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Fabrication method of rigid-flex board for preventing gold finger of flexible board from deviation

A soft-rigid combination board and manufacturing method technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, PCB positioning during processing, etc., can solve problems such as misalignment, and achieve the effect of preventing misalignment

Active Publication Date: 2016-03-16
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is that in the prior art, the shape of the soft board and gold finger is usually positioned by the cursor point on the hard board, which is likely to cause deviation in the actual cutting process and affect the subsequent use, so a new method is proposed. A kind of manufacturing method of soft-rigid combination board that prevents soft board gold finger from being misaligned

Method used

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Embodiment Construction

[0022] In order to make the content of the present invention more clearly understood, the present invention will be further described in detail below according to specific embodiments of the present invention.

[0023] The invention provides a method for making a soft-rigid combination board for preventing the gold finger of the soft board from being misaligned, which includes the following steps:

[0024] S1. Cutting the material, cutting the inner soft board, outer hard board and prepreg according to the required size;

[0025] S2. Inner layer graphics production, etch the circuit pattern on the inner layer board: After the inner layer circuit exposure is completed with a 6-grid or 21-grid exposure ruler, develop and etch according to the conventional operation; at the same time, the gold finger area on the inner layer soft board Make positioning graphics on the waste area on the top side of the gold finger, and the positioning graphics are composed of three positioning poin...

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PUM

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Abstract

The invention discloses a fabrication method of a rigid-flex board for preventing a gold finger of a flexible board from deviation. The fabrication method comprises the following steps of S1, carrying out cutting; S2, fabricating an inner-layer pattern, and fabricating a positioning pattern on a waste region at the side edge of a top end of a gold finger region on a flexible board at an inner layer, wherein the positioning pattern comprises three positioning points; S3, coating and laminating a protection membrane on a region, needed to be protected, of the flexible board at the inner layer; S4, carrying out laser cutting, respectively cutting positioning grooves at the two ends of the gold finger by the positioning pattern, and making the two ends of the gold finger to be directly formed; and S5, laminating the inner layer and an outer layer. According to the method disclosed by the invention, the inner-layer pattern is fabricated and the positioning pattern is simultaneously fabricated on the waste region at the side edge of the top end of the gold finger region, the two positioning grooves are cut at each of the two sides of the gold finger by positioning of the positioning pattern during the laser cutting process, the gold finger is then directly formed, so that the gold finger of the flexible board at the inner layer is already subjected to shape fabrication before lamination, the size precision of the gold finger is ensured, and the deviation of the gold finger is prevented.

Description

technical field [0001] The invention belongs to the field of printed circuit board production, and in particular relates to a production method of a soft-hard combination board for preventing the gold fingers of the soft board from shifting. Background technique [0002] Rigid-flex board is a new type of printed circuit board that has both the durability of rigid printed circuit boards and the adaptability of flexible printed circuit boards. Among all types of printed circuit boards, rigid-flex boards are the most suitable for harsh applications. The environment is the most resistant, so it is favored by the field of medical and military equipment production technology. The rigid-flex board is a product that combines rigid boards and flexible boards with circuit patterns in a certain combination to meet a certain performance requirement. The middle generally relies on prepreg to complete the connection; it has the characteristics of light, thin, short, small characteristics...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4691H05K2203/0228H05K2203/15
Inventor 周长春何淼宇超覃红秀
Owner SHENZHEN SUNTAK MULTILAYER PCB
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