44results about "Printed circuit simultaneous processing" patented technology

The invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method, which comprises the following steps of: 1, preparing raw materials, adding the prepared raw materials into a fuse machine, and changing solid raw materials into liquid raw materials; 2, liquid raw materials are added into a mold machining device, and machining of the circuit board is completed; step 3, carrying out anti-corrosion treatment on the processed circuit board; 4, performing line drawing treatment on the circuit board subjected to the anti-corrosion treatment; step 5, performing punching treatment on the circuit board after line drawing is completed; and step 6, welding the punched circuit board to complete manufacturing of the PCB, the method can process a plurality of circuit board materials at one time, and the speed of manufacturing the PCB is further improved.

A semifinished product (100) which comprises a sacrificial structure (102) and two component carriers (104) releasably formed on opposing main surfaces of the sacrificial structure (102), wherein each of the component carriers (104) comprises at least one electrically insulating layer structure (114), and at least one electrically conductive layer structure (116), and wherein the two electrically insulating layer structures (114), each of which relating to a respective one of the component carriers (104), located closest to the sacrificial structure (102) are pure or unprocessed electrically insulating layers without electrically conductive material therein.

A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.

An electronic board includes: a stack including at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, where one of the plurality of electrically conductive layer structures is disposed on one major surface of the at least one electrically insulating layer structure, and the other of the plurality of electrically conductive layer structures is disposed on the other major surface of the at least one electrically insulating layer structure; and another electrically conductive layer structure of the plurality of electrically conductive layer structures is disposed on another opposite major surface of the at least one electrically insulating layer structure; a via formed in the stack and laterally delimited by a conductive material; at least one plating layer disposed on at least portions of the two opposite major surfaces of the stack and on the sidewalls of the stack; an axial annular projection disposed at one end of the through hole; and a radial annular projection disposed at a sidewall of the stack. The invention also provides a method for manufacturing the electronic board.

A system (10) for separating PCB elements (2') (printed circuit board) from multiple blocks (2) of PCB elements and for feeding them to an operating machine is described. The system (10) comprises: - a first set of separation lines (20) for separating the PCB elements (2') from their respective multiple blocks (2) of PCB elements, each separation line (20) comprising a separation station (24) and a transport system (21 A, 2 IB) for moving a plurality of workpiece-holding units (22), configured to receive, each, a multiple block (2) of PCB elements, at the separation station (24), said separation station being configured to separate the PCB elements (2') from their respective multiple blocks (2) of PCB elements without removing them from the workpiece-holding units (22); and - a second set of feeding lines (40) for feeding the separated PCB elements (2') to the operating machine, each feeding line (40) comprising a conveyor (41) configured for moving a mobile unit (42) configured to receive the separated PCB elements (2') of at least one multiple block (2) of PCB elements.

A micro power distribution box is provided which includes a device, a connector / housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate in overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector / housing in a manner which prevents the device from being removed from the connector / housing.

A common conveyance jig that is a conveyance jig employed to manufacture a circuit board including a board formed from a metal material, an insulation layer fixed on the board, and a circuit part formed from an electroconductive material and fixed on the insulation layer. The common conveyance jig includes a base part that supports the board from below, and a plurality of movement-restricting units that detachably engage with the base part and restrict displacement, in a horizontal direction, of the board supported from below by the base part.

A miniature power distribution box is provided, comprising: a device having a substrate, a first finger, a second finger, and an electrical component, the first and second fingers having a first portion, a second portion, and a third portion, the substrate being overmolded to the first portion of the first and second fingers, the substrate not being overmolded to the second portion or the third portion of the first and second fingers, the second portion of the first and second fingers extending outwardly from the substrate, the third portion of the first and second fingers being exposed via at least one aperture disposed through the substrate, the electrical component being directly mounted to the third portion of the first and second fingers so as to electrically connect the electrical component to each of the first finger and the second finger; a connector / housing configured to receive the device therein and configured to connect to a mating connector; and a cover configured to be secured to the connector / housing in a manner that prevents the device from being removed from the connector / housing.

Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).

Provided is a collective board capable of improving work efficiency for obtaining individual circuit boards from a collective board in which the circuit boards are juxtaposed in a lattice shape. The collective board is provided with a product portion 3 in which a plurality of circuit boards 17 having a circuit pattern 15 on an insulating substrate 13 are juxtaposed in a first direction and a second direction intersecting each other in a lattice shape, a slit 7 spanning between at least ends of the product portion 3 in the first direction and penetrating, in a thickness direction, a portion between the circuit boards 17 adjacent to each other in the second direction, a coupling portion 9 coupling the circuit boards 17 adjacent to each other in the second direction at least at one end of the product portion 3 in the first direction, and grooves 11 spanning between ends of the product portion 3 in the second direction, being located between the circuit boards 17 and the coupling portion 9 adjacent to each other in the first direction and between the circuit boards 17 adjacent to each other in the first direction, and non-penetrating in the thickness direction.

