122results about "PCB positioning during processing" patented technology

The invention relates to the technical field of PCB machining, in particular to a full-automatic integrated vacuum hole plugging machine which comprises a bottom frame, a hole plugging device, an ink scraping device and a transferring mechanism, the hole plugging device is used for completing the hole plugging process of a PCB, the ink scraping device is used for completing the oil coating and ink scraping process of the PCB, and the transferring mechanism is used for transferring the PCB to the bottom frame. And the transferring mechanism is used for moving the PCB to be plugged into the clamping mechanism in the hole plugging device or moving the PCB subjected to hole plugging into the clamping mechanism of the ink scraping device. According to the full-automatic integrated vacuum hole plugging machine, the hole plugging and ink scraping processes of the PCB can be completed, meanwhile, the PCB is moved into the clamping mechanisms of the hole plugging device and the ink scraping device through the transferring mechanism, the feeding action of the hole plugging process or the ink scraping process of the PCB is automatically completed, and therefore the efficiency, quality and yield of the hole plugging process and the ink scraping process of the PCB are ensured.

The invention discloses a double-station circuit board beveling machine, and relates to the technical field of circuit board processing equipment.The double-station circuit board beveling machine comprises a first base and a first tool apron, and the first tool apron is supported on the first base through a tool apron displacement assembly; the tool apron displacement assembly comprises a first left-right translation module, a first height adjusting module and two first front-back displacement modules which are symmetrically arranged, and the first left-right translation module and the first height adjusting module drive the two first tool aprons to integrally displace in the Y-axis direction and the Z-axis direction; each first front-back displacement module can independently drive a first worm and gear rotation device to move in the Y-axis direction, the first worm and gear rotation device rotates the angle of a first tool apron, angle adjustment is completed, a double-tool-apron structure which is symmetrically arranged up and down can synchronously cut the upper edge and the lower edge of a circuit board at the same time, and a three-axis movement system is matched, so that the machining efficiency is improved. And a worm and gear angle adjusting mechanism is combined, so that positioning is more accurate, and precision is higher.

The invention relates to the field of PCB (printed circuit board) printing, in particular to a high-precision multi-layer lamination and alignment PCB printing process which comprises a substrate pretreatment stage, a substrate preassembly stage, a dynamic lamination stage and a finished product output stage, the dynamic lamination stage comprises preheating treatment and resonance impurity removal treatment, and the lamination stage is divided into multi-stage lamination. And air bubbles and resin between the laminated bodies are optimized in the second pressing stage. According to the method, the inner-layer core plate and the copper foil are pretreated, so that positioning of the multi-layer core plate is more accurate and detection is facilitated, meanwhile, nanoscale micropores are formed in the copper foil through a laser technology to improve the flowing property of subsequent resin, and in the pressing process, pre-pressing and multi-stage pressing are set to improve the pressing accuracy; and in the second-stage pressing process, the dispersion direction of internal bubbles and the flowing direction of resin are improved through an ultrasonic device, a radiation heating device, a magnetic field assisting device and the like, the alignment accuracy and the pressing precision of the plate are further improved, and the machining efficiency is guaranteed.

The invention provides a correction method of a pneumatic clamp assembly, which comprises the following steps: controlling a main shaft assembly to move to a preset position, controlling a positioning piece to extend into a first positioning area of a first positioning part of the pneumatic clamp assembly and move in the first area, and controlling the first positioning part to clamp the positioning piece so as to correct the position of the first positioning part; detecting the position deviation between a main shaft of the main shaft assembly and a detection piece on the air clamping assembly; and determining the position of a first positioning point of the first positioning part based on the position deviation. The invention further provides a detection method of the positioning piece and circuit board processing equipment. According to the correction method of the air clamp assembly, the detection method of the positioning piece and the circuit board processing equipment, the position of the air clamp assembly can be accurately adjusted and corrected, so that the processing precision of the circuit board processing equipment is improved.

