405results about How to "Avoid yield" patented technology

An apparatus is described for assessing plant status using biophysical and biochemical properties of the plant remotely sensed by the invention thereby allowing selective monitoring, elimination or treatment of individual plants. In a preferred embodiment, a single polychromatic emitter provides coincident light beams; one beam substantially in the visible portion of the spectrum (400 nm to 700 nm) and the other in the near infrared (NIR) portion of the spectrum (700 nm to 1100 nm). This light beam illuminates a small surface area on the ground, which may be bare ground, desired plants or undesired weeds. The beam of light may be focused, collimated or non-focused. A detector array, usually composed of a visible detector and a NIR detector, detects portions of this polychromatic light beam reflected by the surface area and provides a signal indicative of whether the detected light was reflected by a plant or by some non-plant object such as soil. A controller analyzes this signal and, assuming a plant is detected, responds by activating a device to take some action with respect to the plant or stores the analyzed signal with corresponding DGPS position in the controller's memory for later analysis. A number of actions may be taken by the controller. For instance, if the plant is a weed, the desired action might be to spray herbicide on the weed. Or, if the plant is a crop that is determined to be lacking in nutrient, the desired action may be to apply fertilizer. Additionally, if the plant under test is a turf landscape, such as found on golf courses and sporting fields, plant biomass may be mapped and geo-located using GPS for later, comparative analysis.

A stacked semiconductor device includes a plurality of semiconductor chips and a conductive path extending through at least one of the semiconductor chips. The semiconductor chips are stacked together. The semiconductor chips are electrically connected by the conductive path, and the conductive path has a plurality of through-connections extending through the corresponding semiconductor chip.

An optical interconnection assembled circuit capable of reducing the number of parts and components, as well as the number of manufacturing processes and capable of mounting those parts and components at a high density in an optical module, thereby realizing a low price. The optical interconnection assembled circuit includes a substrate including plural optical waveguides having partial tapered surfaces respectively, as well as an optical element array facing each of the tapered surfaces. In the optical interconnection assembled circuit, the tapered surfaces and the optical element array are fastened so that they face each other and the optical elements of the optical element array are staggered in disposition.

A capacitor structure is described, including a first capacitor and a second capacitor. The first capacitor includes a first electrode, a second electrode and a first insulating layer, wherein the second electrode is disposed under the first electrode and the first insulating layer between the first electrode and the second electrode. The second capacitor is disposed under the first capacitor and coupled thereto in parallel. The second capacitor includes multiple patterned metal layers and via plugs that constitute a third electrode and a fourth electrode, and a second insulating layer. The patterned metal layers are stacked in the second insulating layer and connected by the via plugs, wherein each patterned metal layer includes a portion of the third electrode and a portion of the fourth electrode that are separated by the second insulating layer.

A light source module (1) is constituted by forming lines (13a, 13b) on a mounting substrate (11) and a connection substrate (12) integrally formed of a flexible material, and mounting a first connector (15), a second connector (16), and a plurality of LEDs (18) on the substrates. The connection substrate of one of adjoining light source modules is connected with the first connector (15) of the other light source module, thereby connecting a plurality of light source modules (1) linearly. In the light source module (1) at the end, terminals (14a, 14b) of the connection substrate (12) are connected with the second connector (16) while being reversed, thereby interconnecting two lines (13a, 14b). A plurality of light source modules (1) can thereby be connected without using a separate component such as a wire harness.

A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.

The invention discloses a high-voltage inverted LED chip and a manufacturing method thereof. The manufacturing method of the LED chip includes: etching an epitaxial layer to form an electrode hole array; cutting the epitaxial layer to a substrate by means of the laser cutting technique to form isolation grooves to isolate luminous units; forming a metal reflector layer on a P-type gallium nitride layer; forming an insulating layer in the metal reflector layer and the electrode hole array and forming an opening in the insulating layer to expose part of the metal reflector layer and N-type gallium nitride in the electrode hole array; forming a contact electrode in the opening; welding the substrate and a base plate on which a circuit is formed in an inverted manner through the contact electrode to form an inverted device; and cutting the inverted device to form the high-voltage inverted LED chip consisting of multiple luminous units. The high-voltage inverted LED chip and the manufacturing method thereof have the advantages of simple process and high device reliability.

