Method for transferring selected microdevices (102, 102a, 102b, 102c) in an array of microdevices (102, 102a, 102b, 102c), each of which is bonded to a donor substrate (100) by a donor force, the method comprising: Aligning the donor substrate (100) and a
receiver substrate (200) such that each of the selected microdevices (102, 102a, 102b, 102c) is located on the
receiver substrate (200) in alignment with a
contact pad (206a, 206b, 206c); Moving the donor substrate (100) and the
receiver substrate (200) towards each other until each of the selected microdevices (102, 102a, 102b, 102c) is in contact with or near a respective
contact pad (206a, 206b, 206c) on the receiver substrate (200); Generating a receiver force by means of force modulation elements (204a, 204b, 204c), wherein the receiver force acts such that it holds each of the selected microdevices (102, 102a, 102b, 102c) to its respective contact pads (206a, 206b, 206c), wherein each of the selected microdevices (102, 102a, 102b, 102c) corresponds to one of the force modulation elements (204a, 204b, 204c), and wherein the receiver force is generated selectively to improve selectivity of the microdevice transfer, wherein the receiver force is modulated by heating the receiver substrate (200) by passing a current through the contact pads (206a, 206b, 206c); and Moving the donor substrate (100) and the receiver substrate (200) away from each other, leaving the selected microdevices (102, 102a, 102b, 102c) on the receiver substrate (200). wherein the force modulation elements (204a , 204b , 204c) are on the receiver substrate (200) and in direct contact with the contact pads (206a , 206b, 206c).