65results about "Printed circuit simultaneous processing" patented technology

The invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method, which comprises the following steps of: 1, preparing raw materials, adding the prepared raw materials into a fuse machine, and changing solid raw materials into liquid raw materials; 2, liquid raw materials are added into a mold machining device, and machining of the circuit board is completed; step 3, carrying out anti-corrosion treatment on the processed circuit board; 4, performing line drawing treatment on the circuit board subjected to the anti-corrosion treatment; step 5, performing punching treatment on the circuit board after line drawing is completed; and step 6, welding the punched circuit board to complete manufacturing of the PCB, the method can process a plurality of circuit board materials at one time, and the speed of manufacturing the PCB is further improved.

A semifinished product (100) which comprises a sacrificial structure (102) and two component carriers (104) releasably formed on opposing main surfaces of the sacrificial structure (102), wherein each of the component carriers (104) comprises at least one electrically insulating layer structure (114), and at least one electrically conductive layer structure (116), and wherein the two electrically insulating layer structures (114), each of which relating to a respective one of the component carriers (104), located closest to the sacrificial structure (102) are pure or unprocessed electrically insulating layers without electrically conductive material therein.

A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.

A workpiece support assembly (10, Fig.3) for supporting and aligning a plurality of singulated workpieces. The workpiece support assembly comprises an assembly body (11, Fig.3) and a plurality of supp

A surface mount technology (SMT) panel frame is provided. The SMT panel frame (100) includes a panel (110) and at least one copper material region (130) disposed on the panel (110). The panel (110) is substantially sufficient to securely hold at least one printed circuit board (120), the panel (110) is removably arranged around the printed circuit board (120), and predetermined areas on the printed circuit board (PCB) (120) are designated for placing data matrix codes (DMC), reference points and test points. At least one copper material region (130) is selectively arranged within the panel (110) based on the arrangement of the data matrix code, the reference and the test points such that the copper material region is aligned with the location and arrangement of the panel reference points, DMC and test points, thereby reducing the need of the entire panel (110) for copper.

An electronic board includes: a stack including at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, where one of the plurality of electrically conductive layer structures is disposed on one major surface of the at least one electrically insulating layer structure, and the other of the plurality of electrically conductive layer structures is disposed on the other major surface of the at least one electrically insulating layer structure; and another electrically conductive layer structure of the plurality of electrically conductive layer structures is disposed on another opposite major surface of the at least one electrically insulating layer structure; a via formed in the stack and laterally delimited by a conductive material; at least one plating layer disposed on at least portions of the two opposite major surfaces of the stack and on the sidewalls of the stack; an axial annular projection disposed at one end of the through hole; and a radial annular projection disposed at a sidewall of the stack. The invention also provides a method for manufacturing the electronic board.

A system (10) for separating PCB elements (2') (printed circuit board) from multiple blocks (2) of PCB elements and for feeding them to an operating machine is described. The system (10) comprises: - a first set of separation lines (20) for separating the PCB elements (2') from their respective multiple blocks (2) of PCB elements, each separation line (20) comprising a separation station (24) and a transport system (21 A, 2 IB) for moving a plurality of workpiece-holding units (22), configured to receive, each, a multiple block (2) of PCB elements, at the separation station (24), said separation station being configured to separate the PCB elements (2') from their respective multiple blocks (2) of PCB elements without removing them from the workpiece-holding units (22); and - a second set of feeding lines (40) for feeding the separated PCB elements (2') to the operating machine, each feeding line (40) comprising a conveyor (41) configured for moving a mobile unit (42) configured to receive the separated PCB elements (2') of at least one multiple block (2) of PCB elements.

