecting the ferroelectric capacitor and a dielectric capacitor in series to form a ferroelectric-dielectric system, so as to inhibit the ferroelectricity of the ferroelectric material and reduce the flipping electric field of the ferroelectric material. The reduction degree of the flipping electric field of the ferroelectric material is related to the capacitance value of the dielectric capacitor. The method for reducing the flipping electric field of the ferroelectric material by connecting the ferroelectric body and the dielectric body in series breaks through the limitation of the traditional scheme and has the characteristics of simple principle, non-destructiveness, small implementation difficulty and large regulation range.

The application discloses a multifunctional integrated interposer and a photoelectricity collaborative packaging module, and belongs to the technical field of integrated circuits.The multifunctional integrated interposer is characterized in that a first embedded interconnection unit of an integrated super-high-density and super-low-loss physical wiring channel circuit and a second embedded interconnection unit with photoelectric conversion function are co-planarly embedded in a dielectric body, and the upper surfaces of the two units are flush with the upper surface of the dielectric body, thereby realizing high integration of the two functional units in structure, effectively shortening the interconnection path of high-speed electrical signals and optical signals between chips, and reducing transmission loss and delay.The embedded physical wiring channel circuit can directly provide super-high-speed physical signal direct through in the first embedded interconnection unit, and the USR super-high-speed interface protocol processing function is transferred to an acceleration computing core, thereby significantly improving signal integrity, saving external special DSP chips, and simplifying system architecture, reducing overall power consumption and packaging complexity.

The object of the present invention is to stabilize the relative positional relationship between the outer conductor and the inner conductor. The shielded connector (S) comprises: a dielectric body (30) made of synthetic resin; an inner conductor (21) fixedly attached to a circuit board (P) in an integrated state with the dielectric body (30); and an outer conductor (40) fixedly attached to the circuit board (P) surrounding the dielectric body (30), wherein a first protrusion (61) and a second protrusion (62) are formed on the dielectric body (30) in a plastically deformed state abutting against the outer conductor (40). Because the inner conductor (21) and the dielectric body (30) are integrated relative to the outer conductor (40) through the plastically deformed first protrusion (61) and second protrusion (62), relative displacement between the inner conductor (21) and the outer conductor (40) can be suppressed.

A method of assembling an electrical component is provided. The method includes providing a dielectric body configured to support an electrical conductor. The dielectric body includes a polymer resin. The dielectric body includes glass filler elements embedded in the polymer resin, and the dielectric body includes gas cells embedded in the polymer resin.

A dielectric filter is provided including at least two connected dielectric resonators and a hole group formed between two adjacent dielectric resonators. Each dielectric resonator includes a dielectric body and a resonant cavity. The dielectric body includes a top surface and a bottom surface along a first direction Z of the dielectric filter. The resonant cavity runs through the top surface or the bottom surface. The dielectric body further includes a first side surface and a second side surface along a second direction Y. Each hole group includes a first hole and a second hole. Two ends of the first hole respectively run through the top surface and the bottom surface. The second hole runs through at least one of the first side surface and the second side surface. Projections of the first hole and the second hole intersect along a third direction X of the dielectric filter.

A method for manufacturing a corrosion-resistant coating film, including: a step of applying a slurry in which particles of a corrosion-resistant material are dispersed to a surface of a dielectric substrate to form a coating film of the corrosion-resistant material; and a step of irradiating a laser beam to the coating film to form a corrosion-resistant coating film in which the corrosion-resistant material is sintered, the corrosion-resistant material being at least one selected from the group of YOF, YF3, MgF2, and MgAl2O4, and the dielectric substrate being an alumina-silicon carbide composite sintered body.

The method comprises forming a plurality of islands of a first material on a plurality of first sections of a layer. A plurality of second sections of the layer are not covered by the first material. The method further comprises depositing a second material on (i) the islands of the first material and (ii) the second sections of the layer that are not covered by the islands of the first material. The method further comprises evaporating and / or sublimating the islands of the first material to remove any residue of the second material that was on the islands of the first material. In one example, the second material remains on the second sections of the layer, thereby forming a pattern of the second material on the layer. In one example, the first material is a monomer, and the second material is a conductor, dielectric, or semiconductor.

