A process for the preparation of a curable thermally conductive composition and the process comprises the steps of: (I) preparing an admixture comprising the following components (A), (B1), (C), (D) and (E): (A) 3 wt% to 10 wt% of a Q-branched alkenyl functional polyorganosiloxane having at least three terminal alkenyl groups per molecule, and having a
viscosity of from 25 mPa * s to 2000 mPa * s as determined at 25 DEG C according to ASTM D445-21 using a
viscometer of the glass capillary Cannon-Finsky type; and a method for preparing the same, wherein the
viscosity is from 25 mPa * s to 2000 mPa * s as determined at 25 DEG C using a
viscometer of the glass capillary Cannon-Finsky type; (B1) a silyl-
hydride functional polysiloxane crosslinker containing at least two silyl-
hydride groups per molecule, and present in a concentration that provides a
molar ratio of
silicon-bonded
hydrogen atoms in (B1) to alkenyl groups in the Q-branched alkenyl functional polyorganosiloxanes in the range of 0.2 to 0.35; (C) 90 wt% or more of a thermally conductive filler; (D) a filler treatment agent; and (E) a
platinum-based
hydrosilylation reaction catalyst; (II) curing the admixture obtained from step (I) by heat, thereby forming a pre-cured
composite material; and (III) mixing the pre-cured
composite material obtained from step (II) with (B2) a silyl-
hydride functional polysiloxane cross-linking agent containing at least two silyl-hydride groups per molecule; thereby obtaining a curable thermally conductive composition; wherein the
molar ratio of the total
silicon bonded
hydrogen atoms in the silyl-hydride functional polysiloxane crosslinkers (B1) and (B2) to the alkenyl groups in the Q-branched alkenyl functional polyorganosiloxane (A) is greater than 0.45; and wherein the weight percentages are relative to the weight of the curable thermally conductive composition.