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Non-toxic and environment-friendly electroless nickel immersion gold solution applied to field of printed circuit boards

A printed circuit board, non-toxic and environmentally friendly technology, applied in the direction of printed circuit, liquid chemical plating, printed circuit manufacturing, etc., can solve the problems of highly toxic property management, difficult waste liquid treatment, environmental impact, etc., to achieve stable coating , good adhesion, reduce health impact and the effect of

Inactive Publication Date: 2021-04-23
成功环保科技(南通)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, potassium gold cyanide is a highly toxic substance, and its highly toxic nature has brought great influence and hidden dangers to operators and factory management. It also makes waste liquid treatment more difficult and has a great impact and burden on the environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The non-toxic and environmentally friendly chemical immersion gold solution applied in the field of printed circuit boards per 1 liter includes the following components:

[0042] Cyanide-free gold salt, the content of Au is 1.0g / L

[0043] Complexing agent 100g / L

[0044] Stabilizer 5g / L

[0045] The buffer adjusts the pH to 7-8, and the balance is water.

Embodiment 2

[0047] The non-toxic and environmentally friendly chemical immersion gold solution applied in the field of printed circuit boards per 1 liter includes the following components:

[0048] Cyanide-free gold salt, 0.2g / L in terms of Au content

[0049] Complexing agent 20g / L

[0050] Stabilizer 1g / L

[0051] The buffer adjusts the pH to 7-8, and the balance is water.

Embodiment 3

[0053] The non-toxic and environmentally friendly chemical immersion gold solution applied in the field of printed circuit boards per 1 liter includes the following components:

[0054] Cyanide-free gold salt, the content of Au is 0.5g / L,

[0055] Complexing agent 50g / L,

[0056] Stabilizer 3.0g / L,

[0057] The buffer adjusts the pH to 7-8, and the balance is water.

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PUM

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Abstract

The invention discloses a non-toxic and environment-friendly electroless nickel immersion gold solution applied to the field of printed circuit boards. The non-toxic and environment-friendly electroless nickel immersion gold solution comprises, by mass concentration ratios, 0.2-1.0g / L of cyanide-free gold salt based on Au content, 20-100g / L of complexing agent, 1-5g / L of stabilizer, and the balance water. After the components are uniformly mixed according to the mass concentration ratios, a buffer agent is utilized to adjust a pH value to 7.0-8.0, and then an immersion gold solution is formed. The system of the electroless nickel immersion gold solution does not use high-toxicity substances such as gold potassium cyanide and is free of cyanide, thereby reducing the impact on the health of operators and potential safety hazards in the working environment, and greatly reducing the burden and impact on the environment. Meanwhile, plating of a gold plating layer is stable, good in adhesion and uniform in distribution.

Description

technical field [0001] The invention relates to the technical field of gold immersion solutions, in particular to a non-toxic and environment-friendly chemical gold immersion solution applied in the field of printed circuit boards. Background technique [0002] In the production process of printed circuit boards, it is necessary to carry out some related surface treatment on the surface of the outermost copper circuit to increase its corrosion resistance and fluxing property, and ensure good solderability and electrical properties. Among them, chemical nickel gold is widely used in the surface treatment process of circuit boards because of its excellent weldability and good protection function. Electroless nickel gold is to deposit a layer of 2-5μm thick nickel layer on the copper circuit, and then deposit a layer of 0.02-0.04μm gold layer on the surface of the nickel layer. [0003] The existing chemical immersion gold mostly uses potassium gold cyanide [KAu(CN)2] to prepa...

Claims

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Application Information

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IPC IPC(8): C23C18/42H05K3/18
CPCC23C18/42H05K3/181
Inventor 洪学平李云华
Owner 成功环保科技(南通)有限公司
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