The invention relates to the technical field of PCB drilling positioning, and particularly provides a PCB drilling positioning method and system.The method comprises the steps that structured light pattern images corresponding to different reference mark points are obtained, and the structured light pattern images comprise preset structured light patterns with projection areas covering the reference mark points; for each reference mark point, actual Z-axis height information is obtained according to the structured light pattern image, and then the focusing depth of the laser scanning system is adjusted according to the actual Z-axis height information; for each reference mark point, acquiring original two-dimensional coordinate information of the reference mark point by using a laser scanning system, and then correcting the original two-dimensional coordinate information according to the actual Z-axis height information and preset optical geometric parameters of the laser scanning system to obtain corrected two-dimensional coordinate information; correcting a preset drilling target point position according to all the corrected two-dimensional coordinate information to obtain a final drilling position of the drilling target point; according to the method, the problems of defocusing and projection errors caused by unevenness of the PCB can be effectively solved.

The present invention relates to the technical field of PCB board processing, and more particularly to a fully automatic, integrated vacuum plugging machine, comprising a base frame, a plugging device, a scraping device, and a transfer mechanism. The plugging device is used to complete the plugging process of a PCB board, the scraping device is used to complete the oiling and scraping processes of the PCB board, and the transfer mechanism is used to move a PCB board to be plugged into a clamping mechanism within the plugging device, or to move a PCB board that has been plugged into the clamping mechanism of the scraping device. The fully automatic, integrated vacuum plugging machine of the present invention can complete the plugging and scraping processes of a PCB board, and simultaneously, through the transfer mechanism, enables the PCB board to be moved into the clamping mechanism of the plugging device and the scraping device, automatically completing the loading action of the PCB board for the plugging process or the scraping process, thereby ensuring the efficiency, quality, and yield of the plugging and scraping processes of the PCB board.

The invention belongs to the technical field of silk-screen printing thick conductors, and particularly relates to printing equipment and method for manufacturing a thick conductor and a thick conductor circuit. The printing area is used for printing conductor paste on the LTCC raw ceramic chip; the drying area is used for drying the conductor paste printed on the LTCC raw ceramic chip; the workbench is installed on a guide rail arranged between the printing area and the drying area, and a plurality of adsorption openings are formed in the workbench and used for adsorbing and fixing LTCC raw ceramic chips. The control system controls the workbench to move between the printing area and the drying area through the guide rails. Compared with the prior art, the device has the beneficial effects that multiple printing and drying procedures can be completed on the same equipment, and by improving the workpiece fixing mode and the transfer mode between the procedures, it is guaranteed that alignment marks on a screen printing plate and a green ceramic chip are accurately aligned every time printing is conducted; by using the equipment, the thick conductor can be printed on the LTCC raw ceramic chip, the sintering thickness of the conductor is greater than 50 microns, the pattern line width precision of the thick conductor is high, and the alignment precision is high.

The invention relates to the technical field of image recognition, in particular to a circuit board ink screen printing method based on accurate positioning and a positioning device. The method comprises the following steps: acquiring circuit board placement data; detecting the edge and key positioning points of the circuit board based on the circuit board placement data, and adjusting a fine adjustment indexing rotating rod of a jig top plate to obtain accurate alignment data of the circuit board; the jig top plate is subjected to jig locking through the circuit board accurate alignment data, and the circuit board coining fixing position is obtained; a film pressing frame is installed according to the circuit board coining fixing position, and the pressing force of the film pressing frame is monitored in real time through a pressure sensor; and printing ink screen printing PID control is conducted on the scraper based on the pressing force, and printing ink screen printing control data are generated. Through accurate positioning, real-time pressure control, intelligent quality detection and automatic screen plate positioning, the positioning accuracy and pressure control stability of the circuit board ink screen printing process are improved.

