99results about "Printed circuit simultaneous processing" patented technology

The invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method, which comprises the following steps of: 1, preparing raw materials, adding the prepared raw materials into a fuse machine, and changing solid raw materials into liquid raw materials; 2, liquid raw materials are added into a mold machining device, and machining of the circuit board is completed; step 3, carrying out anti-corrosion treatment on the processed circuit board; 4, performing line drawing treatment on the circuit board subjected to the anti-corrosion treatment; step 5, performing punching treatment on the circuit board after line drawing is completed; and step 6, welding the punched circuit board to complete manufacturing of the PCB, the method can process a plurality of circuit board materials at one time, and the speed of manufacturing the PCB is further improved.

The invention relates to the technical field of high-end equipment manufacturing, and provides vertical digital exposure LDI equipment easy for taking and placing a circuit board and an exposure system. The exposure assembly is vertically arranged on the supporting seat and is used for exposing a workpiece; the frame part is erected on the supporting seat, and the frame part comprises a through hole penetrating through the first surface and the second surface of the frame part. The workpiece is placed in the through hole in the vertical frame part, so that both the workpiece and the frame part are vertical, and the workpiece does not need to be horizontally placed, therefore, the problems that ink on the workpiece is sucked out due to vacuumizing and the exposure effect is poor are solved, and the arrangement of the through hole facilitates double-sided exposure and improves the exposure efficiency.

A semifinished product (100) which comprises a sacrificial structure (102) and two component carriers (104) releasably formed on opposing main surfaces of the sacrificial structure (102), wherein each of the component carriers (104) comprises at least one electrically insulating layer structure (114), and at least one electrically conductive layer structure (116), and wherein the two electrically insulating layer structures (114), each of which relating to a respective one of the component carriers (104), located closest to the sacrificial structure (102) are pure or unprocessed electrically insulating layers without electrically conductive material therein.

A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.

A workpiece support assembly (10, Fig.3) for supporting and aligning a plurality of singulated workpieces. The workpiece support assembly comprises an assembly body (11, Fig.3) and a plurality of supp

A surface mount technology (SMT) panel frame is provided. The SMT panel frame (100) includes a panel (110) and at least one copper material region (130) disposed on the panel (110). The panel (110) is substantially sufficient to securely hold at least one printed circuit board (120), the panel (110) is removably arranged around the printed circuit board (120), and predetermined areas on the printed circuit board (PCB) (120) are designated for placing data matrix codes (DMC), reference points and test points. At least one copper material region (130) is selectively arranged within the panel (110) based on the arrangement of the data matrix code, the reference and the test points such that the copper material region is aligned with the location and arrangement of the panel reference points, DMC and test points, thereby reducing the need of the entire panel (110) for copper.

An electronic board includes: a stack including at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, where one of the plurality of electrically conductive layer structures is disposed on one major surface of the at least one electrically insulating layer structure, and the other of the plurality of electrically conductive layer structures is disposed on the other major surface of the at least one electrically insulating layer structure; and another electrically conductive layer structure of the plurality of electrically conductive layer structures is disposed on another opposite major surface of the at least one electrically insulating layer structure; a via formed in the stack and laterally delimited by a conductive material; at least one plating layer disposed on at least portions of the two opposite major surfaces of the stack and on the sidewalls of the stack; an axial annular projection disposed at one end of the through hole; and a radial annular projection disposed at a sidewall of the stack. The invention also provides a method for manufacturing the electronic board.

A system (10) for separating PCB elements (2') (printed circuit board) from multiple blocks (2) of PCB elements and for feeding them to an operating machine is described. The system (10) comprises: - a first set of separation lines (20) for separating the PCB elements (2') from their respective multiple blocks (2) of PCB elements, each separation line (20) comprising a separation station (24) and a transport system (21 A, 2 IB) for moving a plurality of workpiece-holding units (22), configured to receive, each, a multiple block (2) of PCB elements, at the separation station (24), said separation station being configured to separate the PCB elements (2') from their respective multiple blocks (2) of PCB elements without removing them from the workpiece-holding units (22); and - a second set of feeding lines (40) for feeding the separated PCB elements (2') to the operating machine, each feeding line (40) comprising a conveyor (41) configured for moving a mobile unit (42) configured to receive the separated PCB elements (2') of at least one multiple block (2) of PCB elements.

