68results about "PCB positioning during processing" patented technology

The invention discloses a double-station circuit board beveling machine, and relates to the technical field of circuit board processing equipment.The double-station circuit board beveling machine comprises a first base and a first tool apron, and the first tool apron is supported on the first base through a tool apron displacement assembly; the tool apron displacement assembly comprises a first left-right translation module, a first height adjusting module and two first front-back displacement modules which are symmetrically arranged, and the first left-right translation module and the first height adjusting module drive the two first tool aprons to integrally displace in the Y-axis direction and the Z-axis direction; each first front-back displacement module can independently drive a first worm and gear rotation device to move in the Y-axis direction, the first worm and gear rotation device rotates the angle of a first tool apron, angle adjustment is completed, a double-tool-apron structure which is symmetrically arranged up and down can synchronously cut the upper edge and the lower edge of a circuit board at the same time, and a three-axis movement system is matched, so that the machining efficiency is improved. And a worm and gear angle adjusting mechanism is combined, so that positioning is more accurate, and precision is higher.

The invention relates to the technical field of PCB drilling positioning, and particularly provides a PCB drilling positioning method and system.The method comprises the steps that structured light pattern images corresponding to different reference mark points are obtained, and the structured light pattern images comprise preset structured light patterns with projection areas covering the reference mark points; for each reference mark point, actual Z-axis height information is obtained according to the structured light pattern image, and then the focusing depth of the laser scanning system is adjusted according to the actual Z-axis height information; for each reference mark point, acquiring original two-dimensional coordinate information of the reference mark point by using a laser scanning system, and then correcting the original two-dimensional coordinate information according to the actual Z-axis height information and preset optical geometric parameters of the laser scanning system to obtain corrected two-dimensional coordinate information; correcting a preset drilling target point position according to all the corrected two-dimensional coordinate information to obtain a final drilling position of the drilling target point; according to the method, the problems of defocusing and projection errors caused by unevenness of the PCB can be effectively solved.

The application belongs to the field of pad repair, and discloses a fast and accurate pad repair method and equipment, which comprises the following steps: providing a circuit board with a defective pad; importing a Gerber file of the circuit board into a computer to prepare for starting the repair work; marking a point; performing mechanical positioning (a probe) on the defective pad; performing visual positioning on the defective pad; performing secondary mechanical positioning (a printing head) on the defective pad; printing the pad; solidifying the pad; and trimming the appearance of the pad. The application adopts a three-positioning method, i.e., firstly positioning the position of the pad by using a mechanical pointer, and then performing secondary positioning by using a scanning camera component, so that the positioning accuracy can be effectively improved. The application has a fast pad repair speed, and the speed advantage is more prominent especially for the case of a larger area pad defect. The application uses an electronic additive manufacturing technology to repair the pad, so that the material waste can be reduced, and the application is very friendly to the environment.

The application provides a high-efficiency bending method applied to a flexible circuit board, which is realized by a bending device and comprises the following specific steps: (1) placing a first circuit board on a first workbench, with a connecting terminal of the first circuit board extending out of the placing table; (2) placing a second circuit board on a second workbench; (3) driving a turnover device to turn over the second circuit board to the first workbench, so that the first circuit board and the second circuit board correspond to each other; (4) fixing the front ends of the first circuit board and the second circuit board by a fixing assembly; (5) resetting the turnover device, so that the second circuit board is located above the first circuit board; (6) moving a bending limiting device downward and limiting the rear ends of the first circuit board and the second circuit board; and (7) moving a bending device upward through a bending interval to bend the first circuit board and the second circuit board, so that the bending consistency is good and the bending efficiency is high.

The application discloses an auxiliary packaging device, an auxiliary packaging method and a computer readable storage medium. The auxiliary packaging device comprises a rack, a movement module having a placing part for placing a printed circuit board, and an auxiliary module having a lifting part and a jacking part. The lifting part is movable between a standby position and a lifting position, and the lifting part lifts the printed circuit board away from the placing part during movement from the standby position to the lifting position. The jacking part is movable between an initial position and a jacking position, and the jacking part jacks the printed circuit board away from the lifting part during movement from the initial position to the jacking position. According to the auxiliary packaging device, a worker does not need to hold the printed circuit board with one hand and put a bag with the other hand when packaging the printed circuit board in a bag, thereby reducing the labor intensity and physical burden of the worker, improving the efficiency of bag packaging, and reducing the production cost.

