26results about "PCB positioning during processing" patented technology

The application belongs to the field of pad repair, and discloses a fast and accurate pad repair method and equipment, which comprises the following steps: providing a circuit board with a defective pad; importing a Gerber file of the circuit board into a computer to prepare for starting the repair work; marking a point; performing mechanical positioning (a probe) on the defective pad; performing visual positioning on the defective pad; performing secondary mechanical positioning (a printing head) on the defective pad; printing the pad; solidifying the pad; and trimming the appearance of the pad. The application adopts a three-positioning method, i.e., firstly positioning the position of the pad by using a mechanical pointer, and then performing secondary positioning by using a scanning camera component, so that the positioning accuracy can be effectively improved. The application has a fast pad repair speed, and the speed advantage is more prominent especially for the case of a larger area pad defect. The application uses an electronic additive manufacturing technology to repair the pad, so that the material waste can be reduced, and the application is very friendly to the environment.

The invention discloses PCB processing equipment which comprises a bottom plate, a swing arm assembly is arranged on one side of the top of the bottom plate, a swing plate is arranged at the swing end of the swing arm assembly, a plurality of suction cups distributed in an array mode are arranged at the bottom of the swing plate, the suction cups are connected with a negative pressure source through hoses, and a lead screw driving mechanism is arranged on the other side of the top of the bottom plate. A clamping frame is arranged at the execution position of the lead screw driving mechanism, and the arc track of the swing plate driven by the swing arm assembly to swing intersects or is tangent to the vertical direction of the initial position of the clamping frame. A copper-clad plate is sucked by arranging the swing plate and is rotated between the clamping plates through the rotating mechanism, then the clamping plates are driven by the clamping mechanism to clamp the copper-clad plate, and then the copper-clad plate is driven by the lead screw driving mechanism to move to the notch in the placement frame, so that damage to the copper-clad plate caused by manual clamping of a worker can be avoided; and the production quality of the copper-clad plate is effectively improved.

The invention discloses a processing method for improving picosecond cutting board warping of an FPCOIL product, which comprises the following steps that a circuit board containing the product and a laser carrier capable of containing the circuit board are provided, and the laser carrier comprises a lower jig and an upper jig; the lower jig is placed on a working table; the circuit board is placed in the lower jig, and then the upper jig is placed at the upper end of the lower jig; the working table board adsorbs a circuit board through a lower jig, and a plurality of exhaust holes are formed in the lower jig; and cutting the circuit board by using a picosecond laser. The structure that the lower jig and the upper jig are fixed in a magnetic attraction mode is adopted for improving warping of a product board, the lower jig is placed on the working table, the whole circuit board is placed in the lower jig, a plurality of exhaust holes distributed in the periphery of the product are formed in the lower jig, effective attraction of the working table to the circuit board is facilitated, and the follow-up laser cutting precision is improved; and the upper jig is pressed on the edge area of the circuit board, so that the warping of the product can be improved.

The invention relates to the technical field of adhesive tape pasting equipment, in particular to automatic adhesive tape pasting equipment which comprises a jig lifting conveying mechanism, a material taking moving mechanism, an adhesive tape pasting mechanism, a circuit board feeding conveying mechanism and a finished product discharging conveying mechanism. The jig lifting and conveying mechanism is used for driving the bearing jig to ascend and descend in the vertical direction and conveying the bearing jig to the side portion of the finished product discharging and conveying mechanism. The material taking moving mechanism comprises a linear driving device, a jig grabbing device and a circuit board grabbing device. The adhesive tape attaching mechanism is connected with the material taking and moving mechanism; the circuit board feeding conveying mechanism is used for conveying a to-be-rubberized processing circuit board to the input end of the finished product discharging conveying mechanism. The finished product discharging and conveying mechanism is used for conveying the bearing jig which completes fixing of the machined circuit board to the discharging end of the equipment. According to the automatic rubberizing equipment provided by the invention, the efficiency and quality of rubberizing operation are improved, and the labor intensity of workers is reduced.