The invention relates to the technical field of PCB processing, and particularly discloses an anti-offset PCB short slot processing device. Comprising a fixing square plate, an electric push rod is fixedly connected to the bottom of the fixing square plate, a driving shaft of the electric push rod penetrates through the fixing square plate and is fixedly connected with a pressing plate, a square rubber pad is fixedly connected to the bottom of the pressing plate, and a bottom penetrating rod is fixedly connected to the bottom of the pressing plate. The square rubber pad is used for fixing the plate body in an elastic pressing mode, the static friction force of the plate body is increased through the rubber face of the square rubber pad, and the situation that the machining precision of the short groove hole is affected by continuous slight deviation caused by shaking or shaking when the plate body is subjected to drilling machining is prevented. And a hollow area is arranged between the fixed square plate and the pressing plate, so that cleaned scraps can be conveniently discharged to the outer side, and the situation that the cleaned scraps are pushed to the position between the fixed square plate and the pressing plate by the cleaning device to be accumulated to affect subsequent placement of the PCB during drilling of the drill bit is prevented.

The invention discloses plate machining equipment and a plate feeding and discharging method.The plate machining equipment comprises a main body, a machining platform, a base plate, a positioning piece, a guiding and supporting mechanism and a beating and pressing device, the machining platform is arranged on the main body, the base plate is movably arranged on the upper surface of the machining platform and used for carrying a to-be-machined plate, and the positioning piece is arranged on the machining platform and used for carrying the to-be-machined plate; the guiding and supporting mechanism is arranged on the main body, the guiding and supporting mechanism can penetrate through the machining platform and is used for supporting and guiding a base plate, and the beating and pressing device is arranged on the main body, located above the machining platform and used for beating and pressing a to-be-machined plate. When a plate is machined, the plate to be machined is carried through the base plate, then the base plate and the plate to be machined are guided to the machining position of the machining platform through the guiding and supporting mechanism, and then the plate to be machined is patted and pressed through the patting and pressing device, so that the base plate and the plate to be machined are positioned with the positioning piece in a sleeving mode; and the plate positioning automation and positioning effect of the plate machining equipment are improved.

The application belongs to the field of pad repair, and discloses a fast and accurate pad repair method and equipment, which comprises the following steps: providing a circuit board with a defective pad; importing a Gerber file of the circuit board into a computer to prepare for starting the repair work; marking a point; performing mechanical positioning (a probe) on the defective pad; performing visual positioning on the defective pad; performing secondary mechanical positioning (a printing head) on the defective pad; printing the pad; solidifying the pad; and trimming the appearance of the pad. The application adopts a three-positioning method, i.e., firstly positioning the position of the pad by using a mechanical pointer, and then performing secondary positioning by using a scanning camera component, so that the positioning accuracy can be effectively improved. The application has a fast pad repair speed, and the speed advantage is more prominent especially for the case of a larger area pad defect. The application uses an electronic additive manufacturing technology to repair the pad, so that the material waste can be reduced, and the application is very friendly to the environment.

The application provides a high-efficiency bending method applied to a flexible circuit board, which is realized by a bending device and comprises the following specific steps: (1) placing a first circuit board on a first workbench, with a connecting terminal of the first circuit board extending out of the placing table; (2) placing a second circuit board on a second workbench; (3) driving a turnover device to turn over the second circuit board to the first workbench, so that the first circuit board and the second circuit board correspond to each other; (4) fixing the front ends of the first circuit board and the second circuit board by a fixing assembly; (5) resetting the turnover device, so that the second circuit board is located above the first circuit board; (6) moving a bending limiting device downward and limiting the rear ends of the first circuit board and the second circuit board; and (7) moving a bending device upward through a bending interval to bend the first circuit board and the second circuit board, so that the bending consistency is good and the bending efficiency is high.

The application discloses an auxiliary packaging device, an auxiliary packaging method and a computer readable storage medium. The auxiliary packaging device comprises a rack, a movement module having a placing part for placing a printed circuit board, and an auxiliary module having a lifting part and a jacking part. The lifting part is movable between a standby position and a lifting position, and the lifting part lifts the printed circuit board away from the placing part during movement from the standby position to the lifting position. The jacking part is movable between an initial position and a jacking position, and the jacking part jacks the printed circuit board away from the lifting part during movement from the initial position to the jacking position. According to the auxiliary packaging device, a worker does not need to hold the printed circuit board with one hand and put a bag with the other hand when packaging the printed circuit board in a bag, thereby reducing the labor intensity and physical burden of the worker, improving the efficiency of bag packaging, and reducing the production cost.

