Circuit board repairing method based on movable induction heating

Abstract

The invention discloses a movable heating circuit board repair method, which comprises the steps of S1, data acquisition, S2, induction heating desoldering, S3, new element resoldering and the like. The movable heating circuit board repair method has the advantages of being flexible in machining, high in repair efficiency, high in repair success rate, wide in machining coverage, high in adaptability, sufficient in heat, high in heat source controllability, capable of meeting the desoldering or welding requirements of elements in a wide size range, capable of well achieving the expected heating effect, accurate in positioning, high in repair efficiency, high in repair efficiency, high in repair success rate and high in heat source controllability. And the work is stable.

Description

technical field [0001] The invention belongs to the technical field of precision machining, and in particular relates to a circuit board repairing machine. Background technique [0002] The circuit board is often composed of a substrate, solder and electronic components. After the circuit is designed, the circuit part of the circuit is printed on the substrate. For the position of the electronic components in the circuit design, it is necessary to reserve a pad on the substrate. , when manufacturing, move the specified components to their corresponding positions, and put their metal pads one by one to the pads on the substrate. After applying solder on the pads, heat the solder with a designated heat source to melt it. The solder adheres the electronic components to the pads, and the electronic components are thus connected to the substrate to complete the soldering process of the circuit board. [0003] With the development of electronic technology and the progress of pack...

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Problems solved by technology

[0003] With the development of electronic technology and the progress of packaging technology, the circuit scale is getting larger and larger, the circuit layout is getting more and more compact, the volume of individual electronic components is getting smaller and smaller, and the electronic components that need to be soldered on a single substrate are also becoming more and more The spacing between adjacent electronic components is getting smaller and smaller, and the processing accuracy of the circuit board manufacturing process is also getting higher and higher. It is for the same reason that after a single circuit board is formed once, the local area Individual electronic components due to their own faults or processing errors, the probability of component damage, offset, missing or falling off in the processed circuit board is also multiplied, but the prior art lacks the protection of the once-molded circuit board. There are no effective remedial measures for defective products in the production process, so that once one or several electronic components fail, the entire circuit board is completely scrapped, which not only greatly increases production costs, but also causes The waste of raw materials, so it can be said, how to design a circuit board repair method, so that it can make corresponding repair operations for circuit boards with partial failures and individual electronic components that need to be repaired, and repair defective products in the production process , is a technical problem urgently needed to be solved by those skilled in the art

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