149results about "Printed circuit simultaneous processing" patented technology

The invention relates to the technical field of high-end equipment manufacturing, and provides circuit board vertical left and right exchange frame digital exposure LDI equipment and an exposure system. The exposure assembly is arranged on the supporting seat and is used for exposing a workpiece; the first frame part is vertically arranged on the supporting seat, and is used for mounting a workpiece and enabling the workpiece to be vertical; the second frame part is vertically arranged on the supporting seat, and is used for mounting a workpiece and enabling the workpiece to be vertical; the driving assembly is used for driving the first frame part and the second frame part to move in the exposure scanning direction; and / or driving the exposure assembly to move in the exposure scanning direction. The workpiece is placed in the through hole in the vertical frame part, so that the workpiece and the frame part are both vertical, the workpiece does not need to be horizontally placed, the problems that ink on the workpiece is sucked out due to vacuumizing, and the exposure effect is poor are solved, the first frame part and the second frame part can be alternately exposed, and the exposure efficiency is improved.

The invention discloses a manufacturing method of an electric appliance mounting plate. The manufacturing method comprises the following steps: step 1, processing parts; step 2, cleaning operation; step 3, spraying; and 4, packaging and warehousing. In the workpiece manufacturing process, the workpiece is soaked and cleaned, impurities on the surface of the workpiece are effectively removed, the final workpiece quality is improved, in the soaking and cleaning process, the workpiece is subjected to secondary soaking and cleaning, deep cleaning is achieved, the cleaning effect is effectively improved, the overall quality and reliability of the workpiece are improved, and in the soaking and cleaning process, the cleaning efficiency is improved. In the process of transferring the workpieces from the first soaking tank to the second soaking tank and transferring the workpieces from the second soaking tank to the discharging table, the whole operation automation degree is high, the working efficiency is effectively improved, the workpieces are placed in order through the workpiece placing frame, it is guaranteed that the workpieces cannot be stacked and extruded in the soaking process, and the soaking effect is effectively guaranteed.

The invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method, which comprises the following steps of: 1, preparing raw materials, adding the prepared raw materials into a fuse machine, and changing solid raw materials into liquid raw materials; 2, liquid raw materials are added into a mold machining device, and machining of the circuit board is completed; step 3, carrying out anti-corrosion treatment on the processed circuit board; 4, performing line drawing treatment on the circuit board subjected to the anti-corrosion treatment; step 5, performing punching treatment on the circuit board after line drawing is completed; and step 6, welding the punched circuit board to complete manufacturing of the PCB, the method can process a plurality of circuit board materials at one time, and the speed of manufacturing the PCB is further improved.

A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.

The invention relates to the technical field of high-end equipment manufacturing, and provides vertical digital exposure LDI equipment easy for taking and placing a circuit board and an exposure system. The exposure assembly is vertically arranged on the supporting seat and is used for exposing a workpiece; the frame part is erected on the supporting seat, and the frame part comprises a through hole penetrating through the first surface and the second surface of the frame part. The workpiece is placed in the through hole in the vertical frame part, so that both the workpiece and the frame part are vertical, and the workpiece does not need to be horizontally placed, therefore, the problems that ink on the workpiece is sucked out due to vacuumizing and the exposure effect is poor are solved, and the arrangement of the through hole facilitates double-sided exposure and improves the exposure efficiency.

Example methods, apparatus, systems for droplet actuator fabrication are disclosed. An example non-transitory computer readable medium includes instructions that, when executed, cause at least one processor to at least control movement of a laser to cause the laser to etch an electrode pattern in a first substrate, the electrode pattern including a first set of electrodes, a second set of electrodes, and a third set of electrodes; control a printer driver to cause a hydrophobic material and a dielectric material to be applied to the second set of electrodes and not the first set of electrodes via a printer; control a bonding driver to cause a gap to be defined between the first substrate and a second substrate; and control a dicing driver to cause a portion the first substrate and a portion of the second substrate to be cut into a droplet actuator.

To provide a roll of a wiring circuit board collective sheet capable of suppressing deterioration of the flatness of a wiring circuit board, and provide a manufacturing method of the wiring circuit board.SOLUTION: The present invention provides a roll R of a wiring circuit board collective sheet 1. The wiring circuit board collective sheet 1 includes: a wiring circuit board 2; and a frame 3 supporting the wiring circuit board 2. The wiring circuit board 2 includes an open scheduled part 25 in which formation of an open is scheduled. The open scheduled part 25 is extended in a shaft direction of the roll R, and in a peripheral direction of the roll R. A length L11 of the open scheduled part 25 in the peripheral direction of the roll R is shorter than a length L12 of the open scheduled part 25 in the shaft direction of the roll R.SELECTED DRAWING: Figure 1

Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a core with a first width, and the core comprises a glass layer. In an embodiment, a via is provided through a thickness of the core, where the via is electrically conductive. In an embodiment, a first layer is provided over the core, where the first layer comprises a second width that is smaller than the first width. In an embodiment, a second layer is provided under the core, where the second layer comprises a third width that is smaller than the first width.

