PCB soldering and desoldering device

Abstract

The embodiment of the invention discloses a PCB soldering and desoldering device. The PCB soldering and desoldering device is used for providing a temperature difference environmental condition for PCB soldering and desoldering, thus efficiency of PCB soldering and desoldering is improved, and the success rate of PCB soldering and desoldering is increased. According to a method, the PCB solderingand desoldering device comprises a jig, an outer wall, a cooling mechanism, a preheating device and a bottom support plate; the jig is fixed to the upper portion of the outer wall and used for fixinga to-be-machined PCB; the cooling mechanism and the preheating device are located inside the outer wall, and the cooling mechanism is located on the preheating device; and the preheating device is fixed to the bottom support plate. Therefore, by means of the preheating device, the PCB can be preheated stably; the cooling mechanism is matched, the soldering and desoldering temperature difference ofa to-be-machined area of the PCB is achieved, and the temperature difference environmental condition is provided for soldering and desoldering; influence on devices around soldered and desoldered elements can be reduced conveniently; and thus, efficiency of PCB soldering and desoldering is improved, and the success rate of PCB soldering and desoldering is increased.

Description

technical field [0001] The invention relates to the technical field of PCB technology, in particular to a PCB welding and desoldering device. Background technique [0002] With the continuous development of related electronic technology fields, the corresponding electronic technology has been widely used. In order to meet the requirements of smaller electronic products, electronic product manufacturing has increasingly adopted precision assembly of micro-components. [0003] In this context, the common feature of printed circuit board (PCB, Printed Circuit Board) manufacturers such as smartphones, solid-state drives, and servers is that they are basically limited by space. Under the condition of high performance, the common practice in the industry is The components are soldered on both sides of the PCB board, which leads to more and more types and quantities of components used on the circuit board. In the soldering process of PCB components, it is easy to have unqualified ...

AI Technical Summary

Problems solved by technology

[0005] However, the disadvantage of this large-area hot air heating device is that when the heating is excessive or uneven, it is easy to cause a short circuit between adjacent solder joints caused by solder explosion on the PCB board. Cause certain thermal damage, the success rate and efficiency of this type of welding and desoldering in the industry are relatively low

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