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Fully-automatic vision BGA repairing work station

A fully automatic, workstation technology, applied in electrical components, printed circuit manufacturing, electrical components, etc., can solve the problems of poor quality and performance of SMT components

Active Publication Date: 2018-08-17
SHENZHEN ZHUO MAO TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Based on the above, the quality and performance of the bonded SMT chip components are relatively poor due to factors such as the soldering process and human factors.

Method used

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  • Fully-automatic vision BGA repairing work station
  • Fully-automatic vision BGA repairing work station
  • Fully-automatic vision BGA repairing work station

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Embodiment Construction

[0017] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0018] Please refer to Figure 1 to Figure 5 As shown, a fully automatic visual BGA rework workstation is described below in conjunction with the embodiments, including a frame 1, a fuselage cover 2, a frame platform 3, a Y-axis moving mechanism, an X-axis moving mechanism, a Z-axis moving mechanism, and a lower double temperature district structure.

[0019] Described fuselage outer cover 2 comprises the fuselage lower cover that is installed on frame 1 periphery, is installed on the fuselage upper cover above fuselage lower cover; Described fuselage ...

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Abstract

The invention relates to a fully-automatic vision BGA repairing work station. The work station comprises a rack, a fuselage outer cover and a rack platform. The two sides of the rack platform are provided with Y-axis moving mechanisms, X-axis moving mechanisms are arranged on one end of each of the two-side Y-axis moving mechanisms, a Z-axis moving mechanism is arranged above the X-axis moving mechanisms, a lower-portion double-temperature area structure is arranged below the two-side Y-axis moving mechanisms, and the lower-portion double-temperature area structure is directly installed on therack platform so as to form the fully-automatic vision BGA repairing work station. A machine adopts a computer control mode to drive the X-axis moving mechanisms, the Y-axis moving mechanisms and theZ-axis moving mechanism to complete X-axis direction, Y-axis direction, the Z-axis direction and R axis (R angle) intelligent motion system operation. Accurate alignment is realized, an absorption material and a pasting and installation height are automatically identified, and automatic alignment, automatic pasting and installation, automatic welding and automatic desoldering operation are performed so that an effect of increasing the quality of an attached SMT patch component is achieved.

Description

【Technical field】 [0001] The invention relates to a fully automatic visual BGA rework workstation used in the SMT manufacturing industry. 【Background technique】 [0002] With the development of electronic technology products, they are gradually developing in the direction of high precision. In the SMT manufacturing industry, the SMT chip components are getting smaller and smaller, and the distance between pins on the chip components is getting closer and closer. The direct or indirect relationship of the soldering process has become the main factor affecting the defective rate in the process of PCB finished product processing, and the influence of human factors has become the factor affecting the defective rate in the process of PCB finished product processing. Based on the above, the quality and performance of the bonded SMT chip components are relatively poor due to factors such as the soldering process and human factors. 【Content of invention】 [0003] In view of this...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K3/34
CPCH05K3/341H05K13/0486
Inventor 陈福琪孙俊
Owner SHENZHEN ZHUO MAO TECH
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