The invention discloses a compound water soluble fertilizer used for citrus crops, a preparation method and an application method. The compound water soluble fertilizer used for citrus crops is mainly used in plant nutrition field, and comprises the following components: an amino acid raw material, macroelements P and K, secondary elements Mg and Ca, trace elements Fe, Mn, Zn, B, Mo and Cu, a beneficial element Si, an auxiliary agent, a PH conditioning agent and an aqueous solution. The preparation method is characterized in that composite amino acid chelates Mn, Fe, Cu, Mg, Ca and Zn at normal temperature of 15-35 DEG C and prepares the water soluble fertilizer with six metallic elements, the reasonable fertilizing can be carried out at different growth period of the crops, the balance supplement of a plurality of nutrient elements required by citrus crops can be realized, and the output and quality of the citrus crops can be increased.

Downhole wireline cleaning tool (1) adapted to scrape and remove objects, such as scale decreasing an inner diameter of a casing in a wellbore, comprising a tool housing (4) having a first housing part (5) and a second housing part (6), a projectable arm (7) which is pivotably connected with the first housing part at a first end of the projectable arm, the projectable arm having a plurality of bits (9) in a second end, said projectable arm (7) being movable between a retracted position and a projected position in relation to the tool housing (4), an arm activation assembly (11) for moving the projectable arm between the retracted position and the projected position, and a rotatable shaft (12) for rotating the projectable arm (7), wherein the bits are arranged along an extension of the projectable arm, wherein the extension of the arm extends across the centre tool axis in at least the retracted position, so that the bits of the arm are arranged to scrape the entire internal cross-sectional area of the casing.

A modular energy absorber 10 that is tunable. It comprises one or more energy absorbing modules 12. The energy absorbing modules 12 have means for coordinating 14 energy absorbing units 16 of the one or more modules. The means 14 for coordinating position and support the units 16 in relation to each other before and during relative motion between an incident object and the energy absorber. The units 16 are provided with an upper perimeter 22, a lower perimeter 24 and an intermediate wall 26 with stiffening male 36 or female 38 ribs. A method for configuring and for making the modular energy absorber are also disclosed.

The invention provides a mechanical face seal for rotary rock bits with a novel coil spring energization system that prevents yielding of the coil springs in extreme torque conditions. Within at least one of the coil springs is a cylindrical pin designed to co-act with the spring such that the combination becomes very stiff in the radial direction as the spring extends beyond a certain amount. This prevents the high torque from yielding the springs. When the spring returns to its normal extension, the pin does not interfere with the axial compression of the spring. This combination allows the coil spring energizers of a rotary rock bit mechanical face seal to survive the occasional extreme torque event.

A method and device to warn parents or other caregivers that a child has been inadvertently left in a child safety seat in a vehicle. The system generally includes at least one child sensor coupled to a processor, at least one trigger coupled to the processor, and an alarm coupled to the processor. The child sensor is generally any sensor that can sense the presence of a child in a safety seat. The trigger is generally any sensor that can determine if a danger would exist to a child in a vehicle.

A method for the production of a magnetic recording medium (30) includes the steps of depositing a magnetic layer or Co-containing magnetic layer (3) on at least one side of a nonmagnetic substrate (1) and partially implanting atoms into the magnetic layer or Co-containing magnetic layer to partially unmagnetize the magnetic layer or Co-containing magnetic layer, thereby forming nonmagnetic parts (4) and a magnetic recording pattern magnetically separated by the nonmagnetic parts and, in the case of the Co-containing magnetic layer, lowering Co (002) or Co (110) peak strength of a relevant part of the Co-containing magnetic layer as determined by the X-ray diffraction to ½ or less. A magnetic recording and reproducing device includes the magnetic recording medium (30), a driving part (26) for driving the magnetic recording medium in a direction of recording, a magnetic head (27) consisting of a recording part and a regenerating part, means (28) for moving the magnetic head relative to the magnetic recording medium, and recording and reproducing signal processing means (29) adapted to enter a signal into the magnetic head and regenerate an output signal from the magnetic head.

A method and an apparatus for punching a piercing tool through a wall shell structure and for feeding fire-retardant medium to the object on fire. At the outermost end of the rescue boom (3), according to the invention, there is a piercing device (6) which comprises an elongated piercing tool (7) provided with at least one longitudinal channel for supplying the fire-retardant medium to the nozzles of the tool (7) and further to the object on fire. The piercing device (6) comprises an actuator for advancing the piercing tool (7) through the shell structure (8) by a longitudinal movement.

