Manufacturing method of ultrathin printed circuit board, and ultrathin printed circuit board

A technology of printed circuit board and manufacturing method, applied in the directions of printed circuit manufacturing, printed circuit, printed circuit components, etc., to prevent deformation and avoid scrapping
CN104394665AActive Publication Date: 2015-03-04SHANGHAI MEADVILLE ELECTRONICS +1
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
SHANGHAI MEADVILLE ELECTRONICS
Publication Date
2015-03-04

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Abstract

The invention discloses a manufacturing method of an ultrathin printed circuit board, and an ultrathin printed circuit board. According to the manufacturing method, copper foils and bonding plates are laminated at a support plate in hot-pressing mode and the thin copper foils and the thin bonding plates are supported by the support plate. Therefore, plate thickness limitation by equipment in production of electroplating and graph transferring and the like can be effectively eliminated; deformation like warping, bending, and small wrinkle existence and the like of carriers including a first copper foil, a second copper foil and a conductive layer and the like during the lamination and hot pressing process can be effectively improved; and problems of scrapping of the printed circuit board and low yield of the board due to insufficient hardness and poor smoothness of the laminated object can be solved.
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Description

technical field

[0001] The invention relates to the field of circuit board manufacture, in particular to a method for manufacturing an ultra-thin printed circuit board and the ultra-thin printed circuit board. Background technique

[0002] Printed Circuit Board (PCB), also known as printed circuit board, is one of the important components of electronic products. Due to the repeatability (reproducibility) and consistency of the pattern of the printed circuit board, the errors of wiring and assembly are reduced, and the maintenance, debugging and inspection time of the equipment are saved. The design can be standardized, which is conducive to interchange; the printed circuit board has high wiring density, small size, and light weight, which is conducive to the miniaturization of electronic equipment; it is conducive to mechanized and automated production, which improves labor productivity and reduces the cost of electronic equipment.

[0003] In recent years, circuit boards h...

Claims

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