Automatic desoldering and detinning equipment

Abstract

The invention relates to automatic desoldering and detinning equipment. The automatic desoldering and detinning equipment comprises a main frame; the main frame is provided with a horizontal workbench; a workpiece fixing jig and a workpiece preheating table are installed on the horizontal workbench; a portal frame is further erected on the horizontal workbench and provided with an x-direction sliding seat and a z-direction sliding seat; a desoldering assembly and a detinning assembly are installed on the two side edges of the surface of the z-direction sliding seat correspondingly; and a connection plate is further arranged on the outer side of a third servo motor located on a first longitudinal installation plate, a CCD industrial camera is fixed to the upper portion of the connection plate, and the lower portion of the connection is located between the desoldering assembly and the detinning assembly and provided with an LED light source matched with the CCD industrial camera. According to the automatic desoldering and detinning equipment, before being subjected to desoldering and detinning processes, workpieces are all preheated through the workpiece preheating table under the workpieces, the situation that a circuit board is damaged due to the fact that the temperature difference between the upper portion and the lower portion is too large and dilatation coefficients are different can be avoided, the fault rate and scrape rate of the circuit board are substantially decreased, and environment protecting is facilitated.

Description

[0001] Technical field: [0002] The invention relates to the technical field of electronic circuit board rework equipment, in particular to an automatic desoldering and tin removal equipment. [0003] Background technique: [0004] At present, in the circuit board assembly and manufacturing industry, when the device is reworked and soldered, whether it is a BGA pad or a through-hole device pad, it is necessary to remove the residual solder. Due to the current manual operation method, the method of using the electric soldering iron tip to suck the tin strip is used to perform contact desoldering operations on the pads, which will cause the pads to loosen, fall off, and shrink copper. In severe cases, the entire circuit will be damaged. The board is completely scrapped, resulting in huge cost loss, and the subsequent treatment will also cause great pollution to the environment. [0005] Invention content: [0006] The purpose of the present invention is to overcome the shortco...

AI Technical Summary

Problems solved by technology

Due to the current manual operation method, the method of using the electric soldering iron tip to suck the tin strip is used to perform contact desoldering operations on the pads, which will cause the pads to loosen, fall off, and shrink copper. In severe cases, the entire circuit will be damaged. The board is completely scrapped, resulting in huge cost losses, and the subsequent treatment will also cause great pollution to the environment

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