Manufacturing method of asymmetric plate

A manufacturing method and asymmetric technology, which can be used in printed circuit manufacturing, multi-layer circuit manufacturing, and insulating substrate/layer processing, etc., can solve problems such as warpage of asymmetric circuit boards, improve reliability and reduce warpage. The degree of curvature, the effect of solving the virtual welding

Active Publication Date: 2020-08-07
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a method for manufacturing an asymmetric board, aiming at solving the warping problem of the existing asymmetric circuit board

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  • Manufacturing method of asymmetric plate
  • Manufacturing method of asymmetric plate
  • Manufacturing method of asymmetric plate

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Embodiment Construction

[0041] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0042] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly fixed or disposed on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are for convenience of description only, rather than indicating or implying the refer...

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Abstract

The invention is applicable to the technical field of circuit plate manufacturing, and provides a manufacturing method of an asymmetric plate. The manufacturing method of the asymmetric plate comprises the steps of manufacturing a mother plate, manufacturing a second daughter plate, carrying out thermal compression bonding on the mother plate and the second daughter plate, finished plate milling,and further comprises at least one of the three steps of laying copper on the connection positions, except the second copper layer on the outermost layer, of the mother plate to obtain a copper layingarea, digging copper at the connection position of a third copper layer protection layer when the second daughter plate is manufactured and performing depth control milling on each spliced plate fromone side of the second core plate at the connection position to obtain a depth control groove after the finished plate is milled.Any one of the three steps is beneficial to reducing the warping degree of the asymmetric plate after being heated, so that the problems of pseudo soldering and desoldering of a customer after a circuit plate finished product is assembled are solved, and the reliabilityof the product is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing an asymmetrical board. Background technique [0002] With the wide application of automotive radar, the mixed pressure and asymmetric stacking of different materials are more and more widely used in the design of radar boards. Different from the asymmetric lamination of conventional materials, the asymmetric lamination of the radar board is mainly composed of high-frequency materials and ordinary FR4 materials. Generally, one high-frequency core board is matched with multiple FR4 core boards. Pressed together. Moreover, in order to ensure signal transmission efficiency and reduce loss, the outermost layer where the asymmetric structure is located is usually a high-frequency core board, and the high-frequency core board usually contains PTFE (polytetrafluoroethylene, polytetrafluoroethylene) material. In addition, the assembly is bas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/4611H05K3/0044H05K3/0052H05K1/0271H05K3/0097H05K3/4688H05K2201/068H05K2201/09036H05K2203/061
Inventor 王俊陈前陈晓青胡奇峰
Owner SHENZHEN KINWONG ELECTRONICS
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