The mounting structure (1) includes: a dielectric body (10); a ground electrode (14) disposed on the dielectric body; a first line (11) disposed on the dielectric body opposite to the ground electrode; a second line (12) disposed on the dielectric body opposite to the ground electrode, between the first line and the ground electrode in the normal direction of the dielectric body; a connecting conductor (15) connecting the first line and the second line; and a stub (13) extending from the connection portion of the first line connected to the connecting conductor, disposed on the dielectric body opposite to the ground electrode and the second line. The thickness of the first line in the normal direction is greater than the thickness of the second line in the normal direction. The second line extends in the same direction as the first line. The stub extends in the same direction as the second line. When the dielectric body is viewed from the normal direction, at least a portion of the stub overlaps with the second line in the direction of extension.

Various embodiments provide an electrosurgical instrument comprising a coaxial feed cable having an inner conductor, an outer conductor, and a first dielectric material separating the inner and outer conductors, the coaxial feed cable for conveying a microwave signal. The instrument further comprises a radiating tip disposed at a distal end of the coaxial feed cable for receiving the microwave signal. The radiating tip comprises an elongated conductor electrically connected to the inner conductor and extending in a longitudinal direction, a dielectric body disposed on at least a first portion of the elongated conductor, the dielectric body comprising a second dielectric material having a higher dielectric constant than the first dielectric material, and a conductive body disposed on at least a second portion of the elongated conductor, the second portion being different from the first portion. Some other embodiments provide an electrosurgical apparatus comprising the instrument.

The invention discloses a single-layer super-structure lens covering zero to infinite total object distance. The single-layer super-structure lens comprises a transparent medium substrate; the nano-structure array is arranged on the substrate and consists of a plurality of nano-structure units; each nano structure unit comprises an external cuboid high-refractive-index medium main body and a cuboid cavity completely embedded in the high-refractive-index medium main body; the center of the cavity coincides with the center of the high-refractive-index medium body, and the long axis direction of the cavity has a design orientation angle relative to the x axis in the plane where the high-refractive-index medium body is located. By setting the design orientation angle distribution of the cavity, the metamaterial lens can generate a geometric phase modulated by the design orientation angle for incident circularly polarized light in the cross circular polarization channel, and generate a propagation phase determined by an electromagnetic resonance mode of the high-refractive-index medium main body in the same circular polarization channel. According to the invention, the super-structure lens can cover full-object-distance continuous real image imaging from zero to infinity without mechanical movement or complex stacking.

The purpose of the present invention is to reduce the number of components of and size of a coaxial connector. This coaxial connector comprises: an inner conductor; a dielectric body that surrounds the periphery of the inner conductor; and an outer conductor that surrounds the periphery of the dielectric body. The outer conductor includes: an outer conductor cylinder fit to the outside of the dielectric body in a state of being in contact with the dielectric body; and a plurality of spring pieces integrally formed with the outer conductor cylinder and extending from an opening edge of the outer conductor cylinder.

A plasma processing apparatus comprises a processing chamber providing a processing space, an electromagnetic wave generator configured to generate plasma in the processing space by supplying electromagnetic waves, a first dielectric body having a first surface facing the processing space, an electromagnetic wave supply part configured to supply the electromagnetic waves to the processing space via the first dielectric body and a resonator array structure along the first surface of the first dielectric body. The resonator array structure includes resonators that are capable of resonating with a magnetic field component of the electromagnetic waves and have a size smaller than a wavelength of the electromagnetic waves. The resonators have a structure in which C-shaped ring members made of a conductor are provided on one surface of a dielectric plate. At least one of the C-shaped ring members serves as a probe for measuring information on the plasma.

The invention relates to a flip-chip integrated circuit package of the ball array type, wherein:the underside of the package includes a plurality of receiving pads for signal, ground and solder balls;stacks of signal and ground vias, electrically connected to respective receiving pads, pass vertically through the package's dielectric body forming a quasi-coaxial structure. In an upper part of the package body:the signal vias are electrically connected to a lesser number of signal conductive bumps protruding from the upper surface of the package's dielectric body; andat least two ground vias are connected by means of conductive projections to respective ground conductive bumps, forming a ring around the signal conductive bumps.

Disclosed herein are power modules with enhanced thermal conductivity. In certain embodiments, a power module includes a circuit board, an inductor assembly attached to a first or top side of the circuit board, and a semiconductor die attached to a second or bottom side of the circuit board opposite the first side. The power module also includes a thermally conductive package at least partially surrounding a dielectric body of the inductor assembly. The thermally conductive package is used to transfer heat from the semiconductor die to a cold plate or heat sink that can be attached on the opposite side of the circuit board from the inductor assembly.

