Automatic desoldering and detinning equipment
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 东莞市崴泰电子有限公司
- Publication Date
- 2017-05-24
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Abstract
Description
[0001] Technical field:
[0002] The invention relates to the technical field of electronic circuit board rework equipment, in particular to an automatic desoldering and tin removal equipment.
[0003] Background technique:
[0004] At present, in the circuit board assembly and manufacturing industry, when the device is reworked and soldered, whether it is a BGA pad or a through-hole device pad, it is necessary to remove the residual solder. Due to the current manual operation method, the method of using the electric soldering iron tip to suck the tin strip is used to perform contact desoldering operations on the pads, which will cause the pads to loosen, fall off, and shrink copper. In severe cases, the entire circuit will be damaged. The board is completely scrapped, resulting in huge cost loss, and the subsequent treatment will also cause great pollution to the environment.
[0005] Invention content:
[0006] The purpose of the present invention is to overcome the shortco...