An alignment system 10 for aligning a plurality of singulated workpieces (32A-F, Fig.5A) received within a printing machine within a horizontal (X-Y) plane. The system comprises a plurality of towers 14 spaced apart in the horizontal plane. Each tower has a head 16 configured to support a respective singulated workpiece thereon in use. The system further comprises an actuation tool 22 which is movable within the horizontal plane; and an actuation means (24, 26, 28, Fig.3) operatively connected to the actuation tool for driving the actuation tool within the horizontal plane. Each tower is associated with a respective locking system 30A-F, each locking system being independently operable to place its associated tower in a tool-locking state in which at least the head of the respective tower is locked relative to the actuation tool so as to prevent relative movement between the respective head and the actuation tool in the horizontal (XY) plane. Advantageously the towers are also selectively lockable relative to a base 12 of the alignment system, so that successive towers may be aligned by the actuation tool in a stepwise manner.

This invention discloses a PCB board flipping machine, belonging to the field of PCB board flipping technology. It includes a flipping machine body, a positioning and flipping assembly, and a wireless power supply dust removal assembly. A second conveyor belt is installed on the left side of the flipping machine body, and a first conveyor belt is installed in the inner cavity of the right side of the flipping machine body. PCB boards are installed on the upper surfaces of both conveyor belts. A flipping groove is opened inside the flipping machine body. The PCB board is transported to the fixing groove in the cross-shaped flipping plate via the second conveyor belt. An electromagnet generates a magnetic field identical to that of multiple magnetic blocks, causing the magnetic blocks to move corresponding fixing plates through telescopic rods and return springs to fix the PCB board. The cooperation of silicone pads and protective pads protects the PCB board surface, preventing scratches or damage during fixing. A cooler generates cold air, which is transported to the dust removal box through a connecting pipe. As it flows through the connecting pipe, water vapor and other impurities are removed by an internal filter.

A micro power distribution box is provided which includes a device, a connector / housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate in overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector / housing in a manner which prevents the device from being removed from the connector / housing.

A common conveyance jig that is a conveyance jig employed to manufacture a circuit board including a board formed from a metal material, an insulation layer fixed on the board, and a circuit part formed from an electroconductive material and fixed on the insulation layer. The common conveyance jig includes a base part that supports the board from below, and a plurality of movement-restricting units that detachably engage with the base part and restrict displacement, in a horizontal direction, of the board supported from below by the base part.

A printed circuit board includes an inorganic substrate, a through-via passing through the inorganic substrate, a first insulating layer covering at least a portion of an external surface of the inorganic substrate, a second insulating layer disposed on an upper surface of each of the inorganic substrate and the first insulating layer, a third insulating layer disposed on a lower surface of each of the inorganic substrate and the first insulating layer, a first wiring layer disposed on an upper surface of the second insulating layer, and a second wiring layer disposed on a lower surface of the third insulating layer. The inorganic substrate includes silicon or ceramic. The inorganic substrate has an upper end and a lower end having different widths, in cross-section.

The invention discloses a board turnover machine for PCB machining, and belongs to the technical field of PCB turnover, the board turnover machine comprises a board turnover machine body, a positioning turnover assembly and a wireless power supply dust removal assembly, a second conveying belt is installed on the left side face of the board turnover machine body, a first conveying belt is installed in an inner cavity of the right side face of the board turnover machine body, and PCBs are installed on the upper surfaces of the first conveying belt and the second conveying belt; according to the PCB turnover machine, a PCB is conveyed to the fixing grooves in the cross-shaped turnover plate through the second conveying belt, the electromagnet is started to generate a magnetic field the same as the magnetic blocks, the magnetic blocks are promoted to drive the corresponding fixing plates to fix the PCB through the telescopic rods and the reset springs, and the PCB turnover machine has the advantages that the PCB turnover machine is simple in structure, convenient to use and high in practicability. The surface of the PCB can be protected through mutual cooperation of the silica gel pad and the protective pad, scratches or damage to the surface of the PCB in the fixing process are avoided, cold air is generated through the refrigerator and conveyed into the dust removal box through the connecting pipe, and water vapor and other impurities are removed by the filter in the dust removal box when the cold air flows through the connecting pipe.

