Board arrangement device and board arrangement method

A technology of arranging and arranging boards, which is applied in the direction of multi-layer circuit manufacturing, circuit lamination, electrical components, etc., can solve problems such as position offset, and achieve the effect of improving the quality of PCB lamination.

Inactive Publication Date: 2015-01-21
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the existing board arranging device will cause the position deviation between the boards in the same board, and the stacking centers of the boards are not on the same straight line, which will affect the pressing quality, and provides a method that can make the same board The position of each layer in the tray is not offset, and the stacking center of each tray can be accurately positioned

Method used

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  • Board arrangement device and board arrangement method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A kind of arrangement device provided in this embodiment, refer to Figure 5-8 , including a chassis 40 , a rectangular pallet board 20 , a screw lifter 30 , an infrared sensor, eight fixing clips 50 and a positioning line generator 10 . Screw lifter 30 is set on chassis 40, and a row of pallets 20 are installed on screw lifter 30, the height of row pallet platform 20 can be adjusted by screw lifter 30. Two fixing clips 50 are respectively arranged on each side of the palletizing table 20. After each board is stacked on the palletizing table 20 as required, the laminated layers on the palletizing table are clamped and fixed with the fixing clips 50. , forming a plate. An infrared sensor is set beside the pallet table 20 and at the initial height of the table top of the pallet table 20 to sense the height of the pallet table 20, and the pallet device controls the operation of the screw elevator 30 according to the signal of the infrared sensor , each adjustment all mak...

Embodiment 2

[0049] This embodiment is basically the same as Embodiment 1, except that: in 3-2 of the step (3) of the board arrangement process, the prepregs are stacked symmetrically on both sides of the lower copper foil layer to form the first prepreg layer; and by The scale marks on the general positioning wire frame place the first prepreg layer in the middle of the general positioning wire frame, such as Figure 11 shown. Then with reference to the steps from 3-3 to 3-6 of Example 1 and steps (4), (5), respectively stack the inner layer, the second prepreg layer and the upper copper foil layer on the first prepreg layer successively, Thus, the formed inner layer board is provided with two symmetrically placed inner layer boards.

[0050] Use the board arrangement device of Example 1 and the board arrangement method of this embodiment to make a plurality of boards, then move the boards to the press furnace and press the same hot pressing process as in Example 1 to make a multi-layer ...

Embodiment 3

[0052] This embodiment is basically the same as Embodiment 1, except that: in 3-2 of the step (3) of the board arrangement process, three prepregs are equidistantly placed in parallel on the lower copper foil layer to form the first prepreg layer; and Place the first prepreg layer in the middle of the general positioning wire frame through the scale line on the general positioning wire frame, such as Figure 12 shown. Then with reference to the steps from 3-3 to 3-6 of Example 1 and steps (4), (5), respectively stack the inner layer, the second prepreg layer and the upper copper foil layer on the first prepreg layer successively, Thereby, the formed inner layer board is provided with three inner layer boards placed in parallel at equal distances.

[0053] Use the board arrangement device of Example 1 and the board arrangement method of this embodiment to make a plurality of boards, then move the boards to the press furnace and press the same hot pressing process as in Example...

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Abstract

The invention relates to the technical field of PCB production equipment and particularly relates to a board arrangement device and a board arrangement method. The board arrangement device comprises a chassis, a board arrangement table, an infrared sensor, a fixing clamp and a position line production piece. The board arrangement table is arranged on the chassis. The fixing clamp is arranged on the edge of the board arrangement table. The position line production piece is arranged above the board arrangement table. Rays emitted by the position line production piece form a positioning wireframe on the board arrangement table. A lifting mechanism which drives the board arrangement table to move up and down is arranged between the chassis and the board arrangement table. In the board arrangement, the height of the board arrangement table is lowered upon laminating a board layer. The lifting mechanism is arranged to enable a top board layer of the board arrangement table to be lowered to an initial height, so that a phenomenon that the position of each board layer is shifted in the same board disk is prevented, and the PCB lamination quality is improved. As a projector projects the positioning wireframe with the scale on the board arrangement table, the lamination center of each board disk can be accurately positioned, so that lamination centers of the board disks are located on the same line during the lamination of different board disks, and the PCB lamination quality is improved further.

Description

technical field [0001] The invention relates to the technical field of PCB production and preparation, in particular to a board arrangement device and a board arrangement method for the arrangement and superposition of inner circuit boards. Background technique [0002] The printed circuit board is the support of electronic components and provides electrical connections for electronic components. The production process of printed circuit boards is generally: cutting → inner layer pattern transfer → inner layer etching → lamination → drilling → sinking copper → whole board electroplating → outer layer pattern transfer → pattern electroplating → etching → solder mask → surface Processing→forming processing, etc. Lamination refers to bonding the layers of circuits together through adhesive sheets (prepreg, PP), so that the discrete multi-layer boards are pressed into an integrated multi-layer board with the required number of layers and thickness. The lamination process mainl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/00H05K3/46H05K3/4638H05K2203/06H05K2203/15
Inventor 李丰彭卫红刘克敢季辉
Owner SHENZHEN SUNTAK MULTILAYER PCB
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