Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Desoldering device, system and method for through-hole component

A component and heating device technology, which is applied in the field of through-hole component desoldering devices, can solve the problems of low success rate and efficiency of desoldering, pad damage, etc.

Inactive Publication Date: 2020-09-25
MAIPU COMM TECH CO LTD
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the purpose of the embodiments of the present application is to provide a through-hole component desoldering device, system and method to improve the problems existing in the prior art that are easy to cause damage to the pad, and the success rate and efficiency of desoldering are low.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Desoldering device, system and method for through-hole component
  • Desoldering device, system and method for through-hole component
  • Desoldering device, system and method for through-hole component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032]The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0033] Through the research of the applicant, it is found that for the desoldering of electronic components on the circuit board, a traditional method commonly used is to use a high-temperature electric soldering iron to contact the pins and pads of through-hole devices and heat them one by one, and use a tin suction gun to remove the melted solder from the The solder in the pad and hole is sucked out. When the solder in all pin holes of the device is sucked out, the through-hole device is taken out, and the desoldering is completed.

[0034] In this desoldering method, the tin suction gun uses air negative pressure to absorb the melted solder in the hole. The suction nozzle needs to fit closely with the pad orifice, otherwise it cannot absorb the solder in the hole; because the heating of the electri...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The application provides a desoldering device, system and method for a through-hole component, and relates to the technical field of circuit board welding. The device comprises a cylindrical shell; ahigh-pressure gas passage and a low-pressure gas passage are arranged in the shell; a high-pressure gas inlet of the high-pressure gas passage and a low-pressure gas inlet of the low-pressure gas passage are arranged at the top end of the shell; a high-pressure gas outlet of the high-pressure gas passage and a low-pressure gas outlet of the low-pressure gas passage are arranged at the bottom end of the shell; the low-pressure gas passage is arranged by surrounding the high-pressure gas passage; the high-pressure gas inlet communicates with a high-pressure gas outlet of a gas source device; andthe low-pressure gas inlet communicates with a low-pressure gas outlet of the gas source device. The device continuously and uniformly heats a pad of the through-hole component by low-pressure gas, and applies uniform thrust to the pad and through holes by the high-pressure gas to complete desoldering, thus avoiding mechanical damage, and improving the success rate and efficiency of desoldering.

Description

technical field [0001] The present application relates to the technical field of circuit board soldering, in particular, to a device, system and method for desoldering through-hole components. Background technique [0002] In the electronics industry, the installation of through-hole devices on circuit boards is that each pin passes through the pad hole of the printed board, and is soldered to the pad and the hole with solder. When the through-hole component is damaged or the model is replaced, Rework is required, and desoldering is to remove the solder in the pad and the hole and smoothly take out the old components and clean the solder in the pad and the hole. Solder is some alloy materials, such as lead-tin alloy, tin-silver-copper alloy, they have the characteristics of melting when the temperature is higher than the eutectic point, and solidifying when the temperature is lower than the eutectic point, the temperature must be higher than the eutectic point when desolderi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K1/018B23K3/00B23K3/08H05K3/22
CPCB23K1/018B23K3/00B23K3/08H05K3/225H05K2203/176
Inventor 黄大勇
Owner MAIPU COMM TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com