A method of machining a wafer in which, at the time of grinding the back-side surface of the wafer, only a back-side surface region corresponding to a device formation region where semiconductor chips are formed is thinned by grinding, to form a recessed part on the back side of the wafer. An annular projected part surrounding the recessed part is utilized to secure rigidity of the wafer. Next, the recessed part is etched to cause metallic electrodes to project from the bottom surface of the recessed part, thereby forming a back-side electrode parts, then an insulating film is formed in the recessed part, and the insulating film and end surfaces of the back-side electrode parts are cut.

The present invention provides a display panel, a display device, and a display panel manufacturing method. The display panel includes a display area and a non-display area; the display area surroundsthe non-display area; the non-display area includes a module setting area; the light transmittance of the display panel in the module setting area is greater than a preset value; the display panel includes an array substrate; the array substrate includes: a first substrate; a buffer layer located at one side of the first substrate; a plurality of thin film transistors located on a side of the buffer layer away from the first substrate; a film layer where the plurality of thin film transistors are located only exists in a region of the non-display area except the module setting area and the display area; and the buffer layer is present in the display area and the non-display area, and covers the module setting area. The invention aims to improve the light transmittance of the display panelin the module setting area, reduce the process and improve the production efficiency.

A male plug of a single-pole electrical connector assembly includes a non-conductive housing and a conductive contact having first and second ends disposed in the housing. The first end is adapted to receive an electrical cable and the second end is adapted to engage a corresponding female contact. An axially extending slot is formed in the contact and extends toward the first end of the contact from the second end. The slot forms first and second slotted portions of the contact. A spring disposed proximal the second end of the contact substantially prevents yielding of the first and second slotted portions of the contact and biases the first and second slotted portions radially outwardly.

A method of removing a photoresist layer is provided. An ion implantation process has been performed on the photoresist layer to transform a surface of the photoresist layer to a crust and a soft photoresist layer remains within the crust. The method includes performing a first removing step to remove the crust, such that the soft photoresist layer is exposed. Thereafter, a second removing step is performed to remove the soft photoresist layer. The first and the second removing steps are performed in difference chambers, and a temperature for performing the first removing step is lower than that for performing the second removing step and lower than a gasification temperature of a solvent in the soft photoresist layer.

The invention discloses a novel method for producing high molecular weight sodium hyaluronate (HA-Na) with amino acid complex liquid as a nitrogen source through fermentation. In the method for producing the high molecular weight sodium hyaluronate, provided by the invention, yeast cream or yeast powder is replaced with the amino acid complex liquid as a fermentation nitrogen source of streptococcus zooepidemicus. The HA-Na with molecular weight of 2.2*10<6>D is obtained through control of a fermentation process. When the method is applied to industrial production, on the one hand, contents of hetero-protein and pigment in fermentation liquid can be effectively reduced, the step of subsequent HA-Na extraction is decreased, and the physical damage of the molecular weight of HA-Na in the fermentation liquid in the extraction process is reduced; on the other hand, the HA-Na production cost can be lowered, and the novel method has higher industrial application value. The HA-Na produced by the method has the molecular weight of 2.0-2.2*10<6>D, the alduronic acid content of 42.4-43.5%, the intrinsic viscosity of 3,064-3,115 and the protein content of 0.1%.

The invention discloses a method to prepare soluble human selenium-containing catalytic single-chain antibodies, belonging to biotechnology field. The method includes the following steps: with glutathione derivatives as target antigen, filtrating the recombinant phage display human single-chain antibody library through immune affinity selection method to obtain single-chain antibodies B3 and D8; assembling the single-chain antibodies to secretory procaryon or eucaryon expression vector; translating colon bacillus or yeast cell; expressing and purifying the single-chain antibody proteins in procaryon or eucaryon; introducing GPX catalytic group SeCys at the substrate combining sites of the antibodies through chemical mutation method or directly expressing the soluble single-chain antibody proteins which contain GPX catalytic groups at the substrate combining sites with auxotrophic colon bacillus through genetic mutation techniques to endue the antibodies with GPX catalytic activity. The method of the invention is simple and the human selenium-containing catalytic single-chain antibodies prepared with the method are of high catalytic activity; the proteins expressed by the antibodies are soluble; therefore the method is good for large-scale production and is of broad application prospect in biological pharmacy.