Cloud-based PCB folding device
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN YUANSHUO AUTOMATION TECH
- Publication Date
- 2022-04-26
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Abstract
Description
technical field
[0001] The invention relates to the technical field of PCB forming, in particular to a cloud-based PCB folding device. Background technique
[0002] The display device includes a backplane and a PCB connected to the backplane. In order to glue and cure the connection between the backplane and the PCB, the PCB usually needs to be folded before the display device leaves the factory. In the related art, the work of turning over the PCB is usually done manually, which has the problem of inaccurate turning positions. Contents of the invention
[0003] The main purpose of the present invention is to provide a cloud-based PCB folding device, aiming at improving the accuracy of PCB folding.
[0004] In order to achieve the above object, the present invention proposes a cloud-based PCB folding device, the product to be folded includes a connected backplane and a PCB board, the PCB board is provided with a jack, and the cloud-based PCB folding device It includes a ...