Precision screen printing is described that can enable sub-micron uniformity of metallized material printed on green sheet ceramic. In some examples, a disc having electrical traces is formed by screen printing a paste containing metal in a pattern of electrical traces on a ceramic green sheet, and processing the printed green sheet to form a disc of a workpiece carrier. In some examples, the printing includes applying a squeegee of a screen printing machine to the printed green sheet in a squeegee direction while the green sheet is on a printer bed of the screen printing machine. The method further includes mapping the printer bed at a plurality of locations along the squeegee direction, identifying non-uniformities in the printer bed mapping, and modifying a printer controller of the screen printing machine to compensate for the mapped non-uniformities in the printer bed.

1. A method for manufacturing a plurality of electrical nodes (10), the method comprising: providing (410) a plurality of electronic circuits onto a first substrate (11), such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate, each of the electronic circuits comprising a circuit pattern (14) and at least one electronic component (12) connected to the circuit pattern (14), the electronic circuits being spaced apart from one another on the first substrate (11), thereby defining blank areas (30) surrounding each of the plurality of electronic circuits, respectively; providing (420) a potting or casting material, embedding each of the plurality of electronic circuits in the potting or casting material, and subsequently solidifying (430), including optionally curing, the potting or casting material to form a filler material layer of the plurality of electrical nodes (10).

A wiring board includes a core including a first glass plate, the core having a first primary surface, a second primary surface opposite to the first primary surface, and a side surface continuous with the first primary surface and the second primary surface, the side surface having a plurality of grooves reaching the first primary surface and the second primary surface, a first build-up layer provided on the first primary surface, a second build-up layer provided on the second primary surface, a plurality of through-metal trench layers provided inside the plurality of grooves, respectively, a first metal layer provided on the first primary surface and connected to the plurality of through-metal trench layers, and a second metal layer provided on the second primary surface and connected to the plurality of through-metal trench layers.

The invention provides a method for manufacturing a circuit pattern assembly with a release film, which can prevent bad conditions caused by etching from the surface. In the method for manufacturing the circuit pattern assembly with the release film, the circuit pattern assembly (2) comprises dummy patterns (4) arranged in gaps (G) between a plurality of circuit patterns (3) and first gaps (G1) between the dummy patterns (4) and the circuit patterns (3). The method for manufacturing the circuit pattern assembly with the release film comprises the following steps of: providing a first back surface concave part (G1R) corresponding to the first gap (G1) and a second back surface concave part (G2R) corresponding to the second gap (G2) between the conductive patterns (3a) on the back surface of the metal plate (9); a step for attaching a release film (5) to the rear surface of the metal plate (9) provided with the first rear surface recess (G1R) and the second rear surface recess (G2R); and a step for removing, by etching, a first region corresponding to the first rear surface recess (G1R) and a second region corresponding to the second rear surface recess (G2R) on the surface of the metal plate (9).

The present disclosure relates to a multilayer circuit board manufacturing apparatus. The present disclosure includes an uncoiler configured to provide a member, a processing unit configured to perform a process on the member provided from the uncoiler, a coiler configured to wind the member on which the process is completed in the processing unit, and a tension adjustment unit located in at least one of a region between the uncoiler and the processing unit, a region between the processing unit and the coiler, and a region between the uncoiler and the coiler, and adjusting a tension of the member.

A method of manufacturing a flexible circuit comprised of conducting and insulating layers in an extended length format using multi-point registration to benefit subsequent processing and utilizing one pass printing for up to 110 inches in conjunction with a large format press or alternatively a combination of step press cycles.

An assembly sheet includes a supporting portion, a plurality of wiring circuit boards, and a joint portion. The supporting portion supports the plurality of wiring circuit boards. The supporting portion surrounds the plurality of wiring circuit boards while being separated from the plurality of wiring circuit boards by an interval. The joint portion joins the plurality of wiring circuit boards to the supporting portion. The plurality of wiring circuit boards includes a first wiring circuit board and a second wiring circuit board. The second wiring circuit board is arranged next to the first wiring circuit board while being separated from the first wiring circuit board by an interval. The second wiring circuit board is symmetrical to the first wiring circuit board with respect to a point centered therebetween. The supporting portion includes a first and second mark. The second mark is asymmetrical to the first with respect to the point.