A semifinished product (100) which comprises a sacrificial structure (102) and two component carriers (104) releasably formed on opposing main surfaces of the sacrificial structure (102), wherein each of the component carriers (104) comprises at least one electrically insulating layer structure (114), and at least one electrically conductive layer structure (116), and wherein the two electrically insulating layer structures (114), each of which relating to a respective one of the component carriers (104), located closest to the sacrificial structure (102) are pure or unprocessed electrically insulating layers without electrically conductive material therein.

A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.

The invention relates to a board placing device and a control method thereof, and relates to the technical field of PCB automatic machining, the board placing device comprises a protection cover, a controller installed outside the protection cover and a rack installed in the protection cover, the rack is provided with a feeding table close to the feeding end, and the rack is provided with a discharging table close to the discharging end; an anti-sticking mechanism is arranged on the feeding table, the anti-sticking mechanism comprises first moving equipment, a plurality of fixed anti-sticking assemblies and a plurality of movable anti-sticking assemblies, and the first moving equipment is used for driving the movable anti-sticking assemblies to move in the direction close to or away from the fixed anti-sticking assemblies; a thickness detection mechanism is mounted above the discharging end; a moving mechanism is arranged above the feeding table and the discharging table and comprises second moving equipment and adsorption equipment, and the second moving equipment is used for driving the adsorption equipment to move in the direction close to or away from the feeding table or the discharging table. The method has the effect of improving the automatic processing efficiency of the flexible PCB.

A workpiece support assembly (10, Fig.3) for supporting and aligning a plurality of singulated workpieces. The workpiece support assembly comprises an assembly body (11, Fig.3) and a plurality of supp

A surface mount technology (SMT) panel frame is provided. The SMT panel frame (100) includes a panel (110) and at least one copper material region (130) disposed on the panel (110). The panel (110) is substantially sufficient to securely hold at least one printed circuit board (120), the panel (110) is removably arranged around the printed circuit board (120), and predetermined areas on the printed circuit board (PCB) (120) are designated for placing data matrix codes (DMC), reference points and test points. At least one copper material region (130) is selectively arranged within the panel (110) based on the arrangement of the data matrix code, the reference and the test points such that the copper material region is aligned with the location and arrangement of the panel reference points, DMC and test points, thereby reducing the need of the entire panel (110) for copper.

A circuit board, an LED lighting system, and a manufacturing method are described. The circuit board includes a ceramic carrier and a body on the ceramic carrier. The body includes multiple dielectric layers and multiple slots formed through the entire thickness of the multiple dielectric layers. The slots are filled with a dielectric material. A conductive pad is provided on the surface of each of the slots opposite the ceramic carrier.

An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; a heat dissipation structure disposed around the antenna on the upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure.

An electronic board includes: a stack including at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, where one of the plurality of electrically conductive layer structures is disposed on one major surface of the at least one electrically insulating layer structure, and the other of the plurality of electrically conductive layer structures is disposed on the other major surface of the at least one electrically insulating layer structure; and another electrically conductive layer structure of the plurality of electrically conductive layer structures is disposed on another opposite major surface of the at least one electrically insulating layer structure; a via formed in the stack and laterally delimited by a conductive material; at least one plating layer disposed on at least portions of the two opposite major surfaces of the stack and on the sidewalls of the stack; an axial annular projection disposed at one end of the through hole; and a radial annular projection disposed at a sidewall of the stack. The invention also provides a method for manufacturing the electronic board.

A system (10) for separating PCB elements (2') (printed circuit board) from multiple blocks (2) of PCB elements and for feeding them to an operating machine is described. The system (10) comprises: - a first set of separation lines (20) for separating the PCB elements (2') from their respective multiple blocks (2) of PCB elements, each separation line (20) comprising a separation station (24) and a transport system (21 A, 2 IB) for moving a plurality of workpiece-holding units (22), configured to receive, each, a multiple block (2) of PCB elements, at the separation station (24), said separation station being configured to separate the PCB elements (2') from their respective multiple blocks (2) of PCB elements without removing them from the workpiece-holding units (22); and - a second set of feeding lines (40) for feeding the separated PCB elements (2') to the operating machine, each feeding line (40) comprising a conveyor (41) configured for moving a mobile unit (42) configured to receive the separated PCB elements (2') of at least one multiple block (2) of PCB elements.

A workpiece support assembly (80) for supporting and aligning a plurality of single workpieces (35, 35A), comprises an assembly body (82) and a plurality of support members (10, 81) mounted on the assembly body (82), each supporting a workpiece (35, 35A) when in use, each support member (10, 81) comprising: a base (12) mounted on the assembly body (82), a head unit (11) for supporting a workpiece (35, 35A) thereon, and an actuation mechanism (40) for moving the head unit (11) relative to the base (12), wherein the actuation mechanism (40) comprises a parallel kinematic system having at least three drive units (15, 41) each directly acting on the head unit (11), such that the actuation mechanism (40) is selectively operative to move the head unit (11) relative to the base (12) to cause a translation of the head unit (11) parallel to a plane (XY), a rotation (θ) of the head unit (11) about an axis orthogonal to that plane (XY), or a combination of said translation and said rotation (θ).