The invention relates to a special positioning bottom plate for numerical control machining of a high-precision printed circuit board and a machining method. Linear guide rails, guide grooves, scale marks, corresponding auxiliary holes and the like are machined on a conventional phenolic resin base plate by adopting a mechanical and laser combined application method. The problems that a base plate positioning machining method commonly used in the industry is low in efficiency, high in cost and poor in precision, and deviation exists between the perpendicularity between different positions of the upper surface of the base plate and a main shaft, and the deviation can directly cause cutter breaking, deviation, hole inclination, cutter abrasion and the like in the drilling machining process can be fundamentally solved.

The invention discloses PCB processing equipment which comprises a bottom plate, a swing arm assembly is arranged on one side of the top of the bottom plate, a swing plate is arranged at the swing end of the swing arm assembly, a plurality of suction cups distributed in an array mode are arranged at the bottom of the swing plate, the suction cups are connected with a negative pressure source through hoses, and a lead screw driving mechanism is arranged on the other side of the top of the bottom plate. A clamping frame is arranged at the execution position of the lead screw driving mechanism, and the arc track of the swing plate driven by the swing arm assembly to swing intersects or is tangent to the vertical direction of the initial position of the clamping frame. A copper-clad plate is sucked by arranging the swing plate and is rotated between the clamping plates through the rotating mechanism, then the clamping plates are driven by the clamping mechanism to clamp the copper-clad plate, and then the copper-clad plate is driven by the lead screw driving mechanism to move to the notch in the placement frame, so that damage to the copper-clad plate caused by manual clamping of a worker can be avoided; and the production quality of the copper-clad plate is effectively improved.

The invention discloses a processing method for improving picosecond cutting board warping of an FPCOIL product, which comprises the following steps that a circuit board containing the product and a laser carrier capable of containing the circuit board are provided, and the laser carrier comprises a lower jig and an upper jig; the lower jig is placed on a working table; the circuit board is placed in the lower jig, and then the upper jig is placed at the upper end of the lower jig; the working table board adsorbs a circuit board through a lower jig, and a plurality of exhaust holes are formed in the lower jig; and cutting the circuit board by using a picosecond laser. The structure that the lower jig and the upper jig are fixed in a magnetic attraction mode is adopted for improving warping of a product board, the lower jig is placed on the working table, the whole circuit board is placed in the lower jig, a plurality of exhaust holes distributed in the periphery of the product are formed in the lower jig, effective attraction of the working table to the circuit board is facilitated, and the follow-up laser cutting precision is improved; and the upper jig is pressed on the edge area of the circuit board, so that the warping of the product can be improved.

The present invention discloses a double-sided exposure device and method for high-density circuit boards. The double-sided exposure device includes a workbench and a frame fixed on the workbench. The upper surface of the workbench is provided with an X-axis moving mechanism. The X-axis moving mechanism includes two grooves opened on the upper surface of the workbench and parallel to each other. Each of the grooves is provided with an X-axis linear module. The slide of each X-axis linear module is provided with a fixed plate. The upper surface of the fixed plate is provided with a circuit board rotating assembly and a Y-axis moving mechanism. The present invention can realize double-sided exposure of high-density circuit boards. After the front of the circuit board is exposed, the circuit board does not need to be removed. The circuit board can be turned over to realize exposure of the back of the circuit board. The circuit board fixing frame can realize rapid support and fixation of the circuit board. The mask plate fixing frame quickly installs the mask plate, thereby improving the working efficiency of circuit board exposure. The entire exposure equipment structure is simple and low-cost.