The invention discloses a high-precision etching treatment device for a fine circuit, and relates to the technical field related to workpiece etching treatment, and the high-precision etching treatment device comprises an etching treatment machine body, a moving sliding table, a dust collection assembly, a negative pressure fixing assembly and a dust cleaning unit, and the right side of the top end of the etching treatment machine body is provided with a single-chip microcomputer; the moving sliding table is installed on the inner wall of the top of the etching treatment machine body, the laser is installed on the bottom side of the moving end of the moving sliding table, and the negative pressure fixing assembly is installed on the top side of the dust collecting shell. The problems that in the etching machining process of circuit board workpieces, the circuit board workpieces are mostly mechanically clamped or rigidly adsorbed, mechanical clamping easily causes workpiece edge damage and circuit deformation, rigid adsorption is difficult to adapt to workpieces with different surface profiles, the subsequent etching precision is affected, meanwhile, a large number of dust particles are generated in the laser etching process, and the production cost is reduced are solved. A traditional dust cleaning mode is low in efficiency and poor in effect, part of dust can be attached to the surface of a workpiece, the etching path of a laser is interfered, and the etching precision is affected.

The invention discloses pressing equipment for printed circuit board production, and relates to the technical field of circuit board pressing tin plating equipment. Comprising an equipment body, and a scraper mechanism, a screen plate mechanism and a conveying mechanism are arranged in the equipment body; the screen plate mechanism comprises a fixing frame, a lifting control cylinder is mounted on the fixing frame, a mounting frame is mounted at the output end of the lifting control cylinder, a screen plate is detachably mounted in the mounting frame, and mesh holes are formed in the screen plate. The circuit board can be conveyed to the position below the screen plate mechanism based on the conveying mechanism, solder paste is applied to the screen plate, the screen plate is moved downwards based on the lifting control cylinder, the circuit board is attached to the bottom of the screen plate, one scraper is lowered to the working height based on work of the scraper mechanism, and the solder paste is scraped on the top face of the screen plate through the other scraper. And the solder paste passes through the mesh holes, the heights of the two scrapers are switched, the other scraper is used for scraping the solder paste on the top surface of the mesh plate, and the process is repeated, so that the solder paste is attached to the circuit board through the mesh holes.

The application discloses a kind of for semi-finished circuit board dividing board dividing board device and method, the present application relates to the technical field of semi-finished circuit board dividing board, the table top of workbench is provided with two for positioning and fixedly attaching semi-finished circuit board positioning and fixed assembly, positioning and fixed assembly in left side includes fixedly attached on the upright of workbench table top, it is hinged to the top end portion of upright first pin shaft rotating plate, rotating plate bottom surface left end portion is hinged to one connecting rod on second pin shaft, connecting rod is located in the left side of upright, and the top surface of rotating plate is fixedly attached with one strip positioning table and one vacuum chuck B;The spacer plate is provided with for pulling down two positioning and fixed assembly connecting rod pulling-down assembly.The beneficial effects of the present application are: greatly improve the efficiency of semi-finished circuit board dividing board, and no powdery waste in dividing board process.

The present application relates to the technical field of circuit board processing equipment, and particularly relates to a circuit board glue residue removing device and method. The device comprises a support frame, a rotating frame rotatably connected to the support frame, a mounting frame symmetrically connected to the bottom of the rotating frame, a rotating frame rotatably connected to the mounting frame, a driving motor symmetrically mounted on the side surface of the rotating frame, a brush cylinder symmetrically rotatably connected to the rotating frame, and a rotating shaft of the brush cylinder being connected to an output shaft of the driving motor, a first motor mounted on the side surface of the mounting frame, a first worm connected to the output shaft of the first motor, and a first worm wheel connected to the rotating shaft of the rotating frame and engaged with the first worm. Through cooperation of the cleaning frame, the first screw rod motor and the moving plate, the device can automatically scrape off the glue residue adhered to the brush cylinder and collect the glue residue into a collection box, effectively avoiding the problem of efficiency reduction caused by glue residue accumulation of a traditional brush, and significantly improving the glue residue removing effect and the continuous working capacity of the device.

