Antioxidant tin-copper alloy brazing filler metal

A technology of alloy solder and tin oxide, which is applied in metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problem that liquid flux is not easy to store, and achieve improved anti-oxidation protection, good mechanical properties, Effect of improving tensile strength properties

Active Publication Date: 2016-02-03
上海一远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing routines generally provide additional flux, and conventional flux is generally prepared as liquid flux, but liquid flux is not easy to store

Method used

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  • Antioxidant tin-copper alloy brazing filler metal

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] In the present embodiment, the anti-oxidation tin-copper alloy solder comprises the mass percent of the following components:

[0020] Ag: 0.1%; Cu: 1.0%; anti-oxidation flux material: 3.0%; the rest is Sn and unavoidable impurity elements;

[0021] Taking the anti-oxidation flux material as a whole, the anti-oxidation flux material is mainly made of the following raw materials in mass percentage:

[0022] Rare earth additive: 70%; organic acid: 2.0%; ammonium chloride 3.0%; ammonium fluoride 1.0%; ethyl acetate: 4.0%; Diacid, co-solvent is deionized water.

[0023] In the present embodiment, the anti-oxidation tin-copper alloy solder can be prepared by the following method:

[0024] Weigh the raw materials according to the above mass percentage, add Sn into the furnace, and control the temperature at 300°C to completely melt; then, when the temperature is raised to 320°C, add metal Ag into the Sn liquid and stir fully to form an alloy liquid; after the melting is co...

Embodiment 2

[0026] In the present embodiment, the anti-oxidation tin-copper alloy solder comprises the mass percent of the following components:

[0027] Ag: 1.0%; Cu: 0.5%; anti-oxidation flux material: 1.0%; the rest is Sn and unavoidable impurity elements;

[0028] Taking the anti-oxidation flux material as a whole, the anti-oxidation flux material is mainly made of the following raw materials in mass percentage:

[0029] Rare earth additive: 30%; organic acid: 10%; ammonium chloride 10%; ammonium fluoride 5.0%; ethyl acetate: 5.0%; , the co-solvent is deionized water.

[0030] The specific preparation method of the oxidation-resistant tin-copper alloy solder in this embodiment is the same as that in Embodiment 1, and will not be repeated here.

Embodiment 3

[0032] In the present embodiment, the anti-oxidation tin-copper alloy solder comprises the mass percent of the following components:

[0033] Cu: 0.8%; anti-oxidation flux material: 0.5%; the rest is Sn and unavoidable impurity elements;

[0034] Taking the anti-oxidation flux material as a whole, the anti-oxidation flux material is mainly made of the following raw materials in mass percentage:

[0035] Rare earth additive: 50%; organic acid: 8%; ammonium chloride 10%; ammonium fluoride 8.0%; ethyl acetate: 3.0%; Fatty acid, co-solvent is deionized water.

[0036] The specific preparation method of the oxidation-resistant tin-copper alloy solder in this embodiment is the same as that in Embodiment 1, and will not be repeated here.

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PUM

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Abstract

The invention relates to an antioxidant tin-copper alloy brazing filler metal, belongs to the technical field of welding materials, solves the problems about how to reduce the output of welding slag and improve the oxidation resistance of the brazing filler metal, and provides the antioxidant tin-copper alloy brazing filler metal. The alloy brazing filler metal comprises the following components by mass percent: 0%-1.0% of Ag, 0.1%-1.0% of Cu, 0.01%-3.0% of an antioxidant welding-aiding material, and the balance of Sn and unavoidable impurity elements. According to the antioxidant tin-copper alloy brazing filler metal, the antioxidative protective function can be improved, the air and the environment are prevented from oxidizing and corroding the brazing filler metal, the oxidization resistance of the brazing filler metal is improved, the welding performance is improved, the weldability is improved, and the reject ratio of pseudo soldering and desoldering is decreased, so that the welding slag and oxidizing slag are reduced, the product is enabled to have relatively good mechanical performance, and the tensile strength, electrical conductivity, weldability and elongation are improved.

Description

technical field [0001] The invention relates to an oxidation-resistant tin-copper alloy solder, which belongs to the technical field of welding materials. Background technique [0002] With the rapid development of the electronics industry, the requirements for electronic products are getting higher and higher. There are many types of solder used in electronic products. Most of the existing lead-free solders are Sn-Ag, Sn-Cu, Sn-Ag-Cu alloys, etc. The disadvantage is that Sn-Cu has a higher melting point, and the Ag content in Sn-Ag and Sn-Ag-Cu is higher, resulting in higher alloy costs. On the other hand, during the welding and melting process of alloys, metal oxide waste slag will inevitably be produced, resulting in a large amount of raw material loss. For example, the number of tin-copper alloys used in electronic lead-free solders in my country reaches more than 100,000 tons every year, and 15% of the oxidized slag is produced in the welding process, and the economic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/262B23K35/362
Inventor 刘婷吴芝锭黄玲霞朱伟武
Owner 上海一远电子科技有限公司
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