The present invention relates to a batch alignment device for a screen printer and a batch alignment method using the same. Since a plurality of printed circuit boards can be aligned simultaneously and quickly in alignment holes formed in a single alignment jig, simplification of parts and weight reduction of the device are possible, shortening of the production process and time, improvement of productivity, and mass production through this are possible. By aligning only the X-axis and Y-axis on the plane of an intermediate printed circuit board where the mask and the alignment jig coincide within the alignment jig, alignment of a plurality of printed circuit boards is completed, and at the same time, high-quality printing that coincides with the printing pattern of the alignment jig and the mask can be quickly performed on a plurality of printed circuit boards simultaneously.

There is provided a method for manufacturing a wiring board in which unintentional release of a carrier during downsizing is effectively suppressed and a first substrate can be reliably laminated onto a second substrate. This method for manufacturing a wiring board includes the steps of: providing a laminated sheet including a carrier, a release layer, and a metal layer in order, wherein the carrier has a flat region and an uneven region on at least a surface on the metal layer side, and wherein the uneven region is provided in a pattern surrounding the flat region; forming a resin-containing layer on a surface of the metal layer to obtain a carrier-attached first substrate; cutting the carrier-attached first substrate according to the pattern of the uneven region to obtain an individualized carrier-attached first substrate; and laminating the individualized carrier-attached first substrate onto a second substrate so that the carrier is on the outside, to obtain a composite substrate.

Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).

A method of manufacturing a printed wiring board according to one aspect of the present disclosure is a method of manufacturing a printed wiring board from a printed wiring board sheet having a plurality of printed wiring board pieces. The method includes: determining, by an electrical inspection, whether each of the plurality of printed wiring board pieces is a non-defective product or a defective product; after the determining, selectively cutting out the non-defective product from the printed wiring board sheet; and inspecting an appearance of the non-defective product cut out in the cutting out. The method further includes passing on data about a non-defective product or a defective product to the cutting out, the data about a non-defective product or a defective product being obtained in the determining. In the cutting out, the non-defective product is cut out based on the data passed on in the passing on.

A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.

An assembly sheet as a wiring circuit board assembly sheet includes a substrate, a wiring pattern, and a dummy wiring pattern. The substrate includes a product region and a frame region adjacent to the product region. The wiring pattern is located on one side in a thickness direction of the substrate in the product region, and includes a first wiring and a second wiring thicker than the first wiring. The dummy wiring pattern is located on the one side in the thickness direction in the frame region, and includes a first dummy wiring and a second dummy wiring thicker than the first dummy wiring.

An electronic board (100) which comprises a stack (102) comprising at least one electrically insulating layer structure (104) and a plurality of electrically conductive layer structures (106, 108), wherein one of said plurality of electrically conductive layer structures (106) is provided on one main surface (110) of said at least one electrically insulating layer structure (104) and a further one of said plurality of electrically conductive layer structures (108) is provided on an opposing further main surface (112) of said at least one electrically insulating layer structure (104), a through hole (120) formed in the stack (102) and being laterally delimited by conductive material, at least one plating layer (122) provided on at least part of both opposing main surfaces (114, 116) of the stack (102) and on a lateral wall (118) of the stack (102), an axial annular protrusion (126, 128) provided at one extremity of the through hole (120), and a radial annular protrusion (130, 132, 134) provided at the lateral wall (118) of the stack (102).

The present invention discloses a method of reprocessing a physiological optical sensor. The method comprises the steps of removing an adhesive portion from a used physiological optical sensor; reusing sensing components of the physiological optical sensor, the sensing components comprising an individual flexible circuit (100) with a connector end (208), and a detector end (206) with an emitter (226), a detector (228), and a hook portion (227a, 227b, 227d), wherein the hook portion is configured to form an opening (227c) that the emitter (226) can attach to; providing a layer of foam (646) on both top and bottom, the foam layer covering the individual flexible circuit (100) and forming a covering which extends from the emitter (226) and detector (228) to the connector end (208); and attaching a new adhesive portion to physiological optical sensor.

The present invention relates to a batch alignment device for screen printers and a batch alignment method using the same, and can simultaneously, collectively, and quickly align multiple printed circuit boards in multiple alignment holes formed in one alignment jig to enable components to be simplified, the weight of a device to be reduced, production process and time to be shortened, and productivity to be improved and, accordingly, enable mass production, and can quickly implement high-quality printing, which corresponds to the alignment jig and a printing pattern of the mask, on the multiple printed circuit boards, simultaneously with completion of the alignment of the multiple printed circuit boards by aligning only the X-axes and Y-axes on the planes of the printed circuit boards in the alignment jig in a state where a mask and the alignment jig are aligned.