To provide: a printed circuit board including a high-density microcircuit that may be formed at high yield and low cost; and a printed circuit board having excellent warpage control characteristics.SOLUTION: A printed circuit board 100A includes an inorganic substrate 111a, a through-via 131 penetrating through the inorganic substrate, a first insulating layer 112 covering at least a portion of the external surface of the inorganic substrate, a second insulating layer 113 disposed on the upper surface of each of the inorganic substrate and the first insulating layer, a third insulating layer 114 disposed on the lower surface of each of the inorganic substrate and the first insulating layer, a first wiring layer 121 disposed on the upper surface of the second insulating layer, and a second wiring layer 122 disposed on the lower surface of the third insulating layer. The inorganic substrate includes silicon or ceramic. The inorganic substrate has an upper end and a lower end having different widths, in cross-section.SELECTED DRAWING: Figure 3

A component carrier (100a) comprising: a layer stack (101) comprising electrically conductive layer structures (104) and electrically insulating layer structures (102), wherein at least one electrically insulating layer structure (130) is a low Young modulus layer structure (130) formed of a low Young modulus material, in particular with a Young modulus of less than 10 GPa, and wherein the layer stack (101) is at least partially formed as a redistribution structure (160); an electronic component (115) embedded in a cavity (111) of the layer stack (101) and electrically connected with the redistribution structure (160) such that a first electric contact (116) of the electronic component (115) is transferred via the redistribution structure (160) to a second electric contact (162) at a main surface (165) of the layer stack (101), wherein the second electric contact (162) is larger than the first electric contact (116); and wherein the electronic component (115) is arranged between, in particular directly between, the low Young modulus layer structure (130) and the redistribution structure (160).

Disclosed is a method of manufacturing a three-dimensional multi-layer electronic device, the method including: a unit forming process of forming a multi-layer unit including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out and integrating the multi-layer unit in a vertical direction.

The invention discloses a vertical double-face hole plugging machine tool and a machining method thereof. The vertical double-face hole plugging machine tool comprises a rack, a conveying belt, two sound wave auxiliary printing scraper devices, at least two sound wave curing devices and a curing bin. The sound wave auxiliary printing scraper device, the sound wave curing device and the curing bin are sequentially arranged in the moving direction of the conveying belt, the working procedures of resin hole filling, surface curing and overall curing can be conducted on the PCB, hole plugging of the PCB is achieved efficiently, and the hole plugging quality is improved. The vertical double-face hole plugging machine tool is adopted, the PCB to be plugged is vertically clamped on the machine tool, the sound wave auxiliary printing scraper device, the sound wave curing device and the curing bin are arranged on the two sides to be plugged respectively, resin hole plugging can be conducted on the two faces of the PCB at the same time, hole plugging can be conducted on the multiple PCBs at the same time in cooperation with the conveying belt, assembly line type machining is achieved, and the production efficiency is improved. The production efficiency of the PCB is improved, and the operation process is simplified.

High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuity, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

A miniature power distribution box is provided, comprising: a device having a substrate, a first finger, a second finger, and an electrical component, the first and second fingers having a first portion, a second portion, and a third portion, the substrate being overmolded to the first portion of the first and second fingers, the substrate not being overmolded to the second portion or the third portion of the first and second fingers, the second portion of the first and second fingers extending outwardly from the substrate, the third portion of the first and second fingers being exposed via at least one aperture disposed through the substrate, the electrical component being directly mounted to the third portion of the first and second fingers so as to electrically connect the electrical component to each of the first finger and the second finger; a connector / housing configured to receive the device therein and configured to connect to a mating connector; and a cover configured to be secured to the connector / housing in a manner that prevents the device from being removed from the connector / housing.

A circuit board manufacturing device including a board, an insulation layer that is fixed on the board, and a circuit part that is formed from an electroconductive material and fixed on the insulation layer. The circuit board manufacturing device includes pressing units (first pressing unit, second pressing unit) that each include a lower mold including a reception jig for the board to be set on, an upper mold that is disposed at an upper side with respect to the lower mold, and heaters that respectively heat the upper mold and the lower mold. The circuit board manufacturing device also includes preheating units (first preheating unit, second preheating unit) that are provided on a path for conveying the board and the insulation layer to the pressing unit side and also on a path for conveying the board, the insulation layer and the circuit part to the pressing unit side, and that heat the board and the insulation layer or heat the board, the insulation layer and the circuit part.