The present invention belongs to the field of flexible circuit board processing, and specifically relates to a flexible circuit board film laminating device, which includes a front box and a rear box. A gate is installed between the front box and the rear box. A sealing door is installed at the front end of the front box. A movable table capable of translating is provided in the front box and the rear box. Above the movable table, there is a tray for placing the flexible circuit board. A wound isolation film is provided in the rear box. Both ends of the isolation film are straightened through a loading box. A protective film for fitting the flexible circuit board is pasted on the bottom surface of the isolation film. Above the isolation film, there are two pressing arms capable of moving. Multiple spray heads capable of spraying are provided on the surface of the pressing arms. An exposure module is installed on the inner top of the front box. Through this setting, the functions of film laminating and post-treatment after film laminating of the flexible circuit board are realized, and the whole process is automatically controlled without human assistance.

The invention relates to the technical field of circuit board ironing, in particular to automatic flexible circuit board ironing equipment. The invention provides automatic flexible circuit board ironing equipment which comprises a mounting base, electric sliding rails, a placement table, a mounting shell, an air cylinder, a sliding rod, a mounting plate, an ironing plate and the like, the electric sliding rails are symmetrically mounted at the front and back of the top of the mounting base, electric sliding blocks are slidably mounted on the electric sliding rails, and the placement table is arranged between the tops of the electric sliding blocks; a mounting shell is arranged on the mounting base, an air cylinder is mounted on the mounting shell, sliding rods are arranged on the left side and the right side of the top of the mounting shell in a front-back symmetrical sliding mode, a mounting plate is arranged on a piston rod of the air cylinder, the mounting plate is connected with the bottom ends of the sliding rods, and an ironing plate is mounted at the bottom of the mounting plate. The purification mechanism sucks waste gas through a gas suction pump and sends the waste gas to a purification box through a gas inlet pipe, harmful substances are filtered through a filter element, it is ensured that discharged gas is harmless, and the influence of scalding waste gas on the environment and personnel is relieved.

The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board positioning tool which comprises an assembly frame, a clamping unit for clamping a main circuit board is arranged on the upper portion of the bottom wall of the assembly frame, and the lower portion of the top wall of the assembly frame is connected with a limiting unit for clamping an auxiliary circuit board through a position adjusting unit. The auxiliary circuit boards in different shapes can be clamped and fixed by adopting the limiting units, so that the adaptability to the auxiliary circuit boards is improved, the distance between the lower contacts of the auxiliary circuit boards and the main circuit board is uniform, the contacts of the auxiliary circuit boards can accurately abut against the main circuit board, and the working efficiency of the auxiliary circuit boards is improved. According to the auxiliary circuit board alignment device, the columnar piece is adopted to drive the expansion piece to be inserted into the positioning hole in the main circuit board, the expansion piece can abut against the inner wall of the positioning hole in a self-adaptive mode by synchronously moving the expansion piece, and therefore the stability of the auxiliary circuit board in the welding process is improved.

The embodiment of the invention provides a circuit board, a carrier assembly and a circuit board carrier system. The circuit board comprises a board body, the side edge of the board body is provided with a plurality of concave parts which are arranged at intervals, and each concave part is arranged to be inserted by one installation protrusion of the carrier assembly. The circuit board provided by the embodiment of the invention can have a relatively large layout area, relatively low layout difficulty and relatively low cost.

The invention relates to the technical field of adhesive tape pasting equipment, in particular to automatic adhesive tape pasting equipment which comprises a jig lifting conveying mechanism, a material taking moving mechanism, an adhesive tape pasting mechanism, a circuit board feeding conveying mechanism and a finished product discharging conveying mechanism. The jig lifting and conveying mechanism is used for driving the bearing jig to ascend and descend in the vertical direction and conveying the bearing jig to the side portion of the finished product discharging and conveying mechanism. The material taking moving mechanism comprises a linear driving device, a jig grabbing device and a circuit board grabbing device. The adhesive tape attaching mechanism is connected with the material taking and moving mechanism; the circuit board feeding conveying mechanism is used for conveying a to-be-rubberized processing circuit board to the input end of the finished product discharging conveying mechanism. The finished product discharging and conveying mechanism is used for conveying the bearing jig which completes fixing of the machined circuit board to the discharging end of the equipment. According to the automatic rubberizing equipment provided by the invention, the efficiency and quality of rubberizing operation are improved, and the labor intensity of workers is reduced.

