A selective laser sintering device for soaking heat and preventing faults and its manufacturing method

A technology of laser sintering and laser scanning device is applied in the field of selective laser sintering device for soaking and anti-fault, which can solve the problems of uneven distance from the heating point, poor preheating uniformity of powder, layered fracture, etc., and achieves improvement. Performance and stability, stable structure of sintered products, uniform performance of sintered products

Active Publication Date: 2022-03-01
贵州森远增材制造科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is characterized by higher production efficiency, higher operating costs, and more expensive equipment costs
[0003] The pain points of 3D selective laser sintering in the prior art are: 1. The prior art usually uses a fixed thermal radiation source to preheat the powder in the area to be printed. Due to the uneven distance from the heating point, there is obvious uneven heating 1. The problem of poor preheating uniformity of the powder greatly affects the performance and stability of the printed product; 2. When the forming area continues to move down with the printing process, due to the mechanical piston lifting and sintering at the same time Uneven regional heat distribution will inevitably affect or even tear the incompletely solidified sintered area during the movement, resulting in stress concentration in the sintered area and even directly causing delamination fracture

Method used

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  • A selective laser sintering device for soaking heat and preventing faults and its manufacturing method
  • A selective laser sintering device for soaking heat and preventing faults and its manufacturing method
  • A selective laser sintering device for soaking heat and preventing faults and its manufacturing method

Examples

Experimental program
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Effect test

Embodiment 1

[0023] As figure 1 The homogenous anti-microfear layer selective laser sintering apparatus is selectively laser sintering apparatus, which is composed of a seat, a laser scanning device 8, a printing working chamber 3, a feed device, and a cavity 11, wherein the laser scanning device 8 is provided at the lower end of the laser channel through a laser channel. The protective light-transmitting plate 9 is connected to the print working chamber 3, so that the laser is transmitted to the upper surface of the forming chamber 11 below the bottom center of the print working chamber 3; the laser sintering device controls the laser shot angle and position to control the laser injection angle and position The movement of the base powder is printed by the movement of the forming chamber piston assembly 13; the upper end of the printing working chamber 3 is provided with a protective gas inlet 14, and the lower left lower end is provided with a protective gas outlet 1, and the bottom side is ...

Embodiment 2

[0031] The whole is consistent with Example 1, and the difference is:

[0032] Summer-hot block 6 is made of aluminum nitride ceramics

[0033] Compared with Example 1, the thermal block solid strength is constant, but the warm ability is deteriorated, and the average elongation printed by the present embodiment by pure PA12 is obtained by pure PA12. The average elongation is below the first embodiment. 1.6% .

Embodiment 3

[0035] The whole is consistent with Example 1, and the difference is:

[0036] The hot block 6 is made of tempered glass

[0037] Compared with Example 1, the heating block is reinforced, but the warm ability is deteriorated, and the product is printed by the pure PA12, and the size of the product printed by the present embodiment is 0.1% (such as 10 mm design size, implementation)Example 1 is printed to be 10.03 mm, this embodiment is 10.02, of course, the data only uses only a rough class ratio, and cannot be accurate to all dimensions, but the overall trend has a statistical manifestation, the average elongation is lower than the implementationExample 1 Print product 2.2%.

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Abstract

The invention discloses a selective laser sintering device for soaking heat and preventing faults and a manufacturing method thereof. The area that affects the laser channel and the position directly above the molding cavity are equipped with a uniformly distributed preheating device, and a soaking block is fixed on the inner surface of the machine base corresponding to the position of the molding cavity; between the lower part of the preheating device and the position above the molding cavity In the area, there is also a heat soaking light-transmitting panel made of solar ultra-clear rolled glass with a thickness of 1mm-2mm. A disc pattern formed by multiple sets of circular and incomplete circular reliefs with a pitch of 5mm. The invention has uniform preheating during 3D printing, good sintering formability, uniform performance of sintered products, no faults in sintering, and stable structure of sintered products.

Description

Technical field [0001] The present invention relates to the field of chemical composite materials, and more particularly to a thermal anti-microfibrilization layer selective laser sintering device and a method of manufacturing the same. Background technique [0002] Selective laser sintering is the SLS method using an infrared laser as an energy source, and the molding material used is mostly powder material. When processing, the powder is first heated to a temperature slightly lower than its melting point, and then the powder is flattened under the action of a flat stick; the laser beam is selectively sintered according to the hierarchical cross-section information under computer control. After the next layer of sintering, after all sintering, the extra powder can be obtained, and the part can be obtained. The mature process material is wax powder and plastic powder, and the process of sintering with metal powder or ceramic powder is still studying. After molding, the product is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/153B29C64/20B29C64/268B29C64/371B29C64/321B29C64/295B29C64/314B33Y10/00B33Y30/00B33Y40/00B33Y40/10
CPCB29C64/153B29C64/20B29C64/268B29C64/371B29C64/321B29C64/295B29C64/314B33Y10/00B33Y30/00B33Y40/00
Inventor 梁寅孙茂银李英吴健吴泽宏于云峰张翠翠
Owner 贵州森远增材制造科技有限公司
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