The present disclosure relates to stress mitigation architectures for glass core substrates. Embodiments disclosed herein include a package substrate having a glass core. In an embodiment, an apparatus includes a core having a first width, and the core includes a glass layer. In an embodiment, a via is disposed through a thickness of the core, where the via is electrically conductive. In an embodiment, a first layer is disposed over the core, where the first layer includes a second width that is less than the first width. In an embodiment, a second layer is disposed under the core, where the second layer includes a third width that is less than the first width.

The invention relates to a process and system for manufacturing a flexible circuit, in particular to a process and system for cutting and / or ablating a material when manufacturing a flexible circuit.

An alignment system 10 for aligning a plurality of singulated workpieces (32A-F, Fig.5A) received within a printing machine within a horizontal (X-Y) plane. The system comprises a plurality of towers 14 spaced apart in the horizontal plane. Each tower has a head 16 configured to support a respective singulated workpiece thereon in use. The system further comprises an actuation tool 22 which is movable within the horizontal plane; and an actuation means (24, 26, 28, Fig.3) operatively connected to the actuation tool for driving the actuation tool within the horizontal plane. Each tower is associated with a respective locking system 30A-F, each locking system being independently operable to place its associated tower in a tool-locking state in which at least the head of the respective tower is locked relative to the actuation tool so as to prevent relative movement between the respective head and the actuation tool in the horizontal (XY) plane. Advantageously the towers are also selectively lockable relative to a base 12 of the alignment system, so that successive towers may be aligned by the actuation tool in a stepwise manner.

This invention discloses a PCB board flipping machine, belonging to the field of PCB board flipping technology. It includes a flipping machine body, a positioning and flipping assembly, and a wireless power supply dust removal assembly. A second conveyor belt is installed on the left side of the flipping machine body, and a first conveyor belt is installed in the inner cavity of the right side of the flipping machine body. PCB boards are installed on the upper surfaces of both conveyor belts. A flipping groove is opened inside the flipping machine body. The PCB board is transported to the fixing groove in the cross-shaped flipping plate via the second conveyor belt. An electromagnet generates a magnetic field identical to that of multiple magnetic blocks, causing the magnetic blocks to move corresponding fixing plates through telescopic rods and return springs to fix the PCB board. The cooperation of silicone pads and protective pads protects the PCB board surface, preventing scratches or damage during fixing. A cooler generates cold air, which is transported to the dust removal box through a connecting pipe. As it flows through the connecting pipe, water vapor and other impurities are removed by an internal filter.

A micro power distribution box is provided which includes a device, a connector / housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate in overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector / housing in a manner which prevents the device from being removed from the connector / housing.

To provide a referencing system for singulated workpieces in which the size and weight are reduced without adversely affecting reliability or accuracy compared to conventional systems.SOLUTION: The invention provides a method and apparatus for referencing a plurality of singulated workpieces within a printer prior to performing a printing operation, permitting a single referencing plate to be used both for horizontal and vertical referencing operations.SELECTED DRAWING: Figure 1

A common conveyance jig that is a conveyance jig employed to manufacture a circuit board including a board formed from a metal material, an insulation layer fixed on the board, and a circuit part formed from an electroconductive material and fixed on the insulation layer. The common conveyance jig includes a base part that supports the board from below, and a plurality of movement-restricting units that detachably engage with the base part and restrict displacement, in a horizontal direction, of the board supported from below by the base part.

A printed circuit board includes an inorganic substrate, a through-via passing through the inorganic substrate, a first insulating layer covering at least a portion of an external surface of the inorganic substrate, a second insulating layer disposed on an upper surface of each of the inorganic substrate and the first insulating layer, a third insulating layer disposed on a lower surface of each of the inorganic substrate and the first insulating layer, a first wiring layer disposed on an upper surface of the second insulating layer, and a second wiring layer disposed on a lower surface of the third insulating layer. The inorganic substrate includes silicon or ceramic. The inorganic substrate has an upper end and a lower end having different widths, in cross-section.

The present invention provides a collective board capable of improving work efficiency for obtaining individual circuit boards from a collective board in which the circuit boards are arranged in a lattice pattern. The present invention comprises: a product part 3 in which a plurality of circuit boards 17 respectively having circuit patterns 15 on an insulating board 13 are arranged in a lattice pattern in a first direction and a second direction intersecting each other; slits 7 which extend at least between the ends of the product part 3 in the first direction and penetrate in the plate thickness direction between the adjacent circuit boards 17 in the second direction; coupling parts 9 which couple the adjacent circuit boards 17 in the second direction at at least one end of the product part 3 in the first direction; and grooves 11 which extend between the ends of the product part 3 in the second direction, are positioned between the coupling parts 9 and the circuit boards 17 adjacent in the first direction and between the adjacent circuit boards 17, and are non-penetrating in the plate thickness direction.