The invention relates to a gold finger wire blind drilling process of a printed circuit board. The process comprises the following steps of gold finger and wire pattern design, jig positioning design, offset inspection design, printed circuit board manufacturing, wet film filling, jig positioning hole manufacturing, plate positioning and fixing, blind drilling, film removing and cleaning. The printed circuit board obtained through the process has the burr-free effect, blind drilling deviation of a broken hole can be prevented by adopting the process, and the risk that in the prior art, due to the fact that golden finger color difference exists, front-end nickel and gold layers are suspended and prone to falling off, the golden fingers are short-circuited abnormally after being inserted and pulled is effectively avoided.

The invention discloses a board splitting device and method for splitting a semi-finished circuit board, and relates to the technical field of board splitting of the semi-finished circuit board. Two positioning and fixing assemblies for positioning, adsorbing and fixing the semi-finished circuit board are arranged on the table top of a workbench; the positioning and fixing assembly located on the left side comprises a stand column fixedly arranged on the table top of the workbench and a rotating plate hinged to the top end of the stand column through a first pin shaft, and a connecting rod is hinged to the left end of the bottom surface of the rotating plate through a second pin shaft and located on the left side of the stand column. A strip-shaped positioning table and a vacuum chuck B are fixedly arranged on the top surface of the rotating plate; the base plate is provided with a pull-down assembly used for pulling down the connecting rods of the two positioning and fixing assemblies. The semi-finished circuit board splitting machine has the beneficial effects that the semi-finished circuit board splitting efficiency is greatly improved, and powdery scraps cannot be generated in the board splitting process.

This application relates to the field of circuit board manufacturing technology, and in particular to a rotary device and method for marking the front and back sides of flexible circuit boards. The device includes: a support frame, connecting rods, rotary servo motors, fixed clamping bars, a first tension cylinder, movable clamping bars, and a control base unit. The support frame includes a first support rod and a second support rod; one end of each connecting rod is connected to the center point of the first support rod; the rotary servo motors are connected to the other ends of each connecting rod; the fixed clamping bars are fixedly connected to the second support rod; one end of the first tension cylinder is fixedly connected to the second support rod; the movable clamping bars are fixedly connected to the other ends of the first tension cylinder; the control base unit includes a first control base and a second control base, which are respectively connected to two rotary servo motors. This application can improve marking accuracy and product quality, reduce manual operation, and increase work efficiency.

The application discloses a flash etching device for fine circuit processing of a PCB (Printed Circuit Board), and relates to the technical field of PCB processing.The device comprises a workbench, a mounting frame and a fixing frame are fixedly connected to the top of the workbench, the mounting frame is arranged on the outer side of the fixing frame, equidistantly rotating connections are arranged on the fixing frame, and a conveying roller is further arranged.The device further comprises a center adjusting mechanism and a dynamic spraying mechanism.The center adjusting mechanism is arranged to realize the axial reciprocating movement of the moving ring frame by means of the fixed sleeve, the moving ring frame and the push plate during the movement of the PCB from the left side of the fixing frame to the inside of the mounting frame, thereby driving the push plate to dynamically adjust the conveying center of the PCB placed on the conveying roller, so as to real-time correct the conveying center of the PCB, ensure that the conveying center is always in the middle, improve the uniformity and consistency of subsequent spraying, reduce the problem of uneven subsequent spraying caused by the deviation of the conveying center, thereby improving the spraying efficiency and product quality, and reducing the rate of defective products.