An alignment system 10 for aligning a plurality of singulated workpieces (32A-F, Fig.5A) received within a printing machine within a horizontal (X-Y) plane. The system comprises a plurality of towers 14 spaced apart in the horizontal plane. Each tower has a head 16 configured to support a respective singulated workpiece thereon in use. The system further comprises an actuation tool 22 which is movable within the horizontal plane; and an actuation means (24, 26, 28, Fig.3) operatively connected to the actuation tool for driving the actuation tool within the horizontal plane. Each tower is associated with a respective locking system 30A-F, each locking system being independently operable to place its associated tower in a tool-locking state in which at least the head of the respective tower is locked relative to the actuation tool so as to prevent relative movement between the respective head and the actuation tool in the horizontal (XY) plane. Advantageously the towers are also selectively lockable relative to a base 12 of the alignment system, so that successive towers may be aligned by the actuation tool in a stepwise manner.

This invention discloses a PCB board flipping machine, belonging to the field of PCB board flipping technology. It includes a flipping machine body, a positioning and flipping assembly, and a wireless power supply dust removal assembly. A second conveyor belt is installed on the left side of the flipping machine body, and a first conveyor belt is installed in the inner cavity of the right side of the flipping machine body. PCB boards are installed on the upper surfaces of both conveyor belts. A flipping groove is opened inside the flipping machine body. The PCB board is transported to the fixing groove in the cross-shaped flipping plate via the second conveyor belt. An electromagnet generates a magnetic field identical to that of multiple magnetic blocks, causing the magnetic blocks to move corresponding fixing plates through telescopic rods and return springs to fix the PCB board. The cooperation of silicone pads and protective pads protects the PCB board surface, preventing scratches or damage during fixing. A cooler generates cold air, which is transported to the dust removal box through a connecting pipe. As it flows through the connecting pipe, water vapor and other impurities are removed by an internal filter.

A micro power distribution box is provided which includes a device, a connector / housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate in overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector / housing in a manner which prevents the device from being removed from the connector / housing.

A common conveyance jig that is a conveyance jig employed to manufacture a circuit board including a board formed from a metal material, an insulation layer fixed on the board, and a circuit part formed from an electroconductive material and fixed on the insulation layer. The common conveyance jig includes a base part that supports the board from below, and a plurality of movement-restricting units that detachably engage with the base part and restrict displacement, in a horizontal direction, of the board supported from below by the base part.

A miniature power distribution box is provided, comprising: a device having a substrate, a first finger, a second finger, and an electrical component, the first and second fingers having a first portion, a second portion, and a third portion, the substrate being overmolded to the first portion of the first and second fingers, the substrate not being overmolded to the second portion or the third portion of the first and second fingers, the second portion of the first and second fingers extending outwardly from the substrate, the third portion of the first and second fingers being exposed via at least one aperture disposed through the substrate, the electrical component being directly mounted to the third portion of the first and second fingers so as to electrically connect the electrical component to each of the first finger and the second finger; a connector / housing configured to receive the device therein and configured to connect to a mating connector; and a cover configured to be secured to the connector / housing in a manner that prevents the device from being removed from the connector / housing.

A circuit board manufacturing device including a board, an insulation layer that is fixed on the board, and a circuit part that is formed from an electroconductive material and fixed on the insulation layer. The circuit board manufacturing device includes pressing units (first pressing unit, second pressing unit) that each include a lower mold including a reception jig for the board to be set on, an upper mold that is disposed at an upper side with respect to the lower mold, and heaters that respectively heat the upper mold and the lower mold. The circuit board manufacturing device also includes preheating units (first preheating unit, second preheating unit) that are provided on a path for conveying the board and the insulation layer to the pressing unit side and also on a path for conveying the board, the insulation layer and the circuit part to the pressing unit side, and that heat the board and the insulation layer or heat the board, the insulation layer and the circuit part.

The present application relates to high-end equipment manufacturing technology field, provide a kind of circuit board vertical left-right exchange frame digital exposure LDI equipment and exposure system, it includes: support seat;Exposure component is arranged in the support seat, for exposing workpiece;First frame portion, the first frame portion is set up in the support seat setting, for installing workpiece and makes workpiece stand up;Second frame portion, the second frame portion is set up in the support seat setting, for installing workpiece and makes workpiece stand up;Drive assembly, for driving first frame portion and second frame portion move in exposure scanning direction;And / or drive the exposure component moves in exposure scanning direction.By placing workpiece in the through hole on the frame portion of vertical, so that workpiece and frame portion are all vertical, without making workpiece lie flat, therefore solve the problem that poor exposure effect is generated that ink on workpiece is sucked out due to vacuumizing, and first frame portion and second frame portion can alternately expose, improve exposure efficiency.

Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).

Provided is a collective board capable of improving work efficiency for obtaining individual circuit boards from a collective board in which the circuit boards are juxtaposed in a lattice shape. The collective board is provided with a product portion 3 in which a plurality of circuit boards 17 having a circuit pattern 15 on an insulating substrate 13 are juxtaposed in a first direction and a second direction intersecting each other in a lattice shape, a slit 7 spanning between at least ends of the product portion 3 in the first direction and penetrating, in a thickness direction, a portion between the circuit boards 17 adjacent to each other in the second direction, a coupling portion 9 coupling the circuit boards 17 adjacent to each other in the second direction at least at one end of the product portion 3 in the first direction, and grooves 11 spanning between ends of the product portion 3 in the second direction, being located between the circuit boards 17 and the coupling portion 9 adjacent to each other in the first direction and between the circuit boards 17 adjacent to each other in the first direction, and non-penetrating in the thickness direction.

Precision screen printing is described that can enable sub-micron uniformity of metallized material printed on green sheet ceramic. In some examples, a disc having electrical traces is formed by screen printing a paste containing metal in a pattern of electrical traces on a ceramic green sheet, and processing the printed green sheet to form a disc of a workpiece carrier. In some examples, the printing includes applying a squeegee of a screen printing machine to the printed green sheet in a squeegee direction while the green sheet is on a printer bed of the screen printing machine. The method further includes mapping the printer bed at a plurality of locations along the squeegee direction, identifying non-uniformities in the printer bed mapping, and modifying a printer controller of the screen printing machine to compensate for the mapped non-uniformities in the printer bed.

1. A method for manufacturing a plurality of electrical nodes (10), the method comprising: providing (410) a plurality of electronic circuits onto a first substrate (11), such as a printed circuit board or other electronic substrate, optionally a low temperature co-fired ceramic substrate, each of the electronic circuits comprising a circuit pattern (14) and at least one electronic component (12) connected to the circuit pattern (14), the electronic circuits being spaced apart from one another on the first substrate (11), thereby defining blank areas (30) surrounding each of the plurality of electronic circuits, respectively; providing (420) a potting or casting material, embedding each of the plurality of electronic circuits in the potting or casting material, and subsequently solidifying (430), including optionally curing, the potting or casting material to form a filler material layer of the plurality of electrical nodes (10).

The application discloses a processing method of a long-service-life flat vibration motor circuit board and belongs to the technical field of circuit board processing. The processing method of the long-service-life flat vibration motor circuit board comprises the following steps: sequentially performing cutting, drilling, electroplating, outer layer circuit manufacturing, gold plating, resistance manufacturing, primary solder mask printing, primary exposure and development, secondary solder mask printing, secondary exposure and development, surface treatment, punching and plate dividing and performance testing on a PCB base material, and a long-service-life flat vibration motor circuit board is obtained. The service life of the flat vibration motor circuit board can be improved by developing a new process line, on the one hand, the rotor self-weight is reduced, on the other hand, the distance between the PCB and the magnetic cylinder is increased, and the magnetic size is reduced, and then the service life of the flat vibration motor circuit board is improved.

A wiring board includes a core including a first glass plate, the core having a first primary surface, a second primary surface opposite to the first primary surface, and a side surface continuous with the first primary surface and the second primary surface, the side surface having a plurality of grooves reaching the first primary surface and the second primary surface, a first build-up layer provided on the first primary surface, a second build-up layer provided on the second primary surface, a plurality of through-metal trench layers provided inside the plurality of grooves, respectively, a first metal layer provided on the first primary surface and connected to the plurality of through-metal trench layers, and a second metal layer provided on the second primary surface and connected to the plurality of through-metal trench layers.