The invention relates to the technical field of electronic manufacturing, and discloses an aluminum substrate electrical element rapid replacement device which comprises a bottom groove plate, one side of the bottom groove plate is fixedly connected with an auxiliary bottom plate, one end of the auxiliary bottom plate is fixedly connected with a mounting partition plate, and one side, away from the bottom groove plate, of the mounting partition plate is fixedly connected with an electrical box. A handle is arranged at the upper end of the outer side face of the electrical box, two first supporting columns are fixedly connected to one end of the upper side face of the bottom groove plate, a second supporting column is fixedly connected to one end of the upper side face of the bottom groove plate, a workbench plate is fixedly connected to the tops of the upper side faces of the first supporting columns, and one side of the workbench plate is fixedly connected to the side face of the mounting partition plate. The device further comprises a plane moving device, a temperature rising auxiliary device and a dismounting and mounting equipment connecting table, precise temperature control is achieved through plane moving and layered heating, and aluminum substrates with different thicknesses can be rapidly clamped and treated in cooperation with a modular tool suspension system and a self-adaptive clamping structure.

The invention belongs to the technical field of integrated circuits, and particularly relates to PCB element pressing equipment for an integrated circuit carrier, which comprises a working table, a pressing assembly is mounted at the top end of the working table, a pressing table is mounted at one end of the pressing assembly, a pressing box is arranged below the pressing table, and the bottom end of the pressing box is fixedly connected with the top end of the working table. Feeding structures are arranged on the two sides of the pressing box, the feeding structures can convey PCBs to the position above the pressing box and discharge the PCBs, and a guide slope is formed in the inner side of the top end of the pressing box and used for guiding the PCBs when the PCBs are fed into the pressing box; the PCB in the containing groove can be clamped through the clamping plate, the moving plate is pushed through the electric telescopic rod to drive the PCB to move to the position above the pressing box, the PCB is discharged, the guide slope face guides the discharged PCB, in this way, the PCB can be more accurately put into the pressing box, and the influence caused by offset pressing is avoided.

The invention is suitable for the technical field of automation, and provides a positioning, overturning and jacking device and a positioning and overturning method. The positioning, overturning and jacking device comprises an overturning assembly, a jacking assembly and a lifting assembly, wherein the overturning assembly is arranged on the rack; the turnover datum plate is provided with a first station and a first vacuum part, a first positioning block is arranged in the first station, and the turnover datum plate is connected with the turnover assembly and used for driving the turnover datum plate to turn over the first station; the jacking assembly is arranged on the rack; and the jacking datum plate is provided with a second station and a second vacuum piece, a second positioning block is arranged in the second station, the jacking datum plate is arranged on the jacking assembly, and the jacking assembly is used for driving the jacking datum plate to ascend, so that the first station is in butt joint with the second station. According to the material overturning device, material overturning is achieved through the jacking assembly and the overturning assembly, the positioning precision and the material discharging and taking efficiency are improved, and the labor intensity is greatly reduced.

The present invention relates to automated production equipment for circuit boards, and particularly to an auxiliary board loading device. The device cooperates with an opening and closing cylinder and an insertion frame assembly. First, the clamping plate frame is vertically inserted into the insertion frame assembly, and then the insertion frame assembly and the clamping plate frame are horizontally laid down to the board loading area together through the opening and closing cylinder. After that, the rotating telescopic assembly abuts and presses the clamping plate frame, and the clamping opening cylinder drives the clamping opening member to open the board clamping assembly on the clamping plate frame. The operator only needs to place the thin circuit board in place, and then control the device to close the clamp and then raise the clamping plate frame. In the whole process, the operator only needs to horizontally place the circuit board in the clamping plate, and other actions of vertically and horizontally clamping the plate frame and the action of opening the clamp are all completed by this device. It can not only improve the efficiency of manually loading the thin circuit board onto the clamping plate frame, but also the horizontal board loading can reduce the damage to the circuit board caused by manual board loading and improve the production yield.