The present application relates to the field of PCB depth control drilling, and particularly discloses a 5G communication PCB depth control drilling device and process, which solves the problem that the existing PCB drilling device can only drill one side of the PCB and is inconvenient to turn over, and the following scheme is proposed, which comprises a device case, a drilling module, a base, a sliding frame, a rotating shaft, a mounting seat, a ratchet wheel, a push rod motor, a lower clamping plate, an upper clamping plate, a PCB, a sliding seat, a leveling assembly, a ratchet bar, a bidirectional telescopic piece, and a mounting seat, wherein the mounting seat is connected with a vertical plate connected with the sliding seat, the base is provided with an inclined angle seat at both ends and in sliding mode, the inclined angle seat is in contact with both ends of the PCB, the mounting seat is provided with a linkage assembly, the linkage assembly is used to control the ratchet bar and the inclined angle seat to slide in opposite directions when the bidirectional telescopic piece is telescoped, and the base is further provided with a cleaning assembly, which is used to clean the downward side of the PCB. The device can be flexibly turned over during PCB drilling processing, has high processing precision, and is good in universality.

The present application relates to the technical field of MiniLED plate manufacturing, in particular to a MiniLED plate manufacturing process, comprising the following steps: S1, taking a substrate, and smoothing and cleaning the surface of the substrate with a grinding brush; S2, setting a circuit on the substrate according to the required setting, and completing pad forming; S3, covering a copper foil layer on the substrate, which is in a frame-shaped structure capable of surrounding the pad; S4, performing laser and over-etching line processes on the substrate circuit board to obtain a copper-clad plate; S5, forming a blind hole on the copper-clad plate by using a drilling process; S6, performing hole-filling electroplating and film-removing processes on the copper-clad plate to obtain an electroplated plate; S7, performing etching on the electroplated plate to obtain a MiniLED plate. The present application also includes a processing clamp for MiniLED plate manufacturing, comprising a clamp table, a positioning table fixedly arranged at the upper end of the clamp table, protruding plates fixedly arranged at both ends of the positioning table in a symmetrical manner, guide holes formed in the protruding plates, and an adsorbing fixing hole formed in the middle position of the positioning table and penetrating through the clamp table.

The invention discloses a pressing process and method of a PCB (Printed Circuit Board), and relates to the technical field of PCB manufacturing. The process method comprises the following steps: coarsening the copper surface of an inner-layer plate, performing ultrasonic cleaning, and performing vacuum drying pretreatment; overlapping the inner layer plate, the prepreg and the copper foil according to a layer sequence, and accurately aligning through a positioning mechanism; the plate group is moved into a vacuum hot pressing cavity, and stepped heating and preheating are performed after vacuumizing; sequentially performing low-pressure exhausting, medium-pressure glue flowing, high-pressure curing segmented pressing and synchronous temperature control; maintaining the pressure and curing until the resin is completely crosslinked; and pressure relief and demolding are performed after pressure-maintaining segmented cooling. Through precise temperature and pressure control, vacuum segmented pressing and structure optimization, the interlayer bonding force of the PCB is improved, the defects of bubbles, deviation and the like are reduced, the product percent of pass is improved, the high-efficiency and high-quality production requirements of the multi-layer PCB are met, the process is stable and controllable, and the practicability is high.

The invention provides an automatic dismounting device and method of a positioning tool and an automatic recovery system formed by the automatic dismounting device, the automatic dismounting device comprises a tripping assembly and a cover turning assembly which are arranged in sequence, and the cover turning assembly comprises a cover turning driving piece, a guide shaft, a rocker and a cover turning shifting piece; the output end of the cover turning driving part is connected with the rocker through the guide shaft, one end of the guide shaft is fixedly connected with the output end of the cover turning driving part, and the other end of the guide shaft penetrates through the rocker; the end, away from the cover turning driving piece, of the rocker is provided with the cover turning shifting piece. The output end of the cover turning driving piece can drive the guide shaft, the rocker and the cover turning shifting piece to rotate in the axis plane perpendicular to the output end of the cover turning driving piece. The positioning tool dismounting device is high in structural applicability, positioning tools of different sizes and models can be conveniently separated, and the automation level and general applicability of positioning tool dismounting are improved.