The invention provides a method for manufacturing a circuit pattern assembly with a release film, which can prevent bad conditions caused by etching from the surface. In the method for manufacturing the circuit pattern assembly with the release film, the circuit pattern assembly (2) comprises dummy patterns (4) arranged in gaps (G) between a plurality of circuit patterns (3) and first gaps (G1) between the dummy patterns (4) and the circuit patterns (3). The method for manufacturing the circuit pattern assembly with the release film comprises the following steps of: providing a first back surface concave part (G1R) corresponding to the first gap (G1) and a second back surface concave part (G2R) corresponding to the second gap (G2) between the conductive patterns (3a) on the back surface of the metal plate (9); a step for attaching a release film (5) to the rear surface of the metal plate (9) provided with the first rear surface recess (G1R) and the second rear surface recess (G2R); and a step for removing, by etching, a first region corresponding to the first rear surface recess (G1R) and a second region corresponding to the second rear surface recess (G2R) on the surface of the metal plate (9).

The present disclosure relates to a multilayer circuit board manufacturing apparatus. The present disclosure includes an uncoiler configured to provide a member, a processing unit configured to perform a process on the member provided from the uncoiler, a coiler configured to wind the member on which the process is completed in the processing unit, and a tension adjustment unit located in at least one of a region between the uncoiler and the processing unit, a region between the processing unit and the coiler, and a region between the uncoiler and the coiler, and adjusting a tension of the member.

A method of manufacturing a flexible circuit comprised of conducting and insulating layers in an extended length format using multi-point registration to benefit subsequent processing and utilizing one pass printing for up to 110 inches in conjunction with a large format press or alternatively a combination of step press cycles.

An assembly sheet includes a supporting portion, a plurality of wiring circuit boards, and a joint portion. The supporting portion supports the plurality of wiring circuit boards. The supporting portion surrounds the plurality of wiring circuit boards while being separated from the plurality of wiring circuit boards by an interval. The joint portion joins the plurality of wiring circuit boards to the supporting portion. The plurality of wiring circuit boards includes a first wiring circuit board and a second wiring circuit board. The second wiring circuit board is arranged next to the first wiring circuit board while being separated from the first wiring circuit board by an interval. The second wiring circuit board is symmetrical to the first wiring circuit board with respect to a point centered therebetween. The supporting portion includes a first and second mark. The second mark is asymmetrical to the first with respect to the point.

A workpiece support assembly for supporting and aligning a plurality of singulated workpieces on respective head units, comprises a horizontal actuation mechanism for moving a head unit, wherein the horizontal actuation mechanism comprises a plurality of elongate shape-memory alloy actuators, each shape-memory alloy actuator having a first end that is connected to a base of the assembly and a second, distal, end that is connected to an anchor point of the head unit, such that selective actuation of shape-memory actuators of the plurality of shape-memory actuators causes the head unit to move relative to the base to cause a translation of the head unit parallel to a horizontal plane, a rotation of the head unit about an axis orthogonal to the horizontal plane, or a combination of said translation and said rotation.

The present invention relates to a batch alignment device for a screen printer and a batch alignment method using the same. Since a plurality of printed circuit boards can be aligned simultaneously and quickly in alignment holes formed in a single alignment jig, simplification of parts and weight reduction of the device are possible, shortening of the production process and time, improvement of productivity, and mass production through this are possible. By aligning only the X-axis and Y-axis on the plane of an intermediate printed circuit board where the mask and the alignment jig coincide within the alignment jig, alignment of a plurality of printed circuit boards is completed, and at the same time, high-quality printing that coincides with the printing pattern of the alignment jig and the mask can be quickly performed on a plurality of printed circuit boards simultaneously.

A common conveyance jig that is a conveyance jig employed to manufacture a circuit board including a board formed from a metal material, an insulation layer fixed on the board, and a circuit part formed from an electroconductive material and fixed on the insulation layer. The common conveyance jig includes a base part that supports the board from below, and a plurality of movement-restricting units that detachably engage with the base part and restrict displacement, in a horizontal direction, of the board supported from below by the base part.