The present application relates to high-end equipment manufacturing technology field, provide a kind of circuit board vertical left-right exchange frame digital exposure LDI equipment and exposure system, it includes: support seat;Exposure component is arranged in the support seat, for exposing workpiece;First frame portion, the first frame portion is set up in the support seat setting, for installing workpiece and makes workpiece stand up;Second frame portion, the second frame portion is set up in the support seat setting, for installing workpiece and makes workpiece stand up;Drive assembly, for driving first frame portion and second frame portion move in exposure scanning direction;And / or drive the exposure component moves in exposure scanning direction.By placing workpiece in the through hole on the frame portion of vertical, so that workpiece and frame portion are all vertical, without making workpiece lie flat, therefore solve the problem that poor exposure effect is generated that ink on workpiece is sucked out due to vacuumizing, and first frame portion and second frame portion can alternately expose, improve exposure efficiency.

Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).

Provided is a collective board capable of improving work efficiency for obtaining individual circuit boards from a collective board in which the circuit boards are juxtaposed in a lattice shape. The collective board is provided with a product portion 3 in which a plurality of circuit boards 17 having a circuit pattern 15 on an insulating substrate 13 are juxtaposed in a first direction and a second direction intersecting each other in a lattice shape, a slit 7 spanning between at least ends of the product portion 3 in the first direction and penetrating, in a thickness direction, a portion between the circuit boards 17 adjacent to each other in the second direction, a coupling portion 9 coupling the circuit boards 17 adjacent to each other in the second direction at least at one end of the product portion 3 in the first direction, and grooves 11 spanning between ends of the product portion 3 in the second direction, being located between the circuit boards 17 and the coupling portion 9 adjacent to each other in the first direction and between the circuit boards 17 adjacent to each other in the first direction, and non-penetrating in the thickness direction.

In an electronic device (100), and method of manufacturing, a first electronics foil piece (10) comprises a flexible foil piece (11), a local circuit (12) arranged on the flexible foil piece (11), and an electronic component (13), electrically connected to the local circuit (12). The first electronics foil piece (10) is adhered to a carrier substrate (51), wherein the electronic component (13) is electrically connected, via the local circuit (12), to an interconnect circuit (52) arranged on the carrier substrate (51). A second electronics foil piece (20) may be adhered to the carrier substrate (51). An electronic component (23) of the second electronics foil piece (20) may be electrically connected to the interconnect circuit (51) via the second local circuit (22), and electrically connected to the electronic component (13) of the first electronics foil piece (10) via the interconnect circuit (51).

The present invention specifically discloses a liftable temporary storage cooler, which includes a frame and a flap mechanism. The flap mechanism is arranged inside the frame. The flap mechanism includes a conveyor belt and several plate placing parts for storing PCB boards. The conveyor belt is wound up and down along the height direction of the frame inside the frame. The plate placing parts make lifting movements inside the frame through the conveyor belt. A buffer mechanism is arranged at the top of the frame. The buffer mechanism is used to provide a buffering force for the PCB board that flips by its own weight. The frame is an airtight cavity. An air-conditioning return air system is arranged inside the frame, which can avoid the PCB board from being easily scratched and rebounded when flipping, shorten the floor area of the equipment in the horizontal direction, save the planar space, avoid local expansion and contraction deformation of the PCB board surface during the cooling process, realize the integration of the cooling process and the temporary storage process of the PCB board, reduce the production time of the PCB board, increase the processing time of the cooling process of the PCB board, and ensure the cooling effect of the PCB board.

Precision screen printing is described that can enable sub-micron uniformity of metallized material printed on green sheet ceramic. In some examples, a disc having electrical traces is formed by screen printing a paste containing metal in a pattern of electrical traces on a ceramic green sheet, and processing the printed green sheet to form a disc of a workpiece carrier. In some examples, the printing includes applying a squeegee of a screen printing machine to the printed green sheet in a squeegee direction while the green sheet is on a printer bed of the screen printing machine. The method further includes mapping the printer bed at a plurality of locations along the squeegee direction, identifying non-uniformities in the printer bed mapping, and modifying a printer controller of the screen printing machine to compensate for the mapped non-uniformities in the printer bed.