The application discloses a kind of drilling target equipment, including bed body base, the upper of the bed body base is equipped with the Y-axis movement plate that can move back and forth, the left upper side, the middle upper side, the right upper side of the Y-axis movement plate are respectively equipped with the workbench along front and back extension, the workbench of left upper side, right upper side can be close to and away from the workbench of middle upper side, so that the workbench can support different size PCB board, the top surface of the workbench is equipped with several adsorption holes along front and back distribution, the adsorption hole can be fixed to PCB board adsorption, the top surface of the workbench of left upper side, right upper side can also supply along front and back extension paper tape placement, so that the workbench can be with the edge between PCB board pad paper tape;The upper of the Y-axis movement plate is equipped with the belt conveying component along front and back extension, the upper of the belt conveying component and the workbench is equipped with gantry.The structure design of the application is reasonable, can be automatically adjusted transmission and drilling position according to PCB board size.

The application belongs to the technical field of integrated circuits, in particular to a PCB plate element pressing device for integrated circuit carriers, which comprises a workbench, a pressing assembly is installed at the top end of the workbench, a pressing table is installed at one end of the pressing assembly, a pressing box is arranged below the pressing table, the bottom end of the pressing box is fixedly connected with the top end of the workbench, feeding structures are arranged on both sides of the pressing box, the feeding structures can convey the PCB plate to the top of the pressing box and discharge the PCB plate, a guide slope is formed in the inner side of the top end of the pressing box, which is used for guiding the PCB plate when the PCB plate is fed into the pressing box; the PCB plate in the storage groove can be clamped by the clamping plate, the PCB plate can be moved to the top of the pressing box by the movable plate driven by the electric telescopic rod, and the PCB plate is discharged, the guide slope guides the discharged PCB plate, and the PCB plate can be more accurately placed into the pressing box by this mode, so that the influence caused by deviation and pressing is avoided.

A substrate processing method and a substrate processing system for processing a substrate are provided. The substrate processing method includes the following steps: (A) heating the substrate on which a coating film is formed on a surface by supplying a coating liquid; (B) after the step (A), moving a spray destination of a removal liquid so as to go toward a center side of the substrate from a peripheral edge position of the surface of the substrate and turn back at a first position further outside than the peripheral edge position and return the peripheral edge position again, while rotating the substrate; (C) after the step (B), moving the spray destination of the removal liquid so as to go toward the center side of the substrate from the peripheral edge position of the surface of the substrate and turn back at a second position further outside than the first position and return the peripheral edge position again, while rotating the substrate; and (D) after the step (C), heating the substrate again.

The invention relates to the technical field of electronic component processing equipment, in particular to a steam furnace LED illuminating lamp circuit board spot welding gluing device which comprises a box body, and a conveying mechanism is horizontally arranged at the top of the box body; a spot welding mechanism and a gluing mechanism are arranged above the conveying mechanism in a matched and spanning mode, and a circuit board supporting assembly is detachably assembled on the conveying mechanism and used for being matched with supporting of a steam oven LED illuminating lamp circuit board and can drive the steam oven LED illuminating lamp circuit board to do intermittent stepping movement. Overturning mechanisms are further symmetrically arranged at the side ends of the conveying mechanism and used for overturning the circuit board so as to achieve collaborative processing of single-face spot welding and double-face gluing of the circuit board; a glue curing machine is arranged between the gluing mechanism and the turnover mechanism in a matched manner; the device is suitable for a double-face gluing and single-face spot welding cooperative automatic machining scene of the circuit board, and efficient and accurate machining of the steam oven LED illuminating lamp circuit board is achieved.

The application provides a flexible circuit board bending equipment, which comprises a rack, a first workbench for placing a first circuit board is arranged on the rack, a turnover device is arranged on one side of the rack, a second workbench for placing a second circuit board is arranged on the turnover device, a thimble device is arranged on the other side of the rack, an assembling mechanism is arranged on the front end of the rack, a placing table for placing the first circuit board is arranged on the front end of the first workbench, the connecting terminal of the first circuit board extends out of the placing table, a bending interval is arranged between the placing table and the first workbench, a bending device is arranged below the bending interval, and the bending device passes through the bending interval to bend the first circuit board and the second circuit board on the first workbench.