The present invention relates to the technical field of circuit board bending, and discloses an automatic bending device for FPC flexible circuit boards and a bending method thereof, including a rail. A side fixing plate is fixedly connected to the front side surface of the rail, and a material box fixing plate is fixedly connected to the rear side surface of the rail. A flipping assembly is arranged above the rail. The guide rail is fixedly connected to the surface of the rail, and the static sliding bar is fixedly connected to the surface of the guide rail. The flipping tooth groove is opened at the middle position of the surface of the static sliding bar. The sliding rail seat is slidably connected to the outer side surface of the guide rail. The flipping plate is slid away from the folded flexible circuit board through the spline rod and the flipping shaft, simplifying the driving structure steps through the operation linkage of the structure and improving the processing efficiency. At the same time, the spline rod rotates to drive the flipping plate to flip, folding the flexible circuit board in half. This folding method can prevent the protective arc at the bending part from being overly pressed and resulting in circuit breakage.

The invention discloses a high-precision etching treatment device for a fine circuit, and relates to the technical field related to workpiece etching treatment, and the high-precision etching treatment device comprises an etching treatment machine body, a moving sliding table, a dust collection assembly, a negative pressure fixing assembly and a dust cleaning unit, and the right side of the top end of the etching treatment machine body is provided with a single-chip microcomputer; the moving sliding table is installed on the inner wall of the top of the etching treatment machine body, the laser is installed on the bottom side of the moving end of the moving sliding table, and the negative pressure fixing assembly is installed on the top side of the dust collecting shell. The problems that in the etching machining process of circuit board workpieces, the circuit board workpieces are mostly mechanically clamped or rigidly adsorbed, mechanical clamping easily causes workpiece edge damage and circuit deformation, rigid adsorption is difficult to adapt to workpieces with different surface profiles, the subsequent etching precision is affected, meanwhile, a large number of dust particles are generated in the laser etching process, and the production cost is reduced are solved. A traditional dust cleaning mode is low in efficiency and poor in effect, part of dust can be attached to the surface of a workpiece, the etching path of a laser is interfered, and the etching precision is affected.

The invention discloses pressing equipment for printed circuit board production, and relates to the technical field of circuit board pressing tin plating equipment. Comprising an equipment body, and a scraper mechanism, a screen plate mechanism and a conveying mechanism are arranged in the equipment body; the screen plate mechanism comprises a fixing frame, a lifting control cylinder is mounted on the fixing frame, a mounting frame is mounted at the output end of the lifting control cylinder, a screen plate is detachably mounted in the mounting frame, and mesh holes are formed in the screen plate. The circuit board can be conveyed to the position below the screen plate mechanism based on the conveying mechanism, solder paste is applied to the screen plate, the screen plate is moved downwards based on the lifting control cylinder, the circuit board is attached to the bottom of the screen plate, one scraper is lowered to the working height based on work of the scraper mechanism, and the solder paste is scraped on the top face of the screen plate through the other scraper. And the solder paste passes through the mesh holes, the heights of the two scrapers are switched, the other scraper is used for scraping the solder paste on the top surface of the mesh plate, and the process is repeated, so that the solder paste is attached to the circuit board through the mesh holes.

The present invention belongs to the technical field of integrated circuits, and more specifically, relates to a device for pressing components of PCB boards for integrated circuit carriers. The device comprises a workbench, a pressing assembly being mounted on the top of the workbench, a pressing platform being mounted on one end of the pressing assembly, a pressing box being disposed below the pressing platform, the bottom end of the pressing box being fixedly connected to the top of the workbench, feeding structures being disposed on both sides of the pressing box, the feeding structures being capable of conveying PCB boards to the top of the pressing box and unloading the boards, a guide slope being provided on the inner side of the top of the pressing box for guiding the PCB boards when they are fed into the pressing box, a clamping plate being used to clamp the PCB boards in the storage slots, a movable plate being driven by an electric telescopic rod to move the PCB boards to the top of the pressing box, and the PCB boards being unloaded, the guide slopes guiding the unloaded PCB boards, and in this way, more accurate placement of the PCB boards into the pressing box is achieved, thereby avoiding the influence caused by offset pressing.