The invention discloses PCB processing equipment which comprises a bottom plate, a swing arm assembly is arranged on one side of the top of the bottom plate, a swing plate is arranged at the swing end of the swing arm assembly, a plurality of suction cups distributed in an array mode are arranged at the bottom of the swing plate, the suction cups are connected with a negative pressure source through hoses, and a lead screw driving mechanism is arranged on the other side of the top of the bottom plate. A clamping frame is arranged at the execution position of the lead screw driving mechanism, and the arc track of the swing plate driven by the swing arm assembly to swing intersects or is tangent to the vertical direction of the initial position of the clamping frame. A copper-clad plate is sucked by arranging the swing plate and is rotated between the clamping plates through the rotating mechanism, then the clamping plates are driven by the clamping mechanism to clamp the copper-clad plate, and then the copper-clad plate is driven by the lead screw driving mechanism to move to the notch in the placement frame, so that damage to the copper-clad plate caused by manual clamping of a worker can be avoided; and the production quality of the copper-clad plate is effectively improved.

The invention discloses a processing method for improving picosecond cutting board warping of an FPCOIL product, which comprises the following steps that a circuit board containing the product and a laser carrier capable of containing the circuit board are provided, and the laser carrier comprises a lower jig and an upper jig; the lower jig is placed on a working table; the circuit board is placed in the lower jig, and then the upper jig is placed at the upper end of the lower jig; the working table board adsorbs a circuit board through a lower jig, and a plurality of exhaust holes are formed in the lower jig; and cutting the circuit board by using a picosecond laser. The structure that the lower jig and the upper jig are fixed in a magnetic attraction mode is adopted for improving warping of a product board, the lower jig is placed on the working table, the whole circuit board is placed in the lower jig, a plurality of exhaust holes distributed in the periphery of the product are formed in the lower jig, effective attraction of the working table to the circuit board is facilitated, and the follow-up laser cutting precision is improved; and the upper jig is pressed on the edge area of the circuit board, so that the warping of the product can be improved.

The present invention discloses a double-sided exposure device and method for high-density circuit boards. The double-sided exposure device includes a workbench and a frame fixed on the workbench. The upper surface of the workbench is provided with an X-axis moving mechanism. The X-axis moving mechanism includes two grooves opened on the upper surface of the workbench and parallel to each other. Each of the grooves is provided with an X-axis linear module. The slide of each X-axis linear module is provided with a fixed plate. The upper surface of the fixed plate is provided with a circuit board rotating assembly and a Y-axis moving mechanism. The present invention can realize double-sided exposure of high-density circuit boards. After the front of the circuit board is exposed, the circuit board does not need to be removed. The circuit board can be turned over to realize exposure of the back of the circuit board. The circuit board fixing frame can realize rapid support and fixation of the circuit board. The mask plate fixing frame quickly installs the mask plate, thereby improving the working efficiency of circuit board exposure. The entire exposure equipment structure is simple and low-cost.

The invention relates to the technical field of circuit board ironing, in particular to automatic flexible circuit board ironing equipment. The invention provides automatic flexible circuit board ironing equipment which comprises a mounting base, electric sliding rails, a placement table, a mounting shell, an air cylinder, a sliding rod, a mounting plate, an ironing plate and the like, the electric sliding rails are symmetrically mounted at the front and back of the top of the mounting base, electric sliding blocks are slidably mounted on the electric sliding rails, and the placement table is arranged between the tops of the electric sliding blocks; a mounting shell is arranged on the mounting base, an air cylinder is mounted on the mounting shell, sliding rods are arranged on the left side and the right side of the top of the mounting shell in a front-back symmetrical sliding mode, a mounting plate is arranged on a piston rod of the air cylinder, the mounting plate is connected with the bottom ends of the sliding rods, and an ironing plate is mounted at the bottom of the mounting plate. The purification mechanism sucks waste gas through a gas suction pump and sends the waste gas to a purification box through a gas inlet pipe, harmful substances are filtered through a filter element, it is ensured that discharged gas is harmless, and the influence of scalding waste gas on the environment and personnel is relieved.