The invention discloses a circuit board pressing process method, and relates to the technical field of printed circuit board manufacturing. The circuit board pressing process method comprises the following steps: S1, separately performing release treatment on a positioning nail and a lining; s2, bushings subjected to release treatment are mounted in the mounting holes of the bottom plate, and the bottom ends of the positioning nails subjected to release treatment are inserted into the bushings of the bottom plate; s3, a first Teflon gasket, the target number of core plates and prepregs and a second Teflon gasket are sequentially arranged on the positioning nail in a sleeving mode, so that stack-up pre-typesetting is completed; and S4, the lining obtained after release treatment is mounted in the mounting hole of the cover plate, the laminated structure is covered with the cover plate, and the top end of the positioning nail is inserted into the lining of the cover plate. Teflon gaskets are additionally arranged on the two sides of the stacking structure in combination with release treatment, it is jointly guaranteed that a positioning system composed of the positioning nails and the linings is clean and smooth in the whole pressing process, labor and cost are efficiently saved, and meanwhile high alignment precision and product quality of pressing are reliably guaranteed.

The invention provides a multilayer circuit board press-fit processing device with precise positioning, which comprises a bottom plate, supporting rods are fixedly mounted on the periphery of the top of the bottom plate, and top plates are fixedly mounted on the tops of the four supporting rods; the driving telescopic rod is fixedly mounted at the top of the top plate; and the pressing assembly is arranged at the moving end of the driving telescopic rod. According to the multi-layer circuit board press-fit processing device with the precise positioning function, through mutual cooperation of structures such as the press-fit assembly, the pushing assembly, the clamping assembly and the placing assembly, when the device is used, the press-fit assembly pushes the assembly to move downwards, so that the pushing assembly pushes a fixing plate to move downwards synchronously, and the pressing efficiency of the multi-layer circuit board is improved. When the circuit board is pressed, the pull rope, the moving block and the clamping plate of the clamping assembly are driven to gather and clamp the circuit board from the four sides, accurate positioning is achieved, circuit board sliding and positioning deviation in the pressing process are avoided, and the production efficiency and the productivity are improved.

The invention relates to a grabbing and positioning method, which comprises the following steps of: preparing two sets of grabbing equipment, shooting equipment, detection equipment and a control host, analyzing and judging the inclination degree and the position degree of a shot circuit board picture through a processing unit, and sending a processed data signal to one set of grabbing equipment and the control host; the circuit board is grabbed through a grabbing device, the circuit board is moved according to a preset path through a control host and transferred to a target position, and meanwhile various data of the circuit board are detected through a detection device in the transferring process; the precision of the whole circuit board in the board dividing machine or the board dividing clamp is guaranteed through machine vision, and the situation that the circuit board is damaged in the board dividing process due to inaccurate position is avoided.

The utility model relates to the technical field of circuit board processing equipment, in particular to an automatic adjusting device of a pneumatic clamping assembly, which comprises a first guide mechanism used for supporting a first positioning part and provided with at least one moving degree of freedom; and the adjusting mechanism is installed on a main shaft assembly of the circuit board machining equipment, the adjusting mechanism comprises a driving part and a positioning piece, and the driving part is used for controlling the positioning piece to move to the clamping groove of the first positioning part from the preset position. The utility model further provides circuit board processing equipment. The main shaft assembly moves to drive the adjusting mechanism to adaptively move, the convenience and accuracy of automatic adjustment of the clamp are improved, meanwhile, the detection assembly for calibrating the positioning piece is designed, the accuracy of adjustment and positioning of the clamp can be further improved, the overall design is simple, and the practicability is high. Automatic adjusting and positioning can be achieved, labor is saved, and the adjusting efficiency is higher.