The embodiment of the present application relates to the technical field of wireless communication, and discloses especially an antenna structure and a mobile terminal, the mobile terminal comprises a shell, the antenna structure comprises an antenna and a telescopic driving assembly, the antenna is at least partially arranged in the shell, the antenna comprises a dielectric body, at least one group of spiral radiation arms and an antenna circuit board, the dielectric body extends along the height direction of the antenna, the at least one group of spiral radiation arms spirally wind around the side surface of the dielectric body along the height direction of the antenna, the antenna circuit board is arranged at one end of the dielectric body, the antenna circuit board is located in the shell, the antenna circuit board is electrically connected with the at least one group of spiral radiation arms, the telescopic driving assembly is arranged in the shell, and the telescopic driving assembly is used for driving the antenna to at least partially extend out of the shell or retract into the shell along the height direction of the antenna. The antenna structure realizes the function that the antenna can extend out of the shell or retract into the shell through the telescopic driving assembly, not only effectively avoids the problem that the fixed antenna is easily interfered and shielded in the mobile phone, but also improves the communication quality.

This invention discloses a small, equal-band dual-frequency transceiver based on wireless communication technology. It includes a ceramic dielectric body, a tuning element, a multilayer circuit body, and an external electrode assembly. The tuning element is disposed on top of the ceramic dielectric body. The multilayer circuit body is disposed inside the ceramic dielectric body and electrically connected to the tuning element through a via structure. The multilayer circuit body includes a low-frequency channel filter and a high-frequency channel filter. The external electrode assembly is disposed at the bottom of the ceramic dielectric body. The low-frequency channel filter outputs signals within a set low-frequency band, and the high-frequency channel filter outputs signals within a set high-frequency band. This invention achieves a large capacitance value within a small volume by using vertical coupling. By setting the tuning element, the stopband bandwidth and suppression depth of the dual-frequency transceiver can be flexibly adjusted by changing the value of the tuning element, resulting in miniaturization, wide stopband, high suppression, and tunability.

This utility model discloses a solderless flexible printed circuit board RF connector, including an outer conductor assembly, an inner conductor assembly, and a dielectric body arranged coaxially. The inner conductor assembly is fixed in the outer conductor assembly through the dielectric body. A positioning plate is provided on the surface of the outer conductor assembly at its end position. The positioning plate has mounting holes. This utility model uses an elastic connection mechanism composed of springs, steel balls, and the inner conductor to automatically adapt to tolerances, eliminate contact gaps caused by vibration, and ensure a reliable electrical connection between the inner conductor assembly and the printed circuit board. Axial fixation is achieved through the mounting holes on the positioning plate and screws, without interfering with the radial floating of the module. It is suitable for systems with limited installation space, simplifies the installation process, and improves installation efficiency.

This disclosure relates to an embedded wafer-level ball grid array package (eWLB package). The eWLB package (1) includes: a molded body (2) encapsulating an integrated circuit (3), a dielectric (4) disposed in the molded body, and a microstrip line (5) electrically connected to the integrated circuit. The end (5a) of the microstrip line is disposed below the dielectric in a direction toward a connection side (8) including a connection element (7) of the eWLB package. The dielectric has a dimension in a direction perpendicular to the microstrip line equal to one-quarter of the designed wavelength of the microstrip line. The eWLB package is used to connect to a printed circuit board (PCB) (100) via the connection element, the PCB having a waveguide (101) with a channel-like opening such that the end of the dielectric and the microstrip line is aligned with the waveguide.

An integrated circuit includes a memory-cell configured to store a piece of data. The memory cell includes a state transistor having a floating gate configured to store a charge representative of the piece of data and a control gate. A capacitive structure includes a first electrically-conductive body coupled to the floating gate, a second electrically-conductive body and a dielectric body between the first and second electrically-conductive bodies. A generation circuit is configured to detect an invasive or non-invasive attack and generate in response thereto a voltage applied to the second electrically-conductive body to generate a leakage current between the first and second electrically-conductive bodies through the dielectric body. The leakage current is applied to the floating gate in order to modify the charge at the floating gate and corrupt the stored piece of data.

A dielectric waveguide filter includes a dielectric body including a first and a second surfaces. The dielectric waveguide filter includes a metal plating covering an outer surface of the dielectric body. The dielectric waveguide filter includes a coupling structure formed a portion of the second surface. The coupling structure includes a coupling groove extending from the second surface into the dielectric body and including a coupling surface parallel to the second surface. The coupling structure includes an inner conductor at an annular center of the coupling groove that surrounds the inner conductor and separates the dielectric body into the inner conductor and an outer conductor. The inner conductor in the coupling groove includes a metal surface on the second surface. A distance between the coupling surface and the second surface is related to a coupling degree of the coupling structure.