Integrated desoldering system conducting upper hot air heating and lower hot air heating synchronously

Abstract

Provided is an integrated desoldering system conducting upper hot air heating and lower hot air heating synchronously. The integrated desoldering system comprises an upper heating device, a lower heating device and a synchronization mechanism. The upper heating device is composed of an upper heating group, an X-axis cross beam, a Y-axis cross beam, an upper heating cover, an upper heating tuyere, an X-direction guide rail, a Y-direction guide rail, a Z-direction guide rail, a ball screw and an upper synchronous wheel. The lower heating device is composed of a lower heating group and a heater through-connection body. The synchronization mechanism is composed of a manipulator front fixing plate, a manipulator upper arm, an arm connecting part, a manipulator front arm, an upper inductor, a lifting induction sheet, a lower inductor, a manipulator rear fixing plate, manipulator side fixing plates, a manipulator upper fixing plate, a ball screw, a lead screw nut, an arm braking component and a manipulator lower fixing plate. According to the integrated desoldering system conducting upper hot air heating and lower hot air heating synchronously, the upper heating group and the lower heating group move synchronously and move freely in the X direction, the Y direction and the Z direction; the desoldering and surface mount precision is effectively guaranteed; the automation is high, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of PCB board desoldering, in particular to an integrated desoldering system with synchronous heating of upper and lower hot air. Background technique [0002] In the field of automatic assembly production and repair of circuit boards, there are more and more high-end precision electronic products. When precision mounting, heating and cooling of components, the accuracy, uniformity and stability of temperature control are very important. The accuracy and stability of the temperature are mainly reflected in the heating and cooling time, the heating and cooling rate and the temperature uniformity of the heated area. In addition to highly automated applications, it is also necessary to have mechanisms such as miniaturization, modularization, precise mounting, and high-precision temperature control to ensure the operating accuracy of the equipment. [0003] Traditional upper and lower heaters (such as figure 1 ...

AI Technical Summary

Problems solved by technology

In the automatic assembly production and rework of circuit boards, because the upper and lower heaters cannot be completely aligned, there will be inconsistencies in the temperature of the front and back of the PCB board, resulting in many problems such as poor local welding of BGA, stable performance and accuracy: a. Traditionally, heaters It is an independent movement, and its effect is not great. Actually, in the automatic assembly production and repair of circuit boards, the upper heater and the lower heater must be heated at the center of the component at the same time to ensure the success rate of desoldering; this traditional structure Affects work quality and production efficiency; b. Traditionally, the heater is fixed, which cannot adapt to the automatic assembly and repair of high-end circuit boards. It is limited in actual operation, and the PCB board is heated and deformed, resulting in poor desoldering accuracy and cannot be guaranteed Low success rate and work efficiency

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