The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board positioning tool which comprises an assembly frame, a clamping unit for clamping a main circuit board is arranged on the upper portion of the bottom wall of the assembly frame, and the lower portion of the top wall of the assembly frame is connected with a limiting unit for clamping an auxiliary circuit board through a position adjusting unit. The auxiliary circuit boards in different shapes can be clamped and fixed by adopting the limiting units, so that the adaptability to the auxiliary circuit boards is improved, the distance between the lower contacts of the auxiliary circuit boards and the main circuit board is uniform, the contacts of the auxiliary circuit boards can accurately abut against the main circuit board, and the working efficiency of the auxiliary circuit boards is improved. According to the auxiliary circuit board alignment device, the columnar piece is adopted to drive the expansion piece to be inserted into the positioning hole in the main circuit board, the expansion piece can abut against the inner wall of the positioning hole in a self-adaptive mode by synchronously moving the expansion piece, and therefore the stability of the auxiliary circuit board in the welding process is improved.

The embodiment of the invention provides a circuit board, a carrier assembly and a circuit board carrier system. The circuit board comprises a board body, the side edge of the board body is provided with a plurality of concave parts which are arranged at intervals, and each concave part is arranged to be inserted by one installation protrusion of the carrier assembly. The circuit board provided by the embodiment of the invention can have a relatively large layout area, relatively low layout difficulty and relatively low cost.

The invention relates to the technical field of adhesive tape pasting equipment, in particular to automatic adhesive tape pasting equipment which comprises a jig lifting conveying mechanism, a material taking moving mechanism, an adhesive tape pasting mechanism, a circuit board feeding conveying mechanism and a finished product discharging conveying mechanism. The jig lifting and conveying mechanism is used for driving the bearing jig to ascend and descend in the vertical direction and conveying the bearing jig to the side portion of the finished product discharging and conveying mechanism. The material taking moving mechanism comprises a linear driving device, a jig grabbing device and a circuit board grabbing device. The adhesive tape attaching mechanism is connected with the material taking and moving mechanism; the circuit board feeding conveying mechanism is used for conveying a to-be-rubberized processing circuit board to the input end of the finished product discharging conveying mechanism. The finished product discharging and conveying mechanism is used for conveying the bearing jig which completes fixing of the machined circuit board to the discharging end of the equipment. According to the automatic rubberizing equipment provided by the invention, the efficiency and quality of rubberizing operation are improved, and the labor intensity of workers is reduced.

The invention is suitable for the technical field of automation, and provides a positioning, overturning and jacking device and a positioning and overturning method. The positioning, overturning and jacking device comprises an overturning assembly, a jacking assembly and a lifting assembly, wherein the overturning assembly is arranged on the rack; the turnover datum plate is provided with a first station and a first vacuum part, a first positioning block is arranged in the first station, and the turnover datum plate is connected with the turnover assembly and used for driving the turnover datum plate to turn over the first station; the jacking assembly is arranged on the rack; and the jacking datum plate is provided with a second station and a second vacuum piece, a second positioning block is arranged in the second station, the jacking datum plate is arranged on the jacking assembly, and the jacking assembly is used for driving the jacking datum plate to ascend, so that the first station is in butt joint with the second station. According to the material overturning device, material overturning is achieved through the jacking assembly and the overturning assembly, the positioning precision and the material discharging and taking efficiency are improved, and the labor intensity is greatly reduced.

The invention discloses a high-precision etching treatment device for a fine circuit, and relates to the technical field related to workpiece etching treatment, and the high-precision etching treatment device comprises an etching treatment machine body, a moving sliding table, a dust collection assembly, a negative pressure fixing assembly and a dust cleaning unit, and the right side of the top end of the etching treatment machine body is provided with a single-chip microcomputer; the moving sliding table is installed on the inner wall of the top of the etching treatment machine body, the laser is installed on the bottom side of the moving end of the moving sliding table, and the negative pressure fixing assembly is installed on the top side of the dust collecting shell. The problems that in the etching machining process of circuit board workpieces, the circuit board workpieces are mostly mechanically clamped or rigidly adsorbed, mechanical clamping easily causes workpiece edge damage and circuit deformation, rigid adsorption is difficult to adapt to workpieces with different surface profiles, the subsequent etching precision is affected, meanwhile, a large number of dust particles are generated in the laser etching process, and the production cost is reduced are solved. A traditional dust cleaning mode is low in efficiency and poor in effect, part of dust can be attached to the surface of a workpiece, the etching path of a laser is interfered, and the etching precision is affected.

