6results about How to "Avoid Yield" patented technology

The utility model provides an edible mushroom strain inoculator convenient for counting, which relates to the technical field of edible mushroom production and comprises an inoculation component, a tightening mechanism, a clamping piece and a supporting piece, the inoculation assembly comprises a strain storage cavity with a cylindrical appearance; according to the utility model, the clamping piece is arranged, and the clamping piece comprises the clamping plate; the clamping plates can be tightened through a specific tightening mechanism, so that the cultivation bag material can be stably clamped between the two groups of clamping plates; the slip phenomenon caused by sliding of cultivation bag materials or other unstable factors in the inoculation process can be effectively avoided, then it is ensured that inoculation operation can be accurately carried out on the cultivation bag materials, and the accuracy and reliability of inoculation work are greatly improved; the problems that most of existing strain inoculators are of a handheld structure, slipping possibly occurs when cylindrical cultivation bag materials are inoculated, and therefore inoculation work cannot be stably carried out are solved; and in addition, a strain receiver cannot count inoculation, so that the fruiting quality and yield can be influenced.

This invention discloses a photoresist stripping device that avoids parasitic gate effects and murex patterns. The photoresist stripping device is sequentially configured with a drying zone, a stripping zone, a hot water washing zone, an ultracooled water washing zone, and an air drying zone according to the substrate transport direction. A hot air knife for blowing hot air onto the substrate surface is provided at the outlet of the stripping zone. A second spray pipe for spraying hot water onto the substrate surface is provided in the hot water washing zone. A cold air knife for blowing cold air onto the substrate surface is provided at the inlet of the ultracooled water washing zone. A third spray pipe for spraying ultracooled water onto the substrate surface is provided in the ultracooled water washing zone. The photoresist stripping device also includes a vortex tube, a heating device, and a cooling device. This invention avoids the product yield and quality risks caused by parasitic gate effects and murex patterns; it also ensures the versatility of the photoresist stripping equipment, which is beneficial for production line logistics optimization and capacity improvement.

This invention belongs to the field of aerospace technology, specifically disclosing a corrugated plate load-bearing cylinder structure. The cylinder is constructed using corrugated plates, a skin, and annular fasteners. Due to the inherent thickness of the corrugated plates, the resulting cylinder possesses high bending stiffness, thus enabling it to bear significant loads. Furthermore, by fixing the inner wall of the skin to multiple outer ring protrusions of the corrugated plates to form the outer cylinder mounting surface, the connection between each outer ring protrusion of the corrugated plate and the skin is a planar structure. This results in the corrugated plates and skin forming multiple vertically arranged strip-like surfaces after installation, preventing localized instability. Compared to conventional cylindrical structures using rod structures or aluminum alloy skin stringer structures, this invention improves the structural efficiency of the cylindrical structure.

This invention relates to a method, apparatus, computer device, and storage medium for inspecting circuit layouts, and pertains to the field of circuit layout design technology. This method, by comprehensively inspecting the circuit layout based on information from both functional items and physical points, achieves more accurate inspections and reduces wasted layout area. Furthermore, the increased accuracy improves the effective utilization rate of the circuit layout area, reduces unnecessary layout and wiring, saves on process and manpower optimization costs, and avoids some difficult-to-detect electrical and yield problems caused by inappropriate circuit settings.

The present invention relates to a mobile transport system (10) for transporting objects, particularly in technical facilities, the mobile transport system comprising: a vehicle frame (12); a pair of first support wheels (41) and a pair of second support wheels (42) rotatably supported; a first drive wheel (71) rotatable about a first drive axis (73) extending in the lateral direction (Y); a second drive wheel (72) rotatable about a second drive axis (74) extending in the lateral direction (Y); and a pitch frame (14) rotatable about a pitch axis (13) relative to the vehicle frame (12), wherein the first support wheels (41) are arranged on the vehicle frame (12) and the second support wheels (42) are arranged on the pitch frame (14). A drive unit (70) is arranged on the pitch frame (14). The drive unit has a drive frame (75), wherein a first drive wheel (71) is rotatably supported on a first rocker arm (81) that can swing relative to the drive frame (75) about a first rocker arm axis (91), and a second drive wheel (72) is rotatably supported on a second rocker arm (82) that can swing relative to the drive frame (75) about a second rocker arm axis (92). The drive frame (75) can swing relative to the pitch frame (14) about a steering axis (95).

A semiconductor device includes a first contact layer, a second contact layer, an active layer, a photonic crystal layer, a passivation layer, a first electrode, and a second electrode. The first contact layer has a first surface and a second surface opposite to each other. The second surface has a microstructure. The second contact layer is below the first surface. The active layer is between the first contact layer and the second contact layer. The photonic crystal layer is between the active layer and the second contact layer. The passivation layer is on the second contact layer. The first electrode is on the passivation layer and electrically connected to the first surface of the first contact layer. The second electrode is on the passivation layer and electrically connected to the second contact layer. The microstructure of the first contact layer can replace a conventional passive element and reduce the overall thickness of the semiconductor device.