The invention discloses pressing equipment for printed circuit board production, and relates to the technical field of circuit board pressing tin plating equipment. Comprising an equipment body, and a scraper mechanism, a screen plate mechanism and a conveying mechanism are arranged in the equipment body; the screen plate mechanism comprises a fixing frame, a lifting control cylinder is mounted on the fixing frame, a mounting frame is mounted at the output end of the lifting control cylinder, a screen plate is detachably mounted in the mounting frame, and mesh holes are formed in the screen plate. The circuit board can be conveyed to the position below the screen plate mechanism based on the conveying mechanism, solder paste is applied to the screen plate, the screen plate is moved downwards based on the lifting control cylinder, the circuit board is attached to the bottom of the screen plate, one scraper is lowered to the working height based on work of the scraper mechanism, and the solder paste is scraped on the top face of the screen plate through the other scraper. And the solder paste passes through the mesh holes, the heights of the two scrapers are switched, the other scraper is used for scraping the solder paste on the top surface of the mesh plate, and the process is repeated, so that the solder paste is attached to the circuit board through the mesh holes.

The invention relates to an AI server mainboard interlayer alignment and laser processing method, which comprises the following steps: a product design step: designing a multi-layer mainboard, arranging a blind hole structure in an outer layer area of a laser layer, arranging an inner target on a board edge to avoid dry film coverage, and adopting oversized material distribution; the machining process includes the steps that pressing target drilling, first-time laser drilling, outer-layer windowing, second-time laser drilling and post-procedure processes are sequentially executed, the first-time laser drilling forms an inner target and an alignment mark, and the outer-layer windowing and the second-time laser drilling are aligned based on the same alignment system. According to the interlayer alignment and laser processing method for the AI server mainboard, through staged laser processing and unified alignment system design, the problem of interlayer offset is solved, and the processing precision and the yield are improved.

The application discloses a kind of for semi-finished circuit board dividing board dividing board device and method, the present application relates to the technical field of semi-finished circuit board dividing board, the table top of workbench is provided with two for positioning and fixedly attaching semi-finished circuit board positioning and fixed assembly, positioning and fixed assembly in left side includes fixedly attached on the upright of workbench table top, it is hinged to the top end portion of upright first pin shaft rotating plate, rotating plate bottom surface left end portion is hinged to one connecting rod on second pin shaft, connecting rod is located in the left side of upright, and the top surface of rotating plate is fixedly attached with one strip positioning table and one vacuum chuck B;The spacer plate is provided with for pulling down two positioning and fixed assembly connecting rod pulling-down assembly.The beneficial effects of the present application are: greatly improve the efficiency of semi-finished circuit board dividing board, and no powdery waste in dividing board process.

The present application relates to the technical field of circuit board processing equipment, and particularly relates to a circuit board glue residue removing device and method. The device comprises a support frame, a rotating frame rotatably connected to the support frame, a mounting frame symmetrically connected to the bottom of the rotating frame, a rotating frame rotatably connected to the mounting frame, a driving motor symmetrically mounted on the side surface of the rotating frame, a brush cylinder symmetrically rotatably connected to the rotating frame, and a rotating shaft of the brush cylinder being connected to an output shaft of the driving motor, a first motor mounted on the side surface of the mounting frame, a first worm connected to the output shaft of the first motor, and a first worm wheel connected to the rotating shaft of the rotating frame and engaged with the first worm. Through cooperation of the cleaning frame, the first screw rod motor and the moving plate, the device can automatically scrape off the glue residue adhered to the brush cylinder and collect the glue residue into a collection box, effectively avoiding the problem of efficiency reduction caused by glue residue accumulation of a traditional brush, and significantly improving the glue residue removing effect and the continuous working capacity of the device.

The invention relates to the technical field of circuit board processing equipment, in particular to circuit board glue residue removing equipment and method. Comprising a support frame; the rotating frame is rotationally connected to the supporting frame; the mounting frames are symmetrically connected to the bottom of the rotating frame; the rotating frame is rotationally connected to the mounting rack; the driving motors are symmetrically mounted on the side surfaces of the rotating frame; the brush barrels are symmetrically and rotationally connected to the rotating frame, and rotating shafts of the brush barrels are connected with an output shaft of the driving motor; the first motor is mounted on the side surface of the mounting frame; the first worm is connected to an output shaft of the first motor; the first worm gear is connected to the rotating shaft of the rotating frame, and the first worm gear is meshed with the first worm. Through cooperation of the cleaning frame, the first lead screw motor and the moving plate, glue residues adhering to the brush cylinder can be automatically scraped and collected into the collecting box, the problem that the efficiency of a traditional brush is reduced due to glue residue accumulation can be effectively solved, and the glue residue cleaning effect and the continuous working capacity of equipment are remarkably improved.

The invention relates to a gold finger wire blind drilling process of a printed circuit board. The process comprises the following steps of gold finger and wire pattern design, jig positioning design, offset inspection design, printed circuit board manufacturing, wet film filling, jig positioning hole manufacturing, plate positioning and fixing, blind drilling, film removing and cleaning. The printed circuit board obtained through the process has the burr-free effect, blind drilling deviation of a broken hole can be prevented by adopting the process, and the risk that in the prior art, due to the fact that golden finger color difference exists, front-end nickel and gold layers are suspended and prone to falling off, the golden fingers are short-circuited abnormally after being inserted and pulled is effectively avoided.

The present invention relates to a substrate carrying jig cleaning device in which a plurality of upper and lower clamps each provided with a clamping magnet on the upper and lower clamps for clamping and holding a circuit board at the edge portion of the circuit board are improved in structure so that the substrate carrying jig can be easily cleaned for reuse after the clamping and holding operation is completed, the clamping portion on which a medicine or the like is formed with unevenness or the clamping portion on which a residue such as a substrate chip or the like can be left can be easily opened, and a fluid such as water or gas can be sprayed to the opened clamping portion side and foreign matter or the medicine left on the clamping portion side can be easily removed by vacuum suction, thereby achieving the cleaning purpose.

The invention discloses a board splitting device and method for splitting a semi-finished circuit board, and relates to the technical field of board splitting of the semi-finished circuit board. Two positioning and fixing assemblies for positioning, adsorbing and fixing the semi-finished circuit board are arranged on the table top of a workbench; the positioning and fixing assembly located on the left side comprises a stand column fixedly arranged on the table top of the workbench and a rotating plate hinged to the top end of the stand column through a first pin shaft, and a connecting rod is hinged to the left end of the bottom surface of the rotating plate through a second pin shaft and located on the left side of the stand column. A strip-shaped positioning table and a vacuum chuck B are fixedly arranged on the top surface of the rotating plate; the base plate is provided with a pull-down assembly used for pulling down the connecting rods of the two positioning and fixing assemblies. The semi-finished circuit board splitting machine has the beneficial effects that the semi-finished circuit board splitting efficiency is greatly improved, and powdery scraps cannot be generated in the board splitting process.

The invention provides a circuit board wet process vertical rotating and swinging device and a processing method.The device comprises a working box, a jig used for containing products and a rotating and swinging system, the rotating and swinging system is arranged on the working box, the front side of the working box is open, and the side wall or the top of the working box is provided with an inlet and outlet; the jig vertically enters the working box through the inlet and outlet and is vertically placed on the rotating and swinging system, and the rotating and swinging system drives the jig to rotate around the center point of the jig or in the X-axis direction or the Z-axis direction and meanwhile swings in a reciprocating mode along with the normal direction of the rotating plane. Driving mechanisms of the rotary swing system are correspondingly arranged at the edge or the center of the jig, the left end and the right end in the X-axis direction and the upper end and the lower end in the Z-axis direction respectively. According to the method, the updating speed of interface liquid medicine is greatly increased through rotation and swing, the overall machining efficiency is improved, and the defects of the pool effect of traditional horizontal machining, holes in holes of static machining and the like are overcome.

The invention relates to the technical field of flexible circuit boards, in particular to a flexible clamp and image detection combined flexible circuit board processing system and process, and the system comprises a main control unit, a flexible clamp and an identification unit. The process comprises the following steps: A, clamping a flexible circuit board by using a flexible clamp, and transmitting data of each sensor to a main control unit; b, the main control unit calculates the deformation condition of the flexible circuit board according to the data of each sensor, and adjusts the pressure of the flexible clamp for clamping the flexible circuit board according to the deformation condition; c, acquiring a three-dimensional image of the flexible circuit board through the identification unit and transmitting the three-dimensional image to the main control unit; d, the main control unit analyzes the three-dimensional image and calculates deformation data of the flexible circuit board; and E, in combination with the deformation data and a pre-input machining position, calculating to obtain an actual machining position. The clamping force can be adjusted according to the stress distribution of the flexible circuit board, and the machining position is compensated and adjusted after three-dimensional image analysis.

This application relates to the field of circuit board manufacturing technology, and in particular to a rotary device and method for marking the front and back sides of flexible circuit boards. The device includes: a support frame, connecting rods, rotary servo motors, fixed clamping bars, a first tension cylinder, movable clamping bars, and a control base unit. The support frame includes a first support rod and a second support rod; one end of each connecting rod is connected to the center point of the first support rod; the rotary servo motors are connected to the other ends of each connecting rod; the fixed clamping bars are fixedly connected to the second support rod; one end of the first tension cylinder is fixedly connected to the second support rod; the movable clamping bars are fixedly connected to the other ends of the first tension cylinder; the control base unit includes a first control base and a second control base, which are respectively connected to two rotary servo motors. This application can improve marking accuracy and product quality, reduce manual operation, and increase work efficiency.

The invention relates to the technical field of circuit board production, in particular to a flexible circuit board front and back side marking rotating device and method.The device comprises a supporting frame, a connecting rod, a rotating servo motor, a fixed clamping strip, a first stretching air cylinder, a movable clamping strip and a control base unit, and the supporting frame comprises a first supporting rod and a second supporting rod; one end of each connecting rod is connected with the center point of the corresponding first supporting rod; the rotary servo motors are respectively connected with the other ends of the connecting rods; the fixed clamping strips are fixedly connected with the second supporting rods respectively; one end of the first stretching air cylinder is fixedly connected with the second supporting rod; the movable clamping strips are fixedly connected with the other ends of the first stretching air cylinders correspondingly. The control base unit comprises a first control base and a second control base, and the first control base and the second control base are connected with the two rotary servo motors correspondingly. The marking precision and the product quality can be improved, manual operation is reduced, and the working efficiency is improved.

The invention belongs to the technical field of PCB production, and particularly relates to a circuit board positioning method. The circuit board positioning method is applied to the circuit board processing equipment, the circuit board processing equipment comprises a first platform, a positioning piece is arranged on the first platform, and the circuit board positioning method comprises the steps that a first rectangular coordinate system is established on a to-be-processed board, and processing position information of a target hole is acquired; calculating the relative position of the reference point on the to-be-processed plate and the original point of the first rectangular coordinate; processing the to-be-processed plate based on the processing position information to obtain a target hole; and based on the relative position of the reference point on the to-be-machined plate and the original point of the first rectangular coordinate, the relative position of the positioning piece on the first platform and the target hole is determined, the positioning piece is inserted into the target hole, and the to-be-machined plate is positioned. Positioning can be completed through cooperation of the positioning piece and the target hole, no extra pin needs to be prepared and installed in advance, no masking tape needs to be pasted, the process preparation time can be shortened, and the production efficiency is improved.

The application discloses a flash etching device for fine circuit processing of a PCB (Printed Circuit Board), and relates to the technical field of PCB processing.The device comprises a workbench, a mounting frame and a fixing frame are fixedly connected to the top of the workbench, the mounting frame is arranged on the outer side of the fixing frame, equidistantly rotating connections are arranged on the fixing frame, and a conveying roller is further arranged.The device further comprises a center adjusting mechanism and a dynamic spraying mechanism.The center adjusting mechanism is arranged to realize the axial reciprocating movement of the moving ring frame by means of the fixed sleeve, the moving ring frame and the push plate during the movement of the PCB from the left side of the fixing frame to the inside of the mounting frame, thereby driving the push plate to dynamically adjust the conveying center of the PCB placed on the conveying roller, so as to real-time correct the conveying center of the PCB, ensure that the conveying center is always in the middle, improve the uniformity and consistency of subsequent spraying, reduce the problem of uneven subsequent spraying caused by the deviation of the conveying center, thereby improving the spraying efficiency and product quality, and reducing the rate of defective products.

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to an integrated circuit board installation jig which comprises a jig platform assembly, the jig platform assembly is of a rectangular hollow structure, first air cylinders are installed on the two sides of the outer wall of the jig platform assembly in an embedded mode, and the output ends of the first air cylinders are in transmission connection with positioning plates. A positioning groove is formed in the outer wall of the positioning plate, the integrated circuit board body and the steel mesh are lifted through the material lifting slopes, finally, after the two ends of the integrated circuit board body and the two ends of the steel mesh are movably clamped to the inner walls of the limiting grooves, the integrated circuit board body, the steel mesh and the positioning groove are arranged on the same horizontal plane, and then the output end of a first air cylinder is used for pushing the positioning plate; the other two ends of the integrated circuit board body and the other two ends of the steel mesh are movably clamped through the positioning grooves so that the integrated circuit board body and the steel mesh in the stacked state can be aligned in the solder paste